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    ANCHOR TRACKING APPARATUS FOR IN-PLANE ACCELEROMETERS AND RELATED METHODS
    31.
    发明申请
    ANCHOR TRACKING APPARATUS FOR IN-PLANE ACCELEROMETERS AND RELATED METHODS 审中-公开

    公开(公告)号：US20180038887A1

    公开(公告)日：2018-02-08

    申请号：US15228229

    申请日：2016-08-04

    Applicant: Analog Devices, Inc.

    Inventor： Xin Zhang ,  William A. Clark ,  Michael Judy

    IPC: G01P15/125

    CPC classification number: G01P15/125 ,  B81B2201/0235 ,  B81B2203/0127 ,  G01P15/18 ,  G01P2015/084

    Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.

    Silicon-Based MEMS Devices Including Wells Embedded with High Density Metal
    32.
    发明申请
    Silicon-Based MEMS Devices Including Wells Embedded with High Density Metal 审中-公开
    包括嵌入高密度金属的井的硅基MEMS器件

    公开(公告)号：US20160178656A1

    公开(公告)日：2016-06-23

    申请号：US14695421

    申请日：2015-04-24

    Applicant: Analog Devices, Inc.

    Inventor： Xin Zhang ,  Michael W. Judy

    IPC: G01P15/14 ,  H01L21/48

    CPC classification number: G01P15/0802 ,  B81C1/00261 ,  G01C19/5769

    Abstract: In one aspect, the disclosure is directed to a MEMS device. The MEMS device includes a silicon-based movable MEMS sensor element. The MEMS device also includes a plurality of wells formed into at least one surface of the movable MEMS sensor element. Each well is filled with at least one metal so as to increase the effective mass of the movable MEMS sensor element. The metal may be tungsten or tantalum, or an alloy with tungsten or tantalum.

    Abstract translation: 在一个方面，本发明涉及一种MEMS装置。 MEMS器件包括硅基可​​移动MEMS传感器元件。 MEMS器件还包括形成在可移动MEMS传感器元件的至少一个表面中的多个阱。 每个孔填充有至少一个金属，以便增加可移动MEMS传感器元件的有效质量。 金属可以是钨或钽，或与钨或钽的合金。

    Tilt Mode Accelerometer with improved Offset and Noise Performance
    33.
    发明申请
    Tilt Mode Accelerometer with improved Offset and Noise Performance 有权
    倾斜模式加速度计具有改进的偏移和噪声性能

    公开(公告)号：US20140251011A1

    公开(公告)日：2014-09-11

    申请号：US13785624

    申请日：2013-03-05

    Applicant: ANALOG DEVICES, INC.

    Inventor： Xin Zhang ,  Howard R. Samuels ,  Michael W. Judy

    IPC: G01P15/125 ,  G01P15/08

    CPC classification number: G01P15/125 ,  G01P15/08 ,  G01P2015/0831 ,  G01P2015/0834

    Abstract: A single-axis tilt-mode microelectromechanical accelerometer structure. The structure includes a substrate having a top surface defined by a first end and a second end. Coupled to the substrate is a first asymmetrically-shaped mass suspended above the substrate pivotable about a first pivot point on the substrate between the first end and the second end and a second asymmetrically-shaped mass suspended above the substrate pivotable about a second pivot point on the substrate between the first end and the second end. The structure also includes a first set of electrodes positioned on the substrate and below the first asymmetrically-shaped mass and a second set of electrodes positioned on the substrate and below the second asymmetrically-shaped mass.

