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公开(公告)号：US10720751B2
公开(公告)日：2020-07-21
申请号：US16118228
申请日：2018-08-30
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Yu-Hsuan Tsai , Lu-Ming Lai , Ying-Chung Chen , Shih-Chieh Tang
IPC: G02B6/02 , H04B10/50 , G02B6/35 , G02B6/42 , H04B10/80 , H01S5/022 , H01L31/0203 , H01L33/62 , H01L23/00 , H01L23/538 , H01S5/40 , H01L33/48 , H01S5/02 , H01L25/075 , H01S5/183 , H01L25/04 , H01L31/02 , H01L25/16
Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
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公开(公告)号：US10665765B2
公开(公告)日：2020-05-26
申请号：US15860567
申请日：2018-01-02
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Mei-Yi Wu , Lu-Ming Lai , Yu-Ying Lee , Yung-Yi Chang
Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
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公开(公告)号：US11588470B2
公开(公告)日：2023-02-21
申请号：US16794112
申请日：2020-02-18
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chi Sheng Tseng , Lu-Ming Lai , Ching-Han Huang , Kuo-Hua Lai , Hui-Chung Liu
Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
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公开(公告)号：US11588081B2
公开(公告)日：2023-02-21
申请号：US16809506
申请日：2020-03-04
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsin-Ying Ho , Hsun-Wei Chan , Shih-Chieh Tang , Lu-Ming Lai
IPC: H01L33/58
Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.
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公开(公告)号：US11562969B2
公开(公告)日：2023-01-24
申请号：US16569228
申请日：2019-09-12
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Yu-Che Huang , Lu-Ming Lai
Abstract: A semiconductor device package and a method for packaging the same are provided. A semiconductor device package includes a carrier, an electronic component, a buffer layer, a reinforced structure, and an encapsulant. The electronic component is disposed over the carrier and has an active area. The buffer layer is disposed on the active area of the electronic component. The reinforced structure is disposed on the buffer layer. The encapsulant encapsulates the carrier, the electronic component and the reinforced structure.
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Patent Agency Ranking
公开(公告)号：US11437292B2
公开(公告)日：2022-09-06
申请号：US16599772
申请日：2019-10-11
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Wei-Wei Liu , Huei-Siang Wong , Lu-Ming Lai
Abstract: A sensing module, a semiconductor device package and a method of manufacturing the same are provided. The sensing module includes a sensing device, a first protection film and a second protection film. The sensing device has an active surface and a sensing region disposed adjacent to the active surface of the sensing device. The first protection film is disposed on the active surface of the sensing device and fully covers the sensing region. The second protection film is in contact with the first protection film and the active surface of the sensing device.
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公开(公告)号：US11427466B2
公开(公告)日：2022-08-30
申请号：US16517444
申请日：2019-07-19
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Wei-Wei Liu , Huei-Siang Wong , Lu-Ming Lai
Abstract: A semiconductor package structure includes an electronic device having an exposed region adjacent to a first surface, a dam surrounding the exposed region of the semiconductor die and disposed on the first surface, the dam having a top surface away from the first surface, an encapsulant encapsulating the first surface of the electronic device, exposing the exposed region of the electronic device. A surface of the dam is retracted from a top surface of the encapsulant. A method for manufacturing the semiconductor package structure is also provided.
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公开(公告)号：US11276797B2
公开(公告)日：2022-03-15
申请号：US16384847
申请日：2019-04-15
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsiang-Cheng Tsai , Lu-Ming Lai , Hsun-Wei Chan , Ying-Chung Chen
IPC: H01L31/12 , H01L31/0203 , H01L31/0232
Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.
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公开(公告)号：US11211536B2
公开(公告)日：2021-12-28
申请号：US16862447
申请日：2020-04-29
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Mei-Yi Wu , Lu-Ming Lai , Yu-Ying Lee , Yung-Yi Chang
Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
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公开(公告)号：US11081413B2
公开(公告)日：2021-08-03
申请号：US16282147
申请日：2019-02-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsin Lin Wu , Yu-Hsuan Tsai , Chang Chin Tsai , Lu-Ming Lai , Ching-Han Huang
IPC: H01L23/20 , H01L23/043 , H01L21/48 , H01L23/10 , H01L23/26 , H01L23/053
Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.
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