Process for preparing episulfide compounds
    33.
    发明授权
    Process for preparing episulfide compounds 有权
    制备环硫化合物的方法

    公开(公告)号:US09051293B2

    公开(公告)日:2015-06-09

    申请号:US14112795

    申请日:2012-04-20

    IPC分类号: C07D331/02

    CPC分类号: C07D331/02

    摘要: Provided is a method for producing an episulfide compound, the method including a step of thiating epoxy groups of (B) an epoxy compound by a reaction with (C) a thiating agent in the presence of (A) a polyhydric hydroxyl compound having two or more hydroxyl groups.

    摘要翻译: 提供了一种环硫化合物的制备方法,该方法包括在(A)具有两个或多个羟基化合物的多羟基化合物的存在下,通过与(C)硫化剂的反应,将(B)环氧化合物的环氧基 更多的羟基。

    Semiconductor device manufacturing method
    35.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US08440524B2

    公开(公告)日:2013-05-14

    申请号:US13030790

    申请日:2011-02-18

    IPC分类号: H01L21/00

    摘要: A method for manufacturing a semiconductor device including a semiconductor substrate composed of silicon carbide, an upper surface electrode which contacts an upper surface of the substrate, and a lower surface electrode which contacts a lower surface of the substrate, the method including steps of: (a) forming an upper surface structure on the upper surface side of the substrate, and (b) forming a lower surface structure on the lower surface side of the substrate. The step (a) comprises steps of: (a1) depositing an upper surface electrode material layer on the upper surface of the substrate, the upper surface electrode material layer being a raw material layer of the upper surface electrode, and (a2) annealing the upper surface electrode material layer. The step (b) comprises steps of: (b1) depositing a lower surface electrode material layer on the lower surface of the substrate, the lower surface electrode material layer being a raw material layer of the lower surface electrode, and (b2) annealing the lower surface electrode material layer with a laser to make an ohmic contact between the lower surface electrode and the substrate.

    摘要翻译: 一种半导体器件的制造方法,该半导体器件包括由碳化硅构成的半导体衬底,与衬底的上表面接触的上表面电极和与衬底的下表面接触的下表面电极,该方法包括以下步骤:( a)在基板的上表面侧上形成上表面结构,(b)在基板的下表面侧形成下表面结构。 步骤(a)包括以下步骤:(a1)在基板的上表面上沉积上表面电极材料层,上表面电极材料层是上表面电极的原料层,(a2)使 上表面电极材料层。 步骤(b)包括以下步骤:(b1)在基板的下表面上沉积下表面电极材料层,下表面电极材料层是下表面电极的原料层,(b2)使 下表面电极材料层用激光器在下表面电极和衬底之间形成欧姆接触。

    Shape measuring apparatus
    37.
    发明申请
    Shape measuring apparatus 审中-公开
    形状测量仪

    公开(公告)号:US20120194651A1

    公开(公告)日:2012-08-02

    申请号:US13200652

    申请日:2011-09-28

    IPC分类号: H04N13/02

    CPC分类号: G01B11/24 G01B11/00 G06T7/571

    摘要: [PROBLEMS] To provide a shape measuring apparatus having a configuration which enables the operation for aligning a measuring probe and a candidate object to be simplified when the shape of the candidate object is measured.[MEANS TO SOLVE THE PROBLEMS] A shape measuring apparatus is configured so that an optical probe 20 moves relative to a candidate object, and the three-dimensional shape of the candidate object is measured without contact from information obtained by the optical probe 20. The shape measuring apparatus includes a gantry structure 10 allowing the optical probe 20 to be moved to a predetermined position relative to the candidate object, and a support device 30 allowing the candidate object to be rotated around at least two rotational axes.

    摘要翻译: 本发明提供一种形状测量装置,其具有能够在测量候选物体的形状时使测量探针和候选物体对准的操作简化的构造。 解决问题的手段形状测量装置被配置为使得光学探针20相对于候选物体移动,并且测量候选物体的三维形状而不与光学探针20获得的信息接触。 形状测量装置包括允许光学探头20相对于候选物体移动到预定位置的台架结构10,以及允许候选物体围绕至少两个旋转轴线旋转的支撑装置30。

    EXPOSURE DEVICE, IMAGE FORMING APPARATUS AND MIRROR ADJUSTING METHOD
    38.
    发明申请
    EXPOSURE DEVICE, IMAGE FORMING APPARATUS AND MIRROR ADJUSTING METHOD 有权
    曝光装置,图像形成装置和镜像调整方法

    公开(公告)号:US20110262185A1

    公开(公告)日:2011-10-27

    申请号:US13090977

    申请日:2011-04-20

    申请人: Takeshi Endo

    发明人: Takeshi Endo

    IPC分类号: G03G15/04

    摘要: An exposure device includes a mirror to reflect light used for exposure of an object, a holder to hold the mirror, an adhesive that bonds the mirror to the holder and elastically deforms, and an adjusting tool that pushes the mirror to change a direction of the mirror.

    摘要翻译: 曝光装置包括用于反射用于物体曝光的光的反射镜,用于保持反射镜的保持器,将反射镜粘合到保持器并弹性变形的粘合剂,以及调节工具,其推动反射镜以改变方向 镜子。

    SiC semiconductor device and method for manufacturing the same
    40.
    发明授权
    SiC semiconductor device and method for manufacturing the same 有权
    SiC半导体器件及其制造方法

    公开(公告)号:US07824995B2

    公开(公告)日:2010-11-02

    申请号:US12071717

    申请日:2008-02-26

    IPC分类号: H01L29/72

    摘要: A SiC semiconductor device includes: a SiC substrate having a main surface; a channel region on the substrate; first and second impurity regions on upstream and downstream sides of the channel region, respectively; a gate on the channel region through a gate insulating film. The channel region for flowing current between the first and second impurity regions is controlled by a voltage applied to the gate. An interface between the channel region and the gate insulating film has a hydrogen concentration equal to or greater than 2.6×1020 cm−3. The interface provides a channel surface perpendicular to a (0001)-orientation plane.

    摘要翻译: SiC半导体器件包括:具有主表面的SiC衬底; 衬底上的沟道区; 分别在通道区域的上游侧和下游侧的第一和第二杂质区域; 通过栅极绝缘膜在沟道区上形成栅极。 用于在第一和第二杂质区域之间流动电流的沟道区域由施加到栅极的电压来控制。 沟道区域和栅极绝缘膜之间的界面的氢浓度等于或大于2.6×1020cm-3。 界面提供垂直于(0001)取向平面的通道表面。