Manufacturing method for probe contact
    31.
    发明授权
    Manufacturing method for probe contact 失效
    探针接触的制造方法

    公开(公告)号:US08312626B2

    公开(公告)日:2012-11-20

    申请号:US12516155

    申请日:2008-09-02

    IPC分类号: H01R43/04

    摘要: To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off.By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.

    摘要翻译: 当探头接触的基板端部断裂并切断时,使压裂位置以高精度方便地进行控制。 通过用推动部件压缩基板端部的前表面,沿着雕刻槽在基板上产生脆性断裂,并且将基板端部与基板切断。 上述断裂中的断裂位置被控制为沿着断裂位置,其延伸部将两个压裂控制结构的应力集中端部置于其上。 这里,压裂控制结构通过光刻的对准技术在基板的正面上位置精度高。 以这种方式,可以以高精度稳定地形成由从作为基板11a的端部的压裂位置突出的端部构成的弹性电枢。

    VEHICULAR OPERATING DEVICE
    32.
    发明申请
    VEHICULAR OPERATING DEVICE 有权
    车辆操作装置

    公开(公告)号:US20120249473A1

    公开(公告)日:2012-10-04

    申请号:US13431451

    申请日:2012-03-27

    申请人: Takeyuki Suzuki

    发明人: Takeyuki Suzuki

    IPC分类号: G06F3/044

    摘要: An operation detection unit of a vehicular operating device is configured to detect a pressing force in a pressing direction substantially perpendicular to a plane including an operation direction of a slide operation by the finger of an operator on an operating surface. A control device does not execute recognition of a gesture pattern based on the slide operation if the pressing force detected by the operation detection unit is smaller than a first threshold value A, and recognizes a gesture pattern based on the slide operation after the pressing force has reached the first threshold value A or more. The control device controls a vehicle equipment in accordance with the recognized gesture pattern.

    摘要翻译: 车辆操作装置的操作检测单元被构造成检测基本上垂直于包括操作者的手指在操作表面上的滑动操作的操作方向的平面的按压方向上的按压力。 如果由操作检测单元检测到的按压力小于第一阈值A,则控制装置不会基于滑动操作执行手势图案的识别,并且在按压力具有基于滑动操作的基础上识别手势图案 达到第一阈值A或更多。 控制装置根据所识别的手势模式来控制车辆设备。

    CONTACT PROBE AND SEMICONDUCTOR DEVICE SOCKET INCLUDING CONTACT PROBE
    33.
    发明申请
    CONTACT PROBE AND SEMICONDUCTOR DEVICE SOCKET INCLUDING CONTACT PROBE 有权
    接触探头和半导体器件插座,包括接触探头

    公开(公告)号:US20120249174A1

    公开(公告)日:2012-10-04

    申请号:US13231016

    申请日:2011-09-13

    IPC分类号: G01R1/067

    摘要: A contact probe having a plunger; a top contacting member which is provided at a tip end of the plunger and is brought into contact with an electrode of a semiconductor device; a bottom contacting member which is brought into contact with an electrode of a testing board; and an elastic member for urging the top contacting member and the bottom contacting member in opposite directions away from each other. The plunger is formed into a cylindrical shape and includes a through-hole which penetrates through the plunger in an axial direction thereof. The top contacting member includes a plurality of mountain-shaped sharp portions at a tip end thereof, and each of the sharp portions is asymmetrical with respect to a straight line that passes through a peak of the sharp portion and extends along an axial direction of the plunger, and is bent toward a center line of the plunger.

    摘要翻译: 具有柱塞的接触探针; 顶部接触构件,其设置在所述柱塞的前端并与半导体器件的电极接触; 与检测板的电极接触的底部接触部件; 以及用于相对于彼此相反的方向推压顶部接触构件和底部接触构件的弹性构件。 柱塞形成为圆筒形状,并且包括沿其轴向穿过柱塞的通孔。 顶部接触构件在其尖端处包括多个山形尖锐部分,并且每个尖锐部分相对于穿过尖锐部分的峰部的直线是不对称的,并且沿着 柱塞,并朝向柱塞的中心线弯曲。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
    34.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
    半导体发光器件及其制造方法

    公开(公告)号:US20120223356A1

    公开(公告)日:2012-09-06

    申请号:US13234774

    申请日:2011-09-16

    申请人: Takeyuki Suzuki

    发明人: Takeyuki Suzuki

    IPC分类号: H01L33/42

    摘要: According to an embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type different from the first conductivity type, a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The device includes a first layer, a first electrode, a second electrode and a third electrode. The first layer is provided on a surface of the second semiconductor layer opposite to the light emitting layer and including conductive oxide. The first electrode is in contact with a part of the first layer and includes a reducible element for reducing the conductive oxide. The second electrode includes a first portion covering the first electrode and a second portion being in contact with the first layer, and the third electrode is electrically connected to the first semiconductor layer.

