公开(公告)号：US20220057259A1

公开(公告)日：2022-02-24

申请号：US17405254

申请日：2021-08-18

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： FENG-JUNG HSU

IPC: G01J1/42

Abstract: This application provides a structure of the optical sensor, in which a photosensitive element is arranged on a substrate, a colloid layer is arranged on the upper part of the substrate and covers the photosensitive element, and a thin film is further arranged. The device includes an adhesive layer and a light-transmitting layer, the adhesive layer is disposed above one of the colloid layers, the light-transmitting layer is disposed above one of the adhesive layers, and the structure can be used to provide the film member that can be changed according to requirements The optical design reduces the production cost of the optical sensor; this application further provides a shielding layer between the film member and the colloid layer to improve the photosensitive efficiency of the optical sensor.

公开(公告)号：US20220021387A1

公开(公告)日：2022-01-20

申请号：US17222271

申请日：2021-04-05

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： WANG-AN LIN ,  MING-CHE YANG ,  MIN-CHUN TUAN ,  CHUNG-JUNG WU

IPC: H03K17/955 ,  H03K17/96

Abstract: The present application provides a proximity detection method and circuit thereof. The circuit includes a detection circuit, a baseline generating circuit, and a proximity sensing circuit. The proximity sensing circuit generates a proximity signal according to a detection data generated by the detection circuit, a baseline data generated by the baseline generating circuit and a proximity threshold, and judges whether the proximity signal is valid according to the detection data, a reference data, and a valid threshold. The validity of the proximity signal may be judged according to the reference data and the valid threshold and thus avoiding false judgement caused by the influences of the ambient factors.

公开(公告)号：US20210325253A1

公开(公告)日：2021-10-21

申请号：US17109673

申请日：2020-12-02

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： FENG-JUNG HSU ,  TSUNG-HUA WU

IPC: G01J5/60 ,  G01J1/42

Abstract: An optical sensing method and an optical sensor module thereof. The optical sensing method includes obtaining an optical signal by sensing with a first optical sensor and a second optical sensor, respectively. The first optical sensor and the second optical sensor have different optical sensing wavelength ranges. Furthermore, a color temperature determination unit receives the optical signals of the first and second optical sensors and calculates a color temperature value by substituting an equation. In this way, the optical sensing method and its optical sensor module can obtain color temperature calculations with high accuracy and can effectively reduce the system computational complexity.

公开(公告)号：US11116059B2

公开(公告)日：2021-09-07

申请号：US16862577

申请日：2020-04-30

Applicant: SensorTek technology Corp.

Inventor： Meng-Yong Lin ,  Ming-Huang Liu

IPC: H05B47/10 ,  H05B47/115 ,  H05B47/17

Abstract: Disclosed is a proximity sensor operating method used in a proximity sensor comprising a light-emitting device. The method comprises: in a standby mode, when an output of the proximity sensor is a first sensing state, driving a driving current of the light-emitting device to comprise a first driving current; when the proximity sensor is triggered, a check mode is entered, the proximity sensor still outputs the first sensing state, and the driving current is switched to comprise a second driving current larger than the first driving current; and in the check mode, when the length of time/number of times of triggering the proximity sensor is larger than or equal to a threshold length/number, the output of the proximity sensor switches to the second sensing state, and returning to the standby mode in which the driving current comprises the first driving current.

公开(公告)号：US11056607B2

公开(公告)日：2021-07-06

申请号：US16512406

申请日：2019-07-16

Applicant: SensorTek technology Corp.

Inventor： Wen-Chieh Tsou ,  Yi-Hua Chang ,  Chih-Wei Chen

IPC: H01L31/112 ,  G01S17/08 ,  H01L31/0203 ,  H01L33/54

Abstract: A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.

