公开(公告)号：US11925073B2

公开(公告)日：2024-03-05

申请号：US17494600

申请日：2021-10-05

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L27/32 ,  H10K59/122 ,  H10K59/35 ,  H10K102/00

CPC classification number: H10K59/122 ,  H10K59/352 ,  H10K59/353 ,  H10K2102/311

Abstract: A display device includes a display layer having a plurality of light-emitting diodes and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.

公开(公告)号：US11769666B2

公开(公告)日：2023-09-26

申请号：US17379508

申请日：2021-07-19

Applicant: Applied Materials, Inc.

Inventor： Rui Cheng ,  Fei Wang ,  Abhijit Basu Mallick ,  Robert Jan Visser

IPC: H01L21/02 ,  A61K9/00 ,  A61K31/438 ,  A61K31/4409 ,  A61K31/47 ,  A61K31/497 ,  A61K47/12 ,  A61K47/26 ,  A61K47/36 ,  H01L21/3065

CPC classification number: H01L21/02636 ,  A61K9/0024 ,  A61K31/438 ,  A61K31/4409 ,  A61K31/47 ,  A61K31/497 ,  A61K47/12 ,  A61K47/26 ,  A61K47/36 ,  H01L21/0262 ,  H01L21/02381 ,  H01L21/02488 ,  H01L21/02491 ,  H01L21/02532 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02664 ,  H01L21/3065

Abstract: Methods for selective silicon film deposition on a substrate comprising a first surface and a second surface are described. More specifically, the process of depositing a film, treating the film to change some film property and selectively etching the film from various surfaces of the substrate are described. The deposition, treatment and etching can be repeated to selectively deposit a film on one of the two substrate surfaces.

公开(公告)号：US11662317B2

公开(公告)日：2023-05-30

申请号：US17188485

申请日：2021-03-01

Applicant: Applied Materials, Inc.

Inventor： Avishek Ghosh ,  Byung-Sung Kwak ,  Todd Egan ,  Robert Jan Visser ,  Gangadhar Banappanavar ,  Dinesh Kabra

IPC: G01N21/00 ,  G01N21/64 ,  H01L51/52

CPC classification number: G01N21/6489 ,  G01N21/6408 ,  H01L51/5287

Abstract: An apparatus for determining a characteristic of a photoluminescent (PL) layer comprises: a light source that generates an excitation light that includes light from the visible or near-visible spectrum; an optical assembly configured to direct the excitation light onto a PL layer; a detector that is configured to receive a PL emission generated by the PL layer in response to the excitation light interacting with the PL layer and generate a signal based on the PL emission; and a computing device coupled to the detector and configured to receive the signal from the detector and determine a characteristic of the PL layer based on the signal.

公开(公告)号：US11610925B2

公开(公告)日：2023-03-21

申请号：US16859708

申请日：2020-04-27

Applicant: Applied Materials, Inc.

Inventor： Jinxin Fu ,  Yongan Xu ,  Ludovic Godet ,  Naamah Argaman ,  Robert Jan Visser

IPC: H01L27/146 ,  G02B1/00 ,  G02B27/00 ,  H04N5/374

Abstract: An imaging system and a method of creating composite images are provided. The imaging system includes one or more lens assemblies coupled to a sensor. When reflected light from an object enters the imaging system, incident light on the metalens filter systems creates filtered light, which is turned into composite images by the corresponding sensors. Each metalens filter system focuses the light into a specific wavelength, creating the metalens images. The metalens images are sent to the processor, wherein the processor combines the metalens images into one or more composite images. The metalens images are combined into a composite image, and the composite image has reduced chromatic aberrations.

公开(公告)号：US11579339B2

公开(公告)日：2023-02-14

申请号：US16406992

申请日：2019-05-08

Applicant: Applied Materials, Inc.

