摘要:
A 256 Meg dynamic random access memory is comprised of a plurality of cells organized into individual arrays, with the arrays being organized into 32 Meg array blocks, which are organized into 64 Meg quadrants. Sense amplifiers are positioned between adjacent rows in the individual arrays while row decoders are positioned between adjacent columns in the individual arrays. In certain of the gap cells, multiplexers are provided to transfer signals from I/O lines to data lines. A datapath is provided which, in addition to the foregoing, includes array I/O blocks, responsive to the datalines from each quadrant to output data to a data read mux, data buffers, and data driver pads. The write data path includes a data in buffer and data write muxes for providing data to the array I/O blocks. A power bus is provided which minimizes routing of externally supplied voltages, completely rings each of the array blocks, and provides gridded power distribution within each of the array blocks. A plurality of voltage supplies provide the voltages needed in the array and in the peripheral circuits. The power supplies are organized to match their power output to the power demand and to maintain a desired ratio of power production capability and decoupling capacitance. A powerup sequence circuit is provided to control the powerup of the chip. Redundant rows and columns are provided as is the circuitry necessary to logically replace defective rows and columns with operational rows and columns. Circuitry is also provided on chip to support various types of test modes.
摘要:
A memory device is operable in either a high mode or a low speed mode. In either mode, 32 bits of data from each of two memory arrays are prefetched into respective sets of 32 flip-flops. In the high-speed mode, the prefetched data bits are transferred in parallel to 4 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 4 data bus terminals. In the low speed mode, two sets of prefetched data bits are transferred in parallel to 8 parallel-to-serial converters, which transform the parallel data bits to a burst of 8 serial data bits and apply the burst to a respective one of 8 data bus terminals.
摘要:
Embodiments in accordance with the present invention provide methods of forming a dual gated semiconductor-on-insulator (SOI) device. Such methods encompass forming a first transistor structure operatively adjacent a first side of the semiconductor layer of an SOI substrate. Insulator layer material is removed from the second side of the semiconductor layer, between the source/drain contact structures of the first transistor structure and a second transistor structure there formed operatively adjacent the second side of the semiconductor layer and aligned to the first transistor structure.
摘要:
A method and apparatus for calibrating a data path of a digital circuit uses an even bit pseudo-random calibration pattern. A portion of the pattern is captured in a capture period and used to predict a next arriving portion of the calibration pattern. The next arriving portion of the calibration pattern is captured and then compared to the predicted pattern in a compare period, and the result of the comparison is used to relatively time data arriving in the data path to a clocking signal which clocks in the data. The time duration of the compare period may be varied to ensure that all possible bits of the calibration pattern are used in the calibration procedure.
摘要:
A memory device having a segment row repair architecture that provides the benefits of single bit repair, thereby efficiently utilizing redundant rows of the memory device, is disclosed. The rows of a memory device are segmented into four segments and segmented row repair is provided by selectively disabling a wordline driver for only one segment of the primary row in which a defective memory cell is located and enabling a redundant wordline driver with a redundant term signal provided by the redundancy matching circuit, thereby substituting a redundant row segment for only a specific segment of the entire row length. By selectively disabling only the wordline driver associated with the defective memory cell and dividing the primary and redundant rows into four segments, localized or single bit repair can be performed, thereby efficiently utilizing the redundant rows of the memory device.
摘要:
A novel bi-level DRAM architecture is described which achieves significant reductions in die size while maintaining the noise performance of traditional folded architectures. Die size reduction results primarily by building the memory arrays with 6F2 or smaller memory cells in a type of cross point memory cell layout. The memory arrays utilize stacked digitlines and vertical digitline twisting to achieve folded architecture operation and noise performance.
摘要:
A memory circuit is described which includes distributed voltage generators to selectively provide power to memory arrays of the memory circuit. Each memory array can be turned off by deactivating its voltage generator if it is determined that the memory array is defective and cannot be repaired. The memory device, therefore, can be salvaged by reducing the operational capacity of the memory device. The distributed voltage generators can be selectively deactivated to test the memory circuit.
摘要:
A dual port memory cell having reduced architecture utilizing silicon on insulator is provided. Each storage capacitor has respective access transistors, for connecting the storage capacitor to two separate digit lines. One of the access transistors connects the capacitor to a first digit line which runs above the silicon on insulator layer while the second access transistor connects the capacitor to a second digit line which runs below the silicon on insulator structure.
摘要:
Processes are disclosed which facilitate improved high density memory circuitry, most preferably dynamic random access memory (DRAM) circuitry. In accordance with aspects of the invention, considerably greater numbers of die sites per wafer are achieved for 6 inch, 8 inch and 12 inch wafers for 4 M, 16 M, 64 M and 256 M integration levels. Further, a semiconductor memory device includes, i) a plurality of functional and operably addressable memory cells arranged in multiple memory arrays formed on a semiconductor die; and ii) circuitry formed on the semiconductor die permitting data to be written to and read from one or more of the memory cells, at least one of the memory arrays containing at least 100 square microns of continuous die surface area having at least 170 of the functional and operably addressable memory cells.
摘要:
Defective memory is programmed to have a contiguous address space by dividing the logical address space of the memory into a plurality of address sections. The address section containing the address mapped to a defective memory location is identified. The physical memory locations originally mapped to the addresses in the identified address section are remapped to addresses in an address section at one end of the address space. The addresses in the end address section are disabled. Alternatively, spare memory is provided and the addresses in the end address section are remapped to physical locations in the spare memory. A similar remapping procedure is applied to repair defective data paths in a memory. The remapping procedure is applicable to memory devices or memory modules.