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1.发明申请METHOD FOR RAPID LASER DRILLING OF HOLES IN GLASS AND PRODUCTS MADE THEREFROM 审中-公开用于激光激光玻璃中的孔的方法和其制造的产品公开(公告)号：US20150166396A1
公开(公告)日：2015-06-18
申请号：US14535800
申请日：2014-11-07
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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公开(公告)号：US20160368100A1
公开(公告)日：2016-12-22
申请号：US15251453
申请日：2016-08-30
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/402 , C03B33/09 , B23K26/04 , C03B33/02 , C03C15/00
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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公开(公告)号：US20130299452A1
公开(公告)日：2013-11-14
申请号：US13889689
申请日：2013-05-08
Applicant: CORNING INCORPORATED
Inventor： Timothy Edward Myers , Shyamala Shanmugam , Alan Thomas Stephens, II , Matthew John Towner , Kevin William Uhlig , Lu Zhang
CPC classification number: C09K13/08 , C03C15/00 , C03C15/02 , C03C2218/34
Abstract: A glass etching medium and a method for etching the surface of a glass sheet to modify surface flaw characteristics without degrading the optical quality of the sheet surface, wherein the etching medium is a thickened aqueous acidic fluoride-containing paste comprising at least one dissolved, water-soluble, high-molecular-weight poly (ethylene oxide) polymer thickener.
Abstract translation: 一种玻璃蚀刻介质和用于蚀刻玻璃板表面以改善表面缺陷特性而不降低片材表面的光学质量的方法，其中所述蚀刻介质是包含至少一种溶解的水的增稠含水性含酸性氟化物浆料 高分子量聚（环氧乙烷）聚合物增稠剂。
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公开(公告)号：US11148225B2
公开(公告)日：2021-10-19
申请号：US16183065
申请日：2018-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/38 , C03B33/09 , C03C15/00 , B23K26/06 , B23K26/04 , C03B33/02 , B32B17/06 , B23K26/0622 , B23K26/53 , B23K26/402 , C03C17/00 , B23K26/55 , C09K13/00 , B32B17/10 , B23K103/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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公开(公告)号：US10144093B2
公开(公告)日：2018-12-04
申请号：US15251453
申请日：2016-08-30
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/402 , C03B33/09 , B23K26/04 , C03B33/02 , C03C15/00 , B32B17/06 , C03C17/00 , B23K26/00 , B23K26/06 , B23K26/38 , B23K26/0622 , C09K13/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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Patent Agency Ranking
公开(公告)号：US20190084090A1
公开(公告)日：2019-03-21
申请号：US16183065
申请日：2018-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/38 , C03B33/09 , C03C15/00 , B23K26/06 , B23K26/04 , C03B33/02 , B32B17/06 , B23K26/0622 , B23K26/53 , B23K26/402 , C03C17/00 , B23K26/55 , B23K103/00 , C09K13/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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7.发明授权Method for rapid laser drilling of holes in glass and products made therefrom 有权用于在玻璃中快速激光钻孔和由其制成的产品的方法公开(公告)号：US09517963B2
公开(公告)日：2016-12-13
申请号：US14535754
申请日：2014-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B32B3/24 , C03B33/09 , C03C15/00 , B32B17/06 , C03C17/00 , B23K26/06 , B23K26/38 , C03B33/02 , B23K26/00
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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公开(公告)号：US09488857B2
公开(公告)日：2016-11-08
申请号：US14591456
申请日：2015-01-07
Applicant: Corning Incorporated
Inventor： Kody Luce Bornstein , Donald Arthur Clark , Gregory Scott Glaesemann , Gregory William Keyes , Jennifer Lynn Lyon , Richard Curwood Peterson , Shyamala Shanmugam , Christopher Clark Thompson , Krishna Hemanth Vepakomma , Kathleen Ann Wexell
IPC: G02F1/1333 , C03C15/00 , C03C17/32 , C03C27/10
CPC classification number: G02F1/133308 , C03C15/00 , C03C17/32 , C03C27/10 , C03C2218/118 , C03C2218/34 , G02F1/1333 , G02F2001/133302 , G02F2001/133325 , G02F2001/133331
Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.
Abstract translation: 公开了一种加强玻璃基板的边缘表面，特别是包含在显示面板内的玻璃基板的方法。 这些方法包括将显示面板的边缘暴露于酸溶液一段时间，并且有效地从边缘表面除去不超过约20微米的玻璃的温度，从边缘冲洗酸溶液并施加经冲洗的聚合物保护涂层 边缘以保持边缘表面的后蚀刻强度。 可能暴露于酸溶液的显示面板上的电子元件在蚀刻之前用终端掩模掩蔽。 边缘蚀刻可以与显示面板/覆盖玻璃基板的表面的蚀刻结合。
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公开(公告)号：US20150198838A1
公开(公告)日：2015-07-16
申请号：US14591456
申请日：2015-01-07
Applicant: Corning Incorporated
Inventor： Kody Luce Bornstein , Donald Arthur Clark , Gregory Scott Glaesemann , Gregory William Keyes , Jennifer Lynn Lyon , Richard Curwood Peterson , Shyamala Shanmugam , Christopher Clark Thompson , Krishna Hemanth Vepakomma , Kathleen Ann Wexell
IPC: G02F1/1333 , C03C27/10 , C03C17/32 , C03C15/00
CPC classification number: G02F1/133308 , C03C15/00 , C03C17/32 , C03C27/10 , C03C2218/118 , C03C2218/34 , G02F1/1333 , G02F2001/133302 , G02F2001/133325 , G02F2001/133331
Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.
Abstract translation: 公开了一种加强玻璃基板的边缘表面，特别是包含在显示面板内的玻璃基板的方法。 这些方法包括将显示面板的边缘暴露于酸溶液一段时间，并且有效地从边缘表面除去不超过约20微米的玻璃的温度，从边缘冲洗酸溶液并施加经冲洗的聚合物保护涂层 边缘以保持边缘表面的后蚀刻强度。 可能暴露于酸溶液的显示面板上的电子元件在蚀刻之前用终端掩模掩蔽。 边缘蚀刻可以与显示面板/覆盖玻璃基板的表面的蚀刻结合。
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公开(公告)号：US10293436B2
公开(公告)日：2019-05-21
申请号：US14535800
申请日：2014-11-07
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Sergio Tsuda , Robert Stephen Wagner
IPC: B23K26/04 , B23K26/06 , B23K26/38 , B23K26/53 , B23K26/55 , B32B17/06 , C03B33/02 , C03B33/09 , C03C15/00 , C03C17/00 , B23K26/384 , B23K26/402 , B23K26/0622 , C09K13/00 , B23K103/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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