    摘要翻译: 根据实施例,半导体发光器件包括第一导电类型的第一半导体层,不同于第一导电类型的第二导电类型的第二半导体层,设置在第一半导体层和第二半导体层之间的发光层 半导体层。 该装置包括第一层,第一电极,第二电极和第三电极。 第一层设置在与发光层相对的第二半导体层的表面上并且包括导电氧化物。 第一电极与第一层的一部分接触,并且包括用于还原导电氧化物的可还原元件。 第二电极包括覆盖第一电极的第一部分和与第一层接触的第二部分,第三电极电连接到第一半导体层。

    METHOD MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
    35.
    发明申请
    METHOD MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
    方法制造半导体发光器件

    公开(公告)号:US20120208308A1

    公开(公告)日:2012-08-16

    申请号:US13209142

    申请日:2011-08-12

    申请人: Takeyuki SUZUKI

    发明人: Takeyuki SUZUKI

    IPC分类号: H01L33/02

    摘要: According to one embodiment, a method is disclosed for manufacturing a semiconductor light emitting device having a stacked body of nitride semiconductor including a light emitting layer. The method can include selectively etching a substrate in an atmosphere containing chlorine and nitrogen, using a carbon-containing mask formed on a surface of the substrate translucent to light emission emitted from the light emitting layer. The method can include forming a nitride semiconductor layer on the etched surface of the substrate, the nitride semiconductor having a higher refractive index than the substrate. In addition, the method can include forming the stacked body including the nitride semiconductor layer on the substrate.

    摘要翻译: 根据一个实施例,公开了一种用于制造具有包括发光层的氮化物半导体层叠体的半导体发光器件的方法。 该方法可以包括使用在基板的表面上形成的含碳掩模对从发光层发射的发光进行半透明的,在含有氯和氮的气氛中选择性地蚀刻基板。 该方法可以包括在衬底的蚀刻表面上形成氮化物半导体层,氮化物半导体具有比衬底更高的折射率。 此外,该方法可以包括在基板上形成包括氮化物半导体层的层叠体。

    Semiconductor light emitting device
    36.
    发明授权
    Semiconductor light emitting device 有权
    半导体发光器件

    公开(公告)号:US08089081B2

    公开(公告)日:2012-01-03

    申请号:US12404807

    申请日:2009-03-16

    IPC分类号: H01L33/00

    CPC分类号: H01L33/22

    摘要: A semiconductor light emitting device including: a substrate; an electrode layer; and a semiconductor multilayer film disposed between the substrate and the electrode layer, the semiconductor multilayer film including: an n-type semiconductor layer; a p-type semiconductor layer; and an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer, wherein the semiconductor multilayer film has a light extraction surface from which a light emitted in the semiconductor multilayer film is extracted, the light extraction surface being formed with a relief structure having nano-scaled convex portions, wherein the relief structure is formed to have variation in equivalent circular diameters of the convex portions, and wherein 90% or more of the convex portions in the relief structure are configured to have circularity coefficient of (4π×(area)/(circumferential length)2) being equal to or larger than 0.7.

    摘要翻译: 一种半导体发光器件,包括:衬底; 电极层; 以及设置在所述基板和所述电极层之间的半导体多层膜,所述半导体多层膜包括:n型半导体层; p型半导体层; 以及设置在所述n型半导体层和所述p型半导体层之间的有源层,其中,所述半导体多层膜具有从所述半导体多层膜发射的光被提取的光提取面,所述光提取面形成有 具有纳米级凸部的浮雕结构,其中所述浮雕结构形成为具有所述凸部的等效圆直径的变化,并且其中所述浮雕结构中的所述凸部中的90%以上的构造具有圆形度系数( 4&pgr×(面积)/(圆周长度)2)等于或大于0.7。

    VEHICULAR INFORMATION NOTIFICATION SYSTEM
    37.
    发明申请
    VEHICULAR INFORMATION NOTIFICATION SYSTEM 审中-公开
    机动车信息通报系统

    公开(公告)号:US20110133916A1

    公开(公告)日:2011-06-09

    申请号:US13055548

    申请日:2009-07-31

    IPC分类号: B60Q1/00

    摘要: Disclosed is a system for notifying information projected on a windshield, on the basis of a virtual image containing the information. The system controls a virtual image creation unit (23) so that the virtual image is displaced in at least one of a direction corresponding the advancing direction of a vehicle, a direction corresponding to a vertical direction with respect to the advancing direction, and a vehicle width direction. Moreover, the system controls a notification sound creation unit (24) so as to create a notification sound corresponding to the displacement of the virtual image.

