公开(公告)号：US10455738B2

公开(公告)日：2019-10-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Gregory N. Stephens ,  Ian A. Spraggs ,  Vu Thanh Vo ,  Amir Salehi ,  Dennis R. Pyper ,  Alex J. Crumlin ,  Corey S. Provencher ,  Derek J. Walters ,  Michael V. Yeh

IPC: H05K5/02 ,  H04B1/03 ,  H05K7/20 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02 ,  H05K1/14 ,  G06F1/16 ,  H05K9/00 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

公开(公告)号：US10244659B2

公开(公告)日：2019-03-26

申请号：US15712069

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  David A. Pakula ,  David J. Dunsmoor ,  Ian A. Spraggs ,  Lee E. Hooton ,  Marwan Rammah ,  Matthew D. Hill ,  Robert F. Meyer ,  James A. Bertin ,  Eric M. Bennett ,  Simon C. Helmore ,  Melissa A. Wah ,  Jon F. Housour ,  Douglas G. Fournier ,  Christopher S. Tomasetta

IPC: H05K7/20 ,  H05K1/02 ,  G06F3/041 ,  H01M2/10 ,  H05K1/14 ,  G06F1/16 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.

公开(公告)号：US09750152B2

公开(公告)日：2017-08-29

申请号：US14456943

申请日：2014-08-11

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  Benjamin J. Pope ,  Jason S. Sloey ,  Jonathan C. Denby ,  Ian A. Spraggs ,  Shayan Malek

IPC: H04M1/02 ,  H05K7/14 ,  H01R43/20 ,  H05K7/02 ,  H05K7/06 ,  H01H23/04 ,  H01H23/14

CPC classification number: H05K7/14 ,  H01H23/04 ,  H01H23/148 ,  H01R43/205 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0277 ,  H05K7/026 ,  H05K7/06

Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

公开(公告)号：US09472917B2

公开(公告)日：2016-10-18

申请号：US14456955

申请日：2014-08-11

Applicant: Apple Inc.

Inventor： Daniel W. Jarvis ,  Benjamin J. Pope ,  Jason S. Sloey ,  Jonathan C. Denby ,  Ian A. Spraggs ,  Shayan Malek

IPC: H05K5/02 ,  H01R43/20 ,  H05K7/02 ,  H05K7/06 ,  H04M1/02

CPC classification number: H05K7/14 ,  H01H23/04 ,  H01H23/148 ,  H01R43/205 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0277 ,  H05K7/026 ,  H05K7/06

Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中，许多插入模制的保持构件用于在跌落事件期间抑制壳体的侧壁的向外变形。 在另一个实施例中，利用整流罩将多个板对板连接器保持在印刷电路板（PCB）上的通信槽内。 在另一个实施例中，使用具有直径相对的突起的C形垫圈来调节内部部件的对准。

公开(公告)号：US20150158245A1

公开(公告)日：2015-06-11

申请号：US14221170

申请日：2014-03-20

Applicant: Apple Inc.

Inventor： DANIEL W. JARVIS ,  Ian A. Spraggs ,  Lee E. Hooton ,  Miguel C. Christophy ,  Richard Hung Minh Dinh

IPC: B29C65/08 ,  B32B17/06

CPC classification number: B29C65/08 ,  B29C66/1122 ,  B29C66/122 ,  B29C66/124 ,  B29C66/30221 ,  B29C66/472 ,  B29C66/53461 ,  B29C66/71 ,  B29L2031/3475 ,  B32B7/12 ,  B32B7/14 ,  B32B17/06 ,  B32B2307/412 ,  H04M1/0266 ,  B29K2069/00

Abstract: A method of using ultrasonic energy to secure a first and a second component is described, and an apparatus formed therefrom. A first layer is bonded to a second layer by converting ultrasonic energy into thermal energy. The energy conversions means is an energy director. A thermally sensitive layer receives the thermal energy and at least a portion of the thermally sensitive layer melts. The resultant melting bonds the first layer with the second layer. A different energy director may also be included and used to convert thermal energy in order to de-bond the first layer from the second layer in order to perform, for example, a rework.

Abstract translation: 描述了使用超声能量来固定第一和第二部件的方法，以及由其形成的装置。 第一层通过将超声波能量转换为热能而与第二层结合。 能量转换是指能源总监。 热敏层接收热能，并且热敏层的至少一部分熔化。 所得到的熔融结合第一层与第二层。 还可以包括不同的能量导向器并用于转换热能，以便将第一层与第二层脱粘合，以便执行例如返工。

公开(公告)号：US11835382B2

公开(公告)日：2023-12-05

申请号：US17471851

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Jason B. Neevel ,  Christopher S. Tomasetta ,  Jonathan M. Lee ,  Ekaterina Pease ,  Nicholas Merz ,  Daniel Jarvis ,  Michael B. Wittenberg ,  Jared P. Ostdiek ,  Rasamy Phouthavong ,  David A. Pakula ,  Richard H. Koch ,  Marwan Rammah ,  Ian A. Spraggs ,  Laura M. Burke

