公开(公告)号：US20220179058A1

公开(公告)日：2022-06-09

申请号：US17682937

申请日：2022-02-28

Applicant: BFLY Operations, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston ,  Keith G. Fife

IPC: G01S7/52 ,  G01S15/89 ,  G01S7/521

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：US12231097B2

公开(公告)日：2025-02-18

申请号：US18389875

申请日：2023-12-20

Applicant: BFLY OPERATIONS, INC.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Nevada J. Sanchez ,  Andrew J. Casper ,  Tyler S. Ralston

IPC: G01S7/52 ,  A61B5/00 ,  A61B8/00 ,  H03F1/08 ,  H03F3/16 ,  H03F3/45

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

公开(公告)号：US11863133B2

公开(公告)日：2024-01-02

申请号：US17331538

申请日：2021-05-26

Applicant: BFLY OPERATIONS, INC.

Inventor： Kailiang Chen ,  Keith G. Fife ,  Nevada J. Sanchez ,  Andrew J. Casper ,  Tyler S. Ralston

IPC: H03F3/16 ,  H03F1/08 ,  H03F3/45 ,  G01S7/52 ,  A61B5/00 ,  A61B8/00 ,  A61B8/08

CPC classification number: H03F3/16 ,  A61B5/6801 ,  A61B8/4444 ,  G01S7/52025 ,  H03F1/086 ,  H03F3/45183 ,  A61B8/5207 ,  H03F2200/408 ,  H03F2200/555 ,  H03F2203/45471 ,  H03F2203/45504 ,  H03F2203/45631 ,  H03F2203/45634 ,  H03F2203/45646 ,  H03F2203/45648 ,  H03F2203/45674 ,  H03F2203/45686 ,  H03F2203/45692 ,  H03F2203/45726

Abstract: A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

公开(公告)号：US11828729B2

公开(公告)日：2023-11-28

申请号：US16986067

申请日：2020-08-05

Applicant: BFLY OPERATIONS, INC.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

CPC classification number: G01N29/2406 ,  A61B8/4483 ,  B06B1/0292 ,  B81B7/007 ,  B81C1/00238 ,  B81C1/00301 ,  B81B2201/0271 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/146 ,  H01L2924/1461

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US11684949B2

公开(公告)日：2023-06-27

申请号：US17086311

申请日：2020-10-30

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  G10K11/18 ,  G10K9/12 ,  B81B7/00

CPC classification number: B06B1/02 ,  B06B1/0292 ,  B81B3/0021 ,  B81B7/0077 ,  B81C1/00158 ,  G10K9/12 ,  G10K11/18 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US11676874B2

公开(公告)日：2023-06-13

申请号：US17191829

申请日：2021-03-04

Applicant: BFLY Operations, Inc.

Inventor： Jianwei Liu ,  Keith G. Fife

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  A61B8/00

CPC classification number: H01L23/3128 ,  A61B8/44 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/83 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/8384

Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.

公开(公告)号：US20230172582A1

公开(公告)日：2023-06-08

申请号：US18104063

申请日：2023-01-31

Applicant: BFLY OPERATIONS, INC.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife

IPC: A61B8/00 ,  B06B1/02 ,  A61B8/08 ,  A61B8/12 ,  B06B1/06

CPC classification number: A61B8/4477 ,  A61B8/12 ,  A61B8/54 ,  A61B8/56 ,  A61B8/465 ,  A61B8/467 ,  A61B8/483 ,  A61B8/485 ,  A61B8/488 ,  A61B8/0883 ,  A61B8/0891 ,  A61B8/4236 ,  A61B8/4427 ,  A61B8/4444 ,  A61B8/4472 ,  A61B8/4494 ,  A61B8/5207 ,  B06B1/0292 ,  B06B1/0622

Abstract: A processing device is coupled to a single ultrasound device having a single array of capacitive micromachined ultrasound transducers (CMUTs). The processing device generates a graphical user interface (GUI) having user selectable GUI menu options corresponding to respective ultrasound operating modes for the single ultrasound device having the single ultrasound transducer array. The user-selectable GUI menu options include GUI menu options labeled as representing an ultrasound operating mode for musculoskeletal imaging, breast imaging, carotid imaging, vascular imaging, and abdominal imaging, respectively. The processing device further receives, via the GUI, user input indicating selection of one of the ultrasound operating modes, and in response to receiving the user input, provides an indication to the single ultrasound device having the single array of CMUTs to operate in the selected ultrasound operating mode.

公开(公告)号：US11647985B2

公开(公告)日：2023-05-16

申请号：US17209126

申请日：2021-03-22

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Gregory Corteville

IPC: A61B8/14 ,  A61B8/00 ,  A61B8/13 ,  A61B8/08 ,  G03B27/42 ,  G03B27/52 ,  B06B1/02 ,  G01S7/00 ,  G01S7/52 ,  G01S15/89 ,  A61N7/02 ,  A61N7/00

CPC classification number: A61B8/4444 ,  A61B8/13 ,  A61B8/14 ,  A61B8/4477 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  A61N7/02 ,  B06B1/0292 ,  G01S7/003 ,  G01S7/5208 ,  G01S7/52084 ,  G01S15/8915 ,  G03B27/423 ,  G03B27/52 ,  A61B8/4411 ,  A61N2007/0078 ,  Y10T29/49005

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

公开(公告)号：US11571711B2

公开(公告)日：2023-02-07

申请号：US16683652

申请日：2019-11-14

Applicant: BFLY OPERATIONS, INC.

Inventor： Lingyun Miao ,  Keith G. Fife ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

Abstract: A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.

公开(公告)号：US11446001B2

公开(公告)日：2022-09-20

申请号：US15629666

申请日：2017-06-21

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife

IPC: A61B8/00 ,  A61B8/12 ,  A61B8/14 ,  B06B1/02 ,  B06B1/06

Abstract: A universal ultrasound device having an ultrasound probe includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.