Abstract:
Electrical overstress protection via silicon controlled rectifier (SCR) trigger amplification control is provided. In certain configurations, an overstress protection circuit includes a control circuit for detecting presence of an overstress event between a first pad and a second pad of an interface, and a discharge circuit electrically connected between the first pad and the second pad and selectively activated by the control circuit. The interface corresponds to an electronic interface of an integrated circuit (IC), a System on a Chip (SoC), or System in-a-Package (SiP). The discharge circuit includes a first smaller SCR and a second larger SCR. In response to detecting an overstress event, the control circuit activates the smaller SCR, which in turn activates the larger SCR to provide clamping between the first pad and the second pad.
Abstract:
Apparatus and methods for electrostatic discharge (ESD) protection of radio frequency circuits are provided. In certain configurations, an ESD protection circuit includes two or more pairs of field effect transistors (FETs) electrically connected in series between a radio frequency signal pin and a radio frequency ground pin. Each of the two or more pairs of FETs includes a negative ESD protection FET for providing protection from negative polarity ESD events and a positive ESD protection FET for providing protection from positive polarity ESD events. The source and gate of the negative ESD protection FET are electrically connected to one another, and the source and gate of the positive ESD protection FET are electrically connected to one another. Additionally, the drains of the negative and positive ESD protection FETs are electrically connected to one another. The ESD protection circuit exhibits a relatively low capacitance and flat capacitance versus voltage characteristic.
Abstract:
Apparatus and methods for actively-controlled trigger and latch release thyristor are provided. In certain configurations, an actively-controlled protection circuit includes an overvoltage sense circuit, a thyristor or silicon controlled rectifier (SCR) that is electrically connected between a signal node and a discharge node, and an active trigger and latch release circuit. The overvoltage sense circuit controls a voltage of a dummy supply node based on a voltage of the signal node, and the active trigger and latch release circuit detects presence of a transient overstress event at the signal node based on the voltage of the dummy supply node. The active trigger and latch release circuit provides one or more trigger signals to the SCR to control the SCR's activation voltage, and the active trigger and latch release circuit activates or deactivates the one or more trigger signals based on whether or not the transient overstress event is detected.
Abstract:
Apparatus and methods for compound semiconductor protection clamps are provided herein. In certain configurations, a compound semiconductor protection clamp includes a resistor-capacitor (RC) trigger network and a metal-semiconductor field effect transistor (MESFET) clamp. The RC trigger network detects when an ESD/EOS event is present between a first node and a second node, and activates the MESFET clamp in response to detecting the ESD/EOS event. When the MESFET clamp is activated, the MESFET clamp provides a low impedance path between the first and second nodes, thereby providing ESD/EOS protection. When deactivated, the MESFET clamp provides high impedance between the first and second nodes, and thus operates with low leakage current and small static power dissipation.
Abstract:
Apparatus and methods for providing transient overstress protection with active feedback are disclosed. In certain configurations, a protection circuit includes a transient detection circuit, a bias circuit, a clamp circuit, and a sense feedback circuit that generates a positive feedback current when the clamp circuit is clamping. The transient detection circuit can detect a presence of a transient overstress event, and can generate a detection current in response to detection of the transient overstress event. The detection current and the positive feedback current can be combined to generate a combined current, and the bias circuit can turn on the clamp circuit in response to the combined current. While the transient overstress event is present and the clamp circuit is clamping, the sense feedback circuit can generate the positive feedback current to maintain the clamp circuit turned on for the event's duration.
Abstract:
Apparatus and methods for precision mixed-signal electronic circuit protection are provided. In one embodiment, an apparatus includes a p-well, an n-well, a poly-active diode structure, a p-type active region, and an n-type active region. The poly-active diode structure is formed over the n-well, the p-type active region is formed in the n-well on a first side of the poly-active diode structure, and the n-type active region is formed along a boundary of the p-well and the n-well on a second side of the poly-active diode structure. During a transient electrical event the apparatus is configured to provide conduction paths through and underneath the poly-active diode structure to facilitate injection of carriers in the n-type active region. The protection device can further include another poly-active diode structure formed over the p-well to further enhance carrier injection into the n-type active region.
Abstract:
A protection clamp is provided between a first terminal and a second terminal, and includes a multi-gate high electron mobility transistor (HEMT), a current limiting circuit, and a forward trigger control circuit. The multi-gate HEMT includes a drain/source, a source/drain, a first depletion-mode (D-mode) gate, a second D-mode gate, and an enhancement-mode (E-mode) gate disposed between the first and second D-mode gates. The drain/source and the first D-mode gate are connected to the first terminal and the source/drain and the second D-mode gate are connected to the second terminal. The forward trigger control and the current limiting circuits are coupled between the E-mode gate and the first and second terminals, respectively. The forward trigger control circuit provides an activation voltage to the E-mode gate when a voltage of the first terminal exceeds a voltage of the second terminal by a forward trigger voltage.
Abstract:
A protection circuit including a multi-gate high electron mobility transistor (HEMT), a forward conduction control block, and a reverse conduction control block is provided between a first terminal and a second terminal. The multi-gate HEMT includes an explicit drain/source, a first depletion-mode (D-mode) gate, a first enhancement-mode (E-mode) gate, a second E-mode gate, a second D-mode gate, and an explicit source/drain. The drain/source and the first D-mode gate are connected to the first terminal and the source/drain and the second D-mode gate are connected to the second terminal. The forward conduction control block turns on the second E-mode gate when a voltage difference between the first and second terminals is greater than a forward conduction trigger voltage, and the reverse conduction control block turns on the first E-mode gate when the voltage difference is more negative than a reverse conduction trigger voltage.
Abstract:
Low capacitance poly-bounded silicon controlled rectifiers (SCRs) are disclosed herein. In certain embodiments, an SCR includes an n-type well (NW) and a p-type well (PW) formed adjacent to one another in a substrate. The SCR further includes active regions including p-type active (P+) fin regions over the NW and connected to an anode terminal of the SCR, and n-type active (N+) fin regions over the PW and connected to a cathode terminal of the SCR. The SCR further includes polysilicon gate regions over the PW and NW that serve to separate the active regions while also improving the SCR's turn-on speed in response to fast overstress transients.
Abstract:
Electrostatic discharge protection for high speed transceiver interface is disclosed. In one aspect, an electrical overstress (EOS) protection device includes an anode terminal and a cathode terminal, a silicon controlled rectifier, a second NPN bipolar transistor including a base connected to the anode terminal and an emitter connected to an emitter of the first PNP bipolar transistor, and a second PNP bipolar transistor including an emitter connected to an emitter of the second NPN bipolar transistor and a base connected to a base of the first PNP bipolar transistor. Two or more paths for current conduction are present during a positive overstress transient that increases a voltage of the anode terminal relative to the cathode terminal, including a first path through the silicon controlled rectifier and a second path through the second NPN bipolar transistor and the second PNP bipolar transistor.