公开(公告)号：US12030093B2

公开(公告)日：2024-07-09

申请号：US17889330

申请日：2022-08-16

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  B24B37/34 ,  H01L21/67

CPC classification number: B08B3/106 ,  B24B37/34 ,  H01L21/67051 ,  H01L21/67248 ,  B08B2203/007

Abstract: An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US11986926B2

公开(公告)日：2024-05-21

申请号：US17897088

申请日：2022-08-26

Applicant: Applied Materials, Inc.

Inventor： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC: B24B57/02 ,  B24B37/10 ,  H01L21/67

CPC classification number: B24B57/02 ,  B24B37/10 ,  H01L21/67075 ,  H01L21/6708

Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.

公开(公告)号：US11833637B2

公开(公告)日：2023-12-05

申请号：US17360907

申请日：2021-06-28

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Calvin Lee ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Dmitry Sklyar ,  Paul D. Butterfield ,  Chad Pollard ,  Haosheng Wu

IPC: B24B37/015 ,  B24B37/04 ,  F22B35/00

CPC classification number: B24B37/015 ,  B24B37/042 ,  F22B35/00

Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

公开(公告)号：US11780046B2

公开(公告)日：2023-10-10

申请号：US17896008

申请日：2022-08-25

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Shou-Sung Chang ,  Steven M. Zuniga ,  Fred C. Redeker

IPC: B24B37/20 ,  B24B37/005 ,  B24B37/013 ,  B24B49/12 ,  B24B41/02 ,  B24B53/02

CPC classification number: B24B37/005 ,  B24B37/013 ,  B24B37/20 ,  B24B37/205 ,  B24B41/02 ,  B24B49/12 ,  B24B53/02

Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

公开(公告)号：US11633833B2

公开(公告)日：2023-04-25

申请号：US16886238

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher

IPC: B24B53/017 ,  B24B53/00 ,  B24B57/02 ,  B24B41/06

Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

公开(公告)号：US11628478B2

公开(公告)日：2023-04-18

申请号：US16886567

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/00 ,  B08B3/10 ,  H01L21/02 ,  B08B1/00 ,  B24B53/017 ,  B24B37/20 ,  H01L21/306

Abstract: A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.

公开(公告)号：US20210331288A1

公开(公告)日：2021-10-28

申请号：US17371032

申请日：2021-07-08

Applicant: Applied Materials, Inc.

Inventor： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC: B24B57/02 ,  B24B37/10 ,  H01L21/67

Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

公开(公告)号：US09808906B2

公开(公告)日：2017-11-07

申请号：US15173491

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung Chang ,  Takashi Fujikawa ,  Hung Chih Chen ,  Paul D. Butterfield

IPC: B24B37/005 ,  B24B37/04 ,  B24B37/10 ,  B24B49/16 ,  B24B37/32 ,  B24B37/16

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/16 ,  B24B37/32 ,  B24B49/16

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

公开(公告)号：US20160016280A1

公开(公告)日：2016-01-21

申请号：US14334608

申请日：2014-07-17

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Paul D. Butterfield ,  Jay Gurusamy ,  Jason Garcheung Fung ,  Shou-Sung Chang ,  Jimin Zhang ,  Eric Lau

IPC: B24B37/10 ,  H01L21/768 ,  H01L21/67

CPC classification number: B24B37/10

Abstract: A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.

Abstract translation: 化学机械抛光装置包括其上容纳有基底的板，以及可抛光垫支撑和耦合的抛光垫，其在抛光操作期间移动穿过基板并且在基板的局部区域上轨道。 可以改变衬垫抵靠衬底的载荷，垫的转速以及衬垫的尺寸，形状和组成，以控制衬垫移除的材料的速率。

公开(公告)号：US20140273766A1

公开(公告)日：2014-09-18

申请号：US14213937

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung Chang ,  Takashi Fujikawa ,  Hung Chih Chen ,  Paul D. Butterfield

IPC: B24B37/005 ,  B24B37/32 ,  B24B37/10

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/16 ,  B24B37/32 ,  B24B49/16

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.