Inventor： Manivannan Thothadri ,  Ali Salehpour ,  John D. Busch ,  Robert Jan Visser

IPC: G02B1/14 ,  G02F1/1333 ,  H01L51/52 ,  H05K5/00 ,  H05K5/03

Abstract: Implementations described herein generally relate to flexible display devices and cover lens assemblies with flexible cover lens. In one or more embodiments, a cover lens assembly is provided and includes a first flexible cover lens, a second flexible cover lens, and a sacrificial adhesion disposed between the first flexible cover lens and the second flexible cover lens. The first flexible cover lens includes a first hard coat layer having a hardness in a range from about 4H to about 9H and a first substrate. The second flexible cover lens includes a second hard coat layer having a hardness in a range from about 2H to about 9H. The first substrate is disposed between the first hard coat layer and the sacrificial adhesion layer.

公开(公告)号：US11480712B2

公开(公告)日：2022-10-25

申请号：US17212500

申请日：2021-03-25

Applicant: Applied Materials, Inc.

Inventor： Tapashree Roy ,  Rutger Meyer Timmerman Thijssen ,  Robert Jan Visser

IPC: G02F1/1335 ,  G02B1/00

Abstract: Embodiments described herein relate to nanostructured trans-reflective filters having sub-wavelength dimensions. In one embodiment, the trans-reflective filter includes a film stack that transmits a filtered light within a range of wavelengths and reflects light not within the first range of wavelengths. The film stack includes a first metal film disposed on a substrate having a first thickness, a first dielectric film disposed on the first metal film having a second thickness, a second metal film disposed on the first dielectric film having a third thickness, and a second dielectric film disposed on the second metal film having a fourth thickness.

公开(公告)号：US11361991B2

公开(公告)日：2022-06-14

申请号：US16975794

申请日：2019-03-07

Applicant: Applied Materials, Inc.

Inventor： Xin Liu ,  Fei Wang ,  Rui Cheng ,  Abhijit Basu Mallick ,  Robert Jan Visser

IPC: H01L21/768 ,  C23C16/01 ,  C23C16/24 ,  C23C16/455 ,  C23C16/46 ,  C23C16/56 ,  H01L21/02 ,  H01L21/3205 ,  H01L29/06

Abstract: Embodiments of the present disclosure relate to processes for filling trenches. The process includes depositing a first amorphous silicon layer on a surface of a layer and a second amorphous silicon layer in a portion of a trench formed in the layer, and portions of side walls of the trench are exposed. The first amorphous silicon layer is removed. The process further includes depositing a third amorphous silicon layer on the surface of the layer and a fourth amorphous silicon layer on the second amorphous silicon layer. The third amorphous silicon layer is removed. The deposition/removal cyclic processes may be repeated until the trench is filled with amorphous silicon layers. The amorphous silicon layers form a seamless amorphous silicon gap fill in the trench since the amorphous silicon layers are formed from bottom up.

公开(公告)号：US20220028942A1

公开(公告)日：2022-01-27

申请号：US17494600

申请日：2021-10-05

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L27/32

Abstract: A display device includes a display layer having a plurality of light-emitting diodes and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.

公开(公告)号：US11121345B2

公开(公告)日：2021-09-14

申请号：US16696971

申请日：2019-11-26

Applicant: Applied Materials, Inc.

Inventor： Gang Yu ,  Chung-Chia Chen ,  Wan-Yu Lin ,  Hyunsung Bang ,  Lisong Xu ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L51/56

Abstract: An organic light-emitting diode (OLED) structure includes a substrate, a dielectric layer on the substrate having an array of well structures with each well structure including a recess with side walls and a floor and the recesses are separated by plateaus having rounded top surfaces, a stack of OLED layers covering at least the floor of the well, and a light extraction layer (LEL) in the well over the stack of OLED layers.

公开(公告)号：US20210135140A1

公开(公告)日：2021-05-06

申请号：US16685944

申请日：2019-11-15

Applicant: Applied Materials, Inc

Inventor： Gang Yu ,  Chung-Chia Chen ,  Wan-Yu Lin ,  Hyunsung Bang ,  Lisong Xu ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/50 ,  H01L51/56 ,  H01L51/52

Abstract: An organic light-emitting diode (OLED) structure includes a stack of OLED layers; a light extraction layer (LEL) comprising a UV-cured ink; and a UV blocking layer between the LEL and the stack of OLED layers.