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/04 ,  H04M1/02

CPC classification number: G01J1/4204 ,  G01J1/0219 ,  G01J1/0233 ,  G01J1/0411 ,  G01J1/0474 ,  G01J1/0252 ,  G01J2001/0257 ,  H04M1/026

Abstract: A portable electronic device includes a housing, a front cover defining a front side of the portable electronic device, a display stack below the front cover and comprising a plurality of display layers configured to produce a graphical output in a display region of the display stack, the graphical output visible through the front cover, and a light sensor module positioned at least partially within the housing and coupled to the display stack in the display region. The light sensor module may be configured to receive ambient light passing through the front cover and through the plurality of display layers and, while a blanking interval is positioned over the light sensor module, produce an output corresponding to the received ambient light, the portable electronic device configured to determine an ambient light value based at least in part on the output from the light sensor module.

公开(公告)号：US11783629B2

公开(公告)日：2023-10-10

申请号：US17471693

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Christopher S. Tomasetta ,  Jason B. Neevel ,  Sara E. Salmon ,  Richard H. Koch ,  Jonathan M. Lee ,  Nicholas Merz ,  Daniel Jarvis ,  Jared P. Ostdiek ,  Michael B. Wittenberg ,  Rasamy Phouthavong ,  David A. Pakula ,  Ian A. Spraggs ,  Marwan Rammah

IPC: G06V40/16 ,  G06T7/521 ,  G06V10/145 ,  H04M1/02

CPC classification number: G06V40/166 ,  G06T7/521 ,  G06V10/145 ,  H04M1/0266 ,  G06T2207/30201

Abstract: A portable electronic device may include a housing, a display at least partially within the housing, a front cover coupled to the housing and positioned over the display, and a biometric sensor module configured to illuminate an object and capture an image of the object through the front cover. The biometric sensor module may include a first lens positioned below the front cover, a first light source positioned below the first lens and configured to project, through the first lens, a dot pattern on the object, a second light source positioned below the first lens and configured to illuminate, through the first lens, the object with a flood of light, a second lens positioned below the front cover, and a light sensor positioned below the second lens and configured to capture an image of the object.

公开(公告)号：US11662772B2

公开(公告)日：2023-05-30

申请号：US17220592

申请日：2021-04-01

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Shimon Elkayam ,  Brandon R. Garbus ,  Christopher S. Graham ,  Karl Ruben F. Larsson ,  Ashley E. Fletcher ,  Jared M. Kole ,  Eric S. Jol ,  Aaron A. Oro ,  Michael D. Quinones ,  Gregory N. Stephens ,  Ian A. Spraggs ,  James A. Bertin ,  Simon C. Helmore ,  Melissa A. Wah ,  Matthew D. Hill ,  Jon F. Housour ,  Douglas G. Fournier ,  Christopher S. Tomasetta

IPC: H04N5/225 ,  H04M1/02 ,  H02J50/70 ,  G06V40/16 ,  G06F1/16 ,  H02J50/10 ,  G06F1/26 ,  H04N23/45 ,  H04N23/51

CPC classification number: G06F1/1626 ,  G06F1/1658 ,  G06F1/1686 ,  G06F1/26 ,  H02J50/10 ,  H02J50/70 ,  H04M1/0202 ,  H04N23/45 ,  H04N23/51 ,  G06V40/172 ,  H04M1/0264 ,  H04M1/0277

Abstract: An electronic disclosed herein may include a band formed from metal that combines with a bottom wall formed from a non-metal to form an enclosure that carries internal components. The electronic device may include a transparent cover and a display assembly partially covered by a border having a uniform dimension. The electronic device may include a vision system designed for facial recognition of a user of the electronic device. A bracket assembly may hold the vision system. The bracket assembly may not be affixed to the enclosure and may move relative to the enclosure. The electronic device may include a battery assembly having multiple battery components coupled together. The electronic device may further include a receiver coil for wireless charging of the battery assembly. The electronic device may include a circuit board assembly having stacked circuit boards. The electronic device may further include a dual camera assembly.

公开(公告)号：US11418638B2

公开(公告)日：2022-08-16

申请号：US16569525

申请日：2019-09-12

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

IPC: G06F1/16 ,  H04M1/18 ,  H04M1/02

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

公开(公告)号：US11073872B2

公开(公告)日：2021-07-27

申请号：US16818680

申请日：2020-03-13

Applicant: Apple Inc.

Inventor： Andrew U. Leopold ,  Owen D. Hale ,  Daniel W. Jarvis ,  David A. Pakula ,  James B. Smith ,  Ian A. Spraggs ,  Gregory N. Stephens

IPC: G06F1/16 ,  H05K7/02 ,  H01R12/52 ,  H05K9/00 ,  H05K1/18 ,  H02J50/10 ,  H04R1/02 ,  H04R3/00 ,  H02J7/02 ,  G08B7/06

Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.