    Abstract translation: 单轴倾斜模式微机电加速度计结构。 该结构包括具有由第一端和第二端限定的顶表面的基底。 耦合到衬底的是第一不对称形状的质量块，悬挂在衬底上方，可在第一端和第二端之间围绕衬底上的第一枢转点枢转，并且悬挂在衬底上方的第二不对称形状的质量可围绕第二枢转点枢转 第一端和第二端之间的衬底。 该结构还包括位于衬底上并位于第一不对称形状的质量下方的第一组电极和位于衬底上并位于第二不对称形状的质量下方的第二组电极。

    GYROSCOPES WITH ELECTRODES FOR TUNING CROSS-AXIS SENSITIVITY
    34.
    发明申请
    GYROSCOPES WITH ELECTRODES FOR TUNING CROSS-AXIS SENSITIVITY 有权

    公开(公告)号：US20250164246A1

    公开(公告)日：2025-05-22

    申请号：US18944411

    申请日：2024-11-12

    Applicant: Analog Devices, Inc.

    Inventor： Tyler Dunn ,  Gaurav Vohra ,  William Clark ,  Xin Zhang ,  Carey Merritt

    IPC: G01C19/5712

    Abstract: Gyroscopes with electrodes for tuning cross-axis sensitivity are disclosed. In certain embodiments, a MEMS gyroscope includes a resonator mass that moves in a first direction (for instance, x-direction), a sensing structure that detects a Coriolis effect in a second direction (for instance, y-direction), and a plurality of electrodes that control a cross-axis stiffness of the MEMS gyroscope by controlling motion of the resonator mass in a third direction (for instance, z-direction). For example, the electrodes can be used to reduce or eliminate cross-axis sensitivity arising from cross-axis stiffnesses, such as kxz (resonator-to-orthogonal) and/or kyz (Coriolis-to-orthogonal).

    MICROELECTROMECHANICAL SYSTEMS (MEMS) AND RELATED PACKAGES
    35.
    发明申请
    MICROELECTROMECHANICAL SYSTEMS (MEMS) AND RELATED PACKAGES 有权

    公开(公告)号：US20250118715A1

    公开(公告)日：2025-04-10

    申请号：US18730912

    申请日：2023-01-24

    Applicant: Analog Devices, Inc.

    Inventor： Xin Zhang ,  Jianglong Zhang ,  Li Chen ,  John C. Cowles ,  Michael Judy ,  Shafi Saiyed

    IPC: H01L25/16 ,  B81B7/00 ,  H01L23/538

    Abstract: Compact packages including microelectromechanical system (MEMS) devices and multiple application specific integrated circuits (ASICs) are described. These packages are sufficiently small to be applicable to contexts in which space requirements are particularly strict, such as in consumer electronics. These packages involve vertical die stacks. A first ASIC may be positioned on one side of the die stack and another ASIC may be positioned on the other side of the die stack. A die including a MEMS device (e.g., an accelerometer, gyroscope, switch, resonator, optical device) is positioned between the ASICs. Optionally, an interposer serving as cap substrate for the MEMS device is also positioned between the ASICs. In one example, a package of the types described herein has an extension of 2 mm×2 mm in the planar axes and less than 500-800 μm in height.

    FULLY DIFFERENTIAL ACCELEROMETER
    39.
    发明申请
    FULLY DIFFERENTIAL ACCELEROMETER 有权

    公开(公告)号：US20220390483A1

    公开(公告)日：2022-12-08

    申请号：US17342484

    申请日：2021-06-08

    Applicant: Analog Devices, Inc.

    Inventor： Jianglong Zhang ,  Xin Zhang

    IPC: G01P15/125 ,  G01P15/18 ,  B81B3/00

    Abstract: Disclosed herein are aspects of a multiple-mass, multi-axis microelectromechanical systems (MEMS) accelerometer sensor device with a fully differential sensing design that applies differential drive signals to movable proof masses and senses differential motion signals at sense fingers coupled to a substrate. In some embodiments, capacitance signals from different sense fingers are combined together at a sensing signal node disposed on the substrate supporting the proof masses. In some embodiments, a split shield may be provided, with a first shield underneath a proof mass coupled to the same drive signal applied to the proof mass and a second shield electrically isolated from the first shield provided underneath the sense fingers and biased with a constant voltage to provide shielding for the sense fingers.

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