METHOD OF IMPROVING READ CURRENT STABILITY IN ANALOG NON-VOLATILE MEMORY USING FINAL BAKE IN PREDETERMINED PROGRAM STATE

    公开(公告)号:US20210065817A1

    公开(公告)日:2021-03-04

    申请号:US16803401

    申请日:2020-02-27

    Abstract: A method of improving stability of a memory device having a controller configured to program each of a plurality of non-volatile memory cells within a range of programming states bounded by a minimum program state and a maximum program state. The method includes testing the memory cells to confirm the memory cells are operational, programming each of the memory cells to a mid-program state, and baking the memory device at a high temperature while the memory cells are programmed to the mid-program state. Each memory cell has a first threshold voltage when programmed in the minimum program state, a second threshold voltage when programmed in the maximum program state, and a third threshold voltage when programmed in the mid-program state. The third threshold voltage is substantially at a mid-point between the first and second threshold voltages, and corresponds to a substantially logarithmic mid-point of read currents.

    Method of making split gate non-volatile flash memory cell

    公开(公告)号:US10833178B2

    公开(公告)日:2020-11-10

    申请号:US16576370

    申请日:2019-09-19

    Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

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