    摘要翻译: 公开了一种用于根据包含该信息的虚拟图像通知投影在挡风玻璃上的信息的系统。 系统控制虚拟图像创建单元(23),使得虚拟图像在与车辆的前进方向相对应的方向,相对于前进方向的垂直方向对应的方向中的至少一个中移动,以及车辆 宽度方向。 此外,系统控制通知声音创建单元(24),以产生与虚拟图像的位移相对应的通知声音。

    Method for assembling testing equipment for semiconductor substrate
    38.
    发明授权
    Method for assembling testing equipment for semiconductor substrate 失效
    组装半导体衬底检测设备的方法

    公开(公告)号:US07908747B2

    公开(公告)日:2011-03-22

    申请号:US11407267

    申请日:2006-04-20

    IPC分类号: H01R43/00 H01R43/16 H05K3/10

    摘要: Upon an assembly of a probe head unit, the relative positions of the probe pins 28ai to those of the electrode group 24E in the pitch-changing substrate 24 are determined by making the positions of the through-holes 26A, 26B, 26C and 26D in the contact block 26 to coincide with the positioning marks 24MA, 24MB, 24MC and 24MD in the pitch-changing substrate 24.

    摘要翻译: 在探针头单元的组装时,通过将通孔26A,26B,26C和26D的位置设置在俯仰改变基板24中,探针28ai与电极组24E的相对位置在 接触块26与间距改变基板24中的定位标记24MA,24MB,24MC和24MD重合。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PROCESS FOR PRODUCTION THEREOF
    39.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PROCESS FOR PRODUCTION THEREOF 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20100221856A1

    公开(公告)日:2010-09-02

    申请号:US12717537

    申请日:2010-03-04

    IPC分类号: H01L33/30 H01L33/44 H01L33/00

    CPC分类号: H01L33/22 H01L33/005

    摘要: One aspect of the present invention provides a semiconductor light-emitting device improved in luminance, and also provides a process for production thereof. The process comprises a procedure of forming a relief structure on the light-extraction surface of the device by use of a self-assembled film. In that procedure, the light-extraction surface is partly covered with a protective film so as to protect an area for an electrode to be formed therein. The electrode is then finally formed there after the procedure. The process thus reduces the area incapable, due to thickness of the electrode, of being provided with the relief structure. Between the electrode and the light-extraction surface, a contact layer is formed so as to establish ohmic contact between them.

    摘要翻译: 本发明的一个方面提供了一种提高亮度的半导体发光器件,并且还提供了其生产方法。 该方法包括通过使用自组装膜在装置的光提取表面上形成浮雕结构的步骤。 在该过程中,光提取表面部分地被保护膜覆盖,以保护其中形成电极的区域。 然后在程序之后最后形成电极。 该方法因此减小了由于电极的厚度而不能设置有浮雕结构的区域。 在电极和光提取表面之间,形成接触层以在它们之间建立欧姆接触。

    ELECTRICAL CONNECTING DEVICE
    40.
    发明申请
    ELECTRICAL CONNECTING DEVICE 有权
    电气连接装置

    公开(公告)号:US20100120265A1

    公开(公告)日:2010-05-13

    申请号:US12500420

    申请日:2009-07-09

    IPC分类号: H01R12/00

    摘要: An electrical connecting device for electrically connecting between two contacted articles, comprising a push member, a lock member, which holds one of the contacted articles in a predetermined mount position through the push member, a base member, to which the two contacted articles are mounted, an elastic member held on the base member, and a plurality of contacts held on the elastic member, and wherein the base member includes an upper base member and a lower base member, each including an accommodating recess, which accommodates the elastic member, the elastic member includes slits, respectively, holding the plurality of contacts, the plurality of contacts, respectively, include at least an upper contact arm having an upper contact portion and a lower contact arm having a lower contact portion, and the upper and lower contact portions of each of the plurality of contacts are structured to enable abutting against the elastic member.

    摘要翻译: 一种电连接装置,用于电连接两个接触物品,包括推动构件,锁定构件,其通过推动构件将一个接触物品保持在预定的安装位置;基座构件,两个接触物品安装在该基座构件上 保持在所述基座上的弹性部件和保持在所述弹性部件上的多个触头,其特征在于,所述基座部件包括上部基座部件和下部基座部件,每个所述上部基部部件和下部基部部件包括容纳所述弹性部件的容纳凹部, 弹性构件分别包括保持多个触点的狭缝,多个触头分别包括具有上接触部分和下接触臂的至少一个上接触臂,该下接触臂具有下接触部分,并且上接触部分和下接触部分 多个触头中的每一个都被构造成能够抵靠弹性构件。