公开(公告)号：US20220072682A1

公开(公告)日：2022-03-10

申请号：US17407062

申请日：2021-08-19

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Manoj A. Gajendra ,  John Anthony Garcia ,  Chetan Kumar Mylappanahalli Narasingaiah ,  Sanjay Bhanrao Chavan ,  Gagan Dobhal ,  Manoj Balakumar ,  Jamie Stuart Leighton ,  Van H. Nguyen

IPC: B24B57/02 ,  B24B37/10 ,  B24B37/04 ,  B24B37/30 ,  B24B37/34 ,  H01L21/02

Abstract: A system and method for sequential single-sided CMP processing of opposite facing surfaces of a silicon carbide (SiC) substrate are disclosed. A method includes urging a first surface of a substrate against one of plurality of polishing pads, wherein the plurality of polishing pads are disposed on corresponding ones of a plurality of rotatable polishing platens. The method includes transferring, using the first side of the end effector, the substrate from the substrate carrier loading station to a substrate alignment station. The method includes transferring, using the first side of the end effector, the substrate from the substrate alignment station to a substrate carrier loading station. The method includes urging a second surface of the substrate against one of the plurality of polishing platens.

公开(公告)号：US20200246935A1

公开(公告)日：2020-08-06

申请号：US16752181

申请日：2020-01-24

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Jamie Stuart LEIGHTON ,  Van H. NGUYEN ,  Roger M. JOHNSON

IPC: B24B37/015 ,  B24B49/14 ,  B24B49/08 ,  G05B11/42

Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.

公开(公告)号：US20180119281A1

公开(公告)日：2018-05-03

申请号：US15851695

申请日：2017-12-21

Applicant: Applied Materials, Inc.

Inventor： Jonghoon BAEK ,  Edwin C. SUAREZ ,  Tsutomu TANAKA ,  Edward P. HAMMOND, IV ,  Jeonghoon OH

IPC: C23C16/455 ,  H01J37/32 ,  C23C16/509

CPC classification number: C23C16/45565 ,  C23C16/509 ,  H01J37/32082 ,  H01J37/32431 ,  H01J37/3244

Abstract: Embodiments of the present invention generally relate to apparatus for reducing arcing and parasitic plasma in substrate processing chambers. The apparatus generally include a processing chamber having a substrate support, a backing plate, and a showerhead disposed therein. A showerhead suspension electrically couples the backing plate to the showerhead. An electrically conductive bracket is coupled to the backing plate and spaced apart from the showerhead. The electrically conductive bracket may include a plate, a lower portion, an upper portion, and a vertical extension. The electrically conductive bracket contacts an electrical isolator.

公开(公告)号：US20180037987A1

公开(公告)日：2018-02-08

申请号：US15784972

申请日：2017-10-16

Applicant: Applied Materials, Inc.

Inventor： Brian WEST ,  Michael S. COX ,  Jeonghoon OH

IPC: C23C14/54 ,  H01L21/67 ,  H01J37/32 ,  C23C14/50 ,  H01L23/34

CPC classification number: C23C14/541 ,  C23C14/50 ,  C23C16/4586 ,  H01J37/3244 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109 ,  H01L23/34

Abstract: Embodiments of the present disclosure provides apparatus and method for stabilizing substrate temperature by flowing a flow of cooling gas to an inlet of cooling channels in a substrate support, receiving the flow of cooling gas from an outlet of the cooling channel using a heat exchanger, and releasing the cooling gas to an immediate environment, such as a cleanroom or a minienvironment.

公开(公告)号：US20160121453A1

公开(公告)日：2016-05-05

申请号：US14879526

申请日：2015-10-09

Applicant: Applied Materials, Inc.

Inventor： David Masayuki ISHIKAWA ,  Jeonghoon OH ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Huanbo ZHANG ,  Chia-Ling PAI ,  Niraj PRASAD ,  Julio David MUZQUIZ

IPC: B24B37/32

CPC classification number: B24B37/32

Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.

Abstract translation: 公开了一种用于抛光工艺的保持环。 保持环包括包括上部和下部的主体以及设置在下部上的牺牲表面，牺牲表面包括具有约0.0003英寸至约0.00015英寸的锥形高度的负锥形表面。

公开(公告)号：US20150047975A1

公开(公告)日：2015-02-19

申请号：US14456014

申请日：2014-08-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Brian T. WEST ,  Michael S. COX ,  Jeonghoon OH

IPC: H01J37/34

CPC classification number: H01J37/3405 ,  C23C14/3407 ,  C23C14/35 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3429 ,  H01J37/3435 ,  H01J37/347 ,  H01J37/3491 ,  H01J37/3497

Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

Abstract translation: 本公开的实施例涉及用于处理衬底的溅射室的溅射靶。 在一个实施方案中，提供了用于溅射室的溅射靶。 溅射靶包括具有径向内部，中部和外部区域的背面的溅射板和安装到溅射板的环形背板。 背面具有多个彼此间隔开的圆形槽，以及至少一个弧形通道，其切割圆形槽并且从径向内部区域延伸到溅射板的径向外部区域。 环形背板限定了暴露溅射板的背面的敞开的环状空间。