Abstract:
An apparatus for, a method of, and a computer carrier medium carrying code to cause a processor to execute a method. The method includes running a plurality of instances of a wireless spanning tree protocol in a wireless mesh node, each instance substantially conforming to the IEEE 802.1 standard. Running an instance of wireless spanning tree protocol including the wireless mesh point wirelessly transmitting BPDU information to other wireless mesh points of the network or wirelessly receiving BPDU information from other wireless mesh points, the BPDU information encapsulated in one or more control/management frames, e.g., beacon or probe response frames of a wireless network standard, the BPDU information relating to a spanning tree topology for the instance.
Abstract:
A method is provided for configuring a video conference endpoint. The method comprises receiving session data that comprises endpoint connection data for remote endpoints associated with scheduled conferences, and receiving a signal from a user interface indicating a user has activated a control associated with a selected conference, identifying the endpoint connection data for the remote endpoint associated with the selected conference, and establishing a media session with the associated remote endpoint. A video conference endpoint system also is provided. The system comprises a controller coupled to a memory, and a user interface coupled to the controller. The user interface includes a command button associated with a conference. The controller periodically receives session data associated with the scheduled conferences, stores the session data in the memory, and establishes the selected conference in response to a user activating the command button.
Abstract:
A packet loss reduction system. In particular implementations, a method includes responsive to indications of roaming intent of a wireless client relative to currently associated wireless access point, determining if a traffic stream associated with the wireless client is to be proactively buffered by one or more potential wireless access points; conditionally transmitting a command to the one or more potential wireless access points to cause the potential, wireless access points to set up resources to proactively buffer packets of the traffic stream; duplicating received packets of the traffic stream destined for the wireless client; and transmitting the duplicate packets to the potential wireless access points for storage in a proactive stream buffer.
Abstract:
A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.
Abstract:
A reversible thermal thickening grease for microelectronic packages, in which the grease contains filler particles; at least one polymer; and a binder; in which the filler particles are dispersed within the binder, in which one or more segments of the at least one polymer may be attached to the filler particles prior to dispersion in the binder, and in which the polymer collapses at temperatures below a Theta temperature and swells at temperatures above a Theta temperature. During the operation of a microelectronic package, grease pump-out and air proliferation are minimized with use of the reversible thermal thickening grease, while grease fluidity is retained under repetitive thermal stresses.
Abstract:
A method and software to cause a processor to implement a method to set a packet age limit in an access point of a wireless network for communicating time-sensitive data with an associated wireless client station. One method includes the client station sending feedback to the access point so that the access point can set its packet age limit. Another method includes the access point setting its packet age limit according to feedback from the associated client station and/or according to information determined at the access point about the network.
Abstract:
In one embodiment, a first endpoint initiates a voice communication with an undetermined second endpoint. A second endpoint is selected that is within a predetermined proximity of a location and voice communication between the first s endpoint and the second endpoint is initiated. The second endpoint may be selected based on preset conditions, such as for example a buddy list definition.
Abstract:
An apparatus for, a method of, and a computer carrier medium carrying code to cause a processor to execute a method. The method includes running a plurality of instances of a wireless spanning tree protocol in a wireless mesh node, each instance substantially conforming to the IEEE 802.1 standard. Running an instance of wireless spanning tree protocol including the wireless mesh point wirelessly transmitting BPDU information to other wireless mesh points of the network or wirelessly receiving BPDU information from other wireless mesh points, the BPDU information encapsulated in one or more control/management frames, e.g., beacon or probe response frames of a wireless network standard, the BPDU information relating to a spanning tree topology for the instance.
Abstract:
A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.
Abstract:
A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.