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公开(公告)号：US10513455B2
公开(公告)日：2019-12-24
申请号：US15521112
申请日：2015-10-29
Applicant: Corning Incorporated
Inventor： Thomas Roger Cook , Christopher William Drewnowski , Peter Knowles , Geunsik Lim , Moussa N'Gom , Irene Mona Peterson , Robert Stephen Wagner
Abstract: An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.
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公开(公告)号：US10366904B2
公开(公告)日：2019-07-30
申请号：US15696736
申请日：2017-09-06
Applicant: CORNING INCORPORATED
Inventor： Andres Covarrubias Jaramillo , Yuhui Jin , Frank Andrew Kramer, IV , Ekaterina Aleksandrovna Kuksenkova , Daniel Wayne Levesque, Jr. , Garrett Andrew Piech , Aric Bruce Shorey , Robert Stephen Wagner
IPC: H01L21/48 , C03C15/00 , C03C23/00 , H01L23/498 , H01L23/538
Abstract: Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.
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公开(公告)号：US10144093B2
公开(公告)日：2018-12-04
申请号：US15251453
申请日：2016-08-30
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/402 , C03B33/09 , B23K26/04 , C03B33/02 , C03C15/00 , B32B17/06 , C03C17/00 , B23K26/00 , B23K26/06 , B23K26/38 , B23K26/0622 , C09K13/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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公开(公告)号：US09850160B2
公开(公告)日：2017-12-26
申请号：US14529520
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US20170355633A1
公开(公告)日：2017-12-14
申请号：US15521112
申请日：2015-10-29
Applicant: Corning Incorporated
Inventor： Thomas Roger Cook , Christopher William Drewnowski , Peter Knowles , Geunsik Lim , Moussa N'Gom , Irene Mona Peterson , Robert Stephen Wagner
Abstract: An apparatus includes a fiber feeding system to deposit a fiber on an edge of the glass article and a laser system. The laser system is positioned to project a first and a second laser beam onto a first and a second side of the fiber, respectively. The laser system is positioned to project a third laser beam onto the edge of the glass article. A method includes advancing a glass article relative to a fiber; positioning the fiber in relation to an edge of the glass article, contacting a first side of the fiber with a first laser beam, contacting a second side of the fiber with a second laser beam, depositing the fiber on the edge of the glass article, and contacting the edge of the glass article with a third laser beam.
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Patent Agency Ranking
公开(公告)号：US20170266757A1
公开(公告)日：2017-09-21
申请号：US15617622
申请日：2017-06-08
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: B23K26/00 , B23K26/382 , C03B33/02 , B23K26/0622
Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.
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公开(公告)号：US20160368809A1
公开(公告)日：2016-12-22
申请号：US15251605
申请日：2016-08-30
Applicant: Corning Incorporated
Inventor： Thomas Hackert , Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/082 , B23K26/0608 , B23K26/0622 , B23K26/359 , B23K26/382 , B23K26/389 , B23K26/53 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03B33/04 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24273
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.
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公开(公告)号：US20150232369A1
公开(公告)日：2015-08-20
申请号：US14529520
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/02
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
Abstract translation: 本发明涉及用于切割和分离透明材料薄基板的激光切割技术，例如切割主要用于制造薄膜晶体管（TFT）器件的显示玻璃组合物。 所描述的激光工艺可以用于例如以> 1m / sec的速度进行直线切割，以切割尖锐的半径外角（<1mm），并且产生包括形成内部孔和狭槽的任意弯曲形状。 激光加工碱土硼硅铝酸盐玻璃复合工件的方法包括将脉冲激光束聚焦到焦线中。 焦线被引导到玻璃复合工件中，在材料内产生诱导吸收。 工件和激光束相对于彼此平移以沿着轮廓形成多条缺陷线，其中相邻的缺陷线具有0.1-20微米的间隔。
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39.发明申请STACKED TRANSPARENT MATERIAL CUTTING WITH ULTRAFAST LASER BEAM OPTICS, DISRUPTIVE LAYERS AND OTHER LAYERS 审中-公开超声波激光束光学，破坏层和其他层的堆叠透明材料切割公开(公告)号：US20150165563A1
公开(公告)日：2015-06-18
申请号：US14530457
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Robert George Manley , Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: H05K5/03 , B23K26/009 , B23K26/0622 , B23K26/359 , B23K26/382 , B23K26/40 , B23K26/53 , B23K26/55 , B23K26/57 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B32B17/00 , B32B2457/20 , C03B33/00 , C03B33/0222 , C03B33/04 , C03B33/078 , C03B33/082 , C03B33/091 , C03C15/00 , Y02P40/57
Abstract: A method of laser drilling, forming a perforation, cutting, separating or otherwise processing a material includes focusing a pulsed laser beam into a laser beam focal line, and directing the laser beam focal line into a workpiece comprising a stack including at least: a first layer, facing the laser beam, the first layer being the material to be laser processed, a second layer comprising a carrier layer, and a laser beam disruption element located between the first and second layers, the laser beam focal line generating an induced absorption within the material of the first layer, the induced absorption producing a defect line along the laser beam focal line within the material of the first layer. The beam disruption element may be a beam disruption layer or a beam disruption interface.
Abstract translation: 激光钻孔，形成穿孔，切割，分离或以其他方式处理材料的方法包括将脉冲激光束聚焦到激光束焦线中，并将激光束焦线引导到包括至少包括第一 层，面对激光束，第一层是待激光处理的材料，第二层包括载体层和位于第一和第二层之间的激光束破坏元件，激光束焦线在其内产生诱发吸收 所述第一层的材料，所述诱导吸收在所述第一层的材料内产生沿着所述激光束焦线的缺陷线。 光束破坏元件可以是光束中断层或光束中断接口。
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公开(公告)号：US20150059411A1
公开(公告)日：2015-03-05
申请号：US14466460
申请日：2014-08-22
Applicant: Corning Incorporated
Inventor： Geunsik Lim , Robert Stephen Wagner , James Joseph Watkins
IPC: C03B33/08 , C03B33/023
CPC classification number: C03B33/082 , B23K26/0624 , B23K26/0643 , B23K26/361 , B23K2103/54 , B65G2249/04 , C03B33/0222 , C03B33/023 , C03B33/07 , C03C23/0025
Abstract: A method of separating a thin glass substrate from a carrier plate to which edge portions of the glass substrate are bonded, including irradiating a surface of the glass substrate with a pulsed laser beam, the laser beam moving along a plurality of parallel scan paths within a raster envelope, producing relative motion between the raster envelope and the glass substrate so that the raster envelope is moved along an irradiation path on the unbonded central portion. The irradiating produces ablation of the glass substrate along the irradiation path that forms a channel having a width W1 at the first surface greater than a width W2 at the second surface and extending through the thickness of the glass substrate, thus separating a thin glass sheet from the glass substrate-carrier plate assembly.
Abstract translation: 将薄玻璃基板与玻璃基板的边缘部分接合的载体板分离的方法，包括用脉冲激光束照射玻璃基板的表面，激光束沿着多个平行的扫描路径移动， 光栅包围，产生光栅包络和玻璃基底之间的相对运动，使得光栅包络沿着未结合的中心部分上的照射路径移动。 照射产生沿着照射路径的玻璃基板的烧蚀，所述照射路径形成在第一表面处的宽度W1大于第二表面处的宽度W2并且延伸穿过玻璃基板的厚度的通道，从而将薄玻璃板从 玻璃基板载体板组件。
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