公开(公告)号：US20210088335A1

公开(公告)日：2021-03-25

申请号：US17016870

申请日：2020-09-10

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： SHIH-WEI LEE ,  CHAO-SHIUN WANG

IPC: G01C19/5712

Abstract: The invention related to a microelectromechanical systems gyroscope, which comprises a plurality of sensing modules sensing angular velocities on tri-axes, a plurality of outer frames set at outside of the sensing modules, and a plurality of driving shafts set between the frames respectively. The driving shafts are connected with two adjacent frames by first and second flexible connecting elements, respectively, and the frames are connected with the sensing modules by a plurality of transporting units. Thus, tri-axes sensing is provided.

公开(公告)号：US09915679B2

公开(公告)日：2018-03-13

申请号：US15093765

申请日：2016-04-08

Applicant: SensorTek technology Corp.

Inventor： Hsin-Hung Huang ,  Wei-Yang Ou ,  Hung-Sen Chen

IPC: G01P15/12 ,  B81C99/00 ,  G01P21/00 ,  G01C19/5783 ,  G01C25/00 ,  G01P15/08 ,  G01P15/125

CPC classification number: G01P21/00 ,  B81C99/0045 ,  G01C19/5783 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0831

Abstract: A method of detecting whether a microelectromechanical system (MEMS) device is hermetic includes applying at least three voltage differences between a movable part and a sensor electrode of the MEMS device to measure at least three effective capacitances, calculating a capacitance-to-voltage curve and an offset voltage of the MEMS device according to the at least three effective capacitances; and determining whether the offset voltage is within a predetermined range to determine whether MEMS device is hermetic.

公开(公告)号：US09634682B1

公开(公告)日：2017-04-25

申请号：US15050479

申请日：2016-02-23

Applicant: SensorTek technology Corp.

Inventor： Tso-Sheng Tsai ,  Jer-Hau Hsu ,  Wen-Cheng Chen ,  Ming-Huang Liu

IPC: H03M1/12 ,  H03M1/10 ,  H03M1/38 ,  G01J1/44

CPC classification number: H03M1/46 ,  H03M1/14

Abstract: An analog-to-digital module includes a sampling unit, for generating an output voltage between a positive output end and a negative output end according to a positive input voltage of a positive input end and a negative input voltage of a negative input end; a comparing unit, for generating a digital output signal according to magnitude relationship between the output voltage and a reference voltage; a variable current source, for generating a variable current according to the digital output signal at the negative input end in a first period according to a control signal; a measured current source, for generating a measured current at the negative input end; and an adjusting unit, for adjusting the output voltage according to the digital output signal in a second period according to the control signal; wherein the first period does not overlap the second period.

公开(公告)号：US20250035807A1

公开(公告)日：2025-01-30

申请号：US18601103

申请日：2024-03-11

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Wang-An Lin ,  Chih-Yu Lin ,  Chih-Yu Joe Lin

IPC: G01V3/08

Abstract: The present application provides a proximity detection circuit and a proximity detection method with compensation. The proximity detection circuit comprises a detection circuit, a baseline processing circuit and a proximity sensing circuit. The detection circuit generates a detection data and a reference data. The proximity sensing circuit generates a proximity signal according to a proximity threshold, the detection data and a baseline data generated from the baseline processing circuit, and the proximity detection circuit and the proximity detection method compensate the baseline data or the proximity threshold according to the reference data. The condition of misjudgment may be avoided under the influence of environmental factors.

公开(公告)号：US20250015206A1

公开(公告)日：2025-01-09

申请号：US18739901

申请日：2024-06-11

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Wen-Chieh Tsou

IPC: H01L31/0216 ,  H01L25/16 ,  H01L31/0203 ,  H01L31/18

Abstract: The present invention discloses a light sensing device packaging structure and the packaging method thereof. The packaging structure comprises a substrate, a transparent molding substance, a first glass, and a sheltering element. A first optical element and a second optical element are disposed on the substrate. The transparent molding substance covers the first optical element and the second optical element. A bottom surface of the first glass is fixed on the transparent molding substance and aligned with the first optical element. The sheltering element covers the edge of the transparent molding substance not covered by the first glass. This design maintains the excellent optical sensing effect of the light sensing device while allowing for miniaturization of the overall structure.