利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

51 条记录 (耗时 0.025 秒)

    Light emitting device and method for fabricating the same
    31.
    发明授权
    Light emitting device and method for fabricating the same 有权
    发光元件及其制造方法

    公开(公告)号：US08299477B2

    公开(公告)日：2012-10-30

    申请号：US12738051

    申请日：2008-10-13

    申请人： Geun Ho Kim ,  Yong Seon Song ,  Yu Ho Won

    发明人： Geun Ho Kim ,  Yong Seon Song ,  Yu Ho Won

    IPC分类号： H01L29/18

    CPC分类号： H01L27/156 ,  H01L33/0079 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/24

    摘要： A light emitting device that includes a conductive substrate, an insulating layer on the conductive substrate, a plurality of light emitting device cells on the insulating layer, a connection layer electrically interconnecting the light emitting device cells, a first contact section electrically connecting the conductive substrate with at least one light emitting device cell, and a second contact section on the at least one light emitting device cell.

    摘要翻译： 一种发光器件，包括导电衬底，导电衬底上的绝缘层，绝缘层上的多个发光器件单元，电连接发光器件单元的连接层，电连接导电衬底的第一接触部分 至少一个发光器件单元，以及在该至少一个发光器件单元上的第二接触部。

    Light emitting device
    32.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08247829B2

    公开(公告)日：2012-08-21

    申请号：US12567155

    申请日：2009-09-25

    申请人： Geun Ho Kim

    发明人： Geun Ho Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Provided is a light emitting device. The light emitting device comprises a body, a light emitting diode on the body, a resistor integrated on the body and configured to sense a temperature of the light emitting diode, and a plurality of metal layers on the body.

    摘要翻译： 提供了一种发光装置。 发光器件包括主体，主体上的发光二极管，集成在主体上并被配置为感测发光二极管的温度的电阻器，以及身体上的多个金属层。

    Light Emitting Device Package, Method Of Manufacturing The Same, And Lighting System
    33.
    发明申请
    Light Emitting Device Package, Method Of Manufacturing The Same, And Lighting System 有权
    发光装置封装，制造方法及照明系统

    公开(公告)号：US20110186872A1

    公开(公告)日：2011-08-04

    申请号：US13019657

    申请日：2011-02-02

    申请人： Geun Ho Kim

    发明人： Geun Ho Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

    摘要： The light emitting device package includes a light emitting structure including a first conductive semiconductor layer, an active layer partially formed under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer, an insulating layer disposed on lateral surfaces of the active layer and the second conductive semiconductor layer, an electrode disposed under the first conductive semiconductor layer and electrically insulated from the active layer and the second conductive semiconductor layer by the insulating layer, and a metallic support layer disposed under the second conductive semiconductor layer, the insulating layer, and the electrode and including a first conductive region electrically connected to the electrode, a second conductive region electrically connected to the second conductive semiconductor layer, and an insulating region disposed between the first and second conductive regions and insulating the first conductive region from the second conductive region.

    摘要翻译： 发光器件封装包括发光结构，其包括第一导电半导体层，部分地形成在第一导电半导体层下面的有源层和在有源层下面的第二导电半导体层，设置在有源层的侧表面上的绝缘层 层和第二导电半导体层，设置在第一导电半导体层下方并通过绝缘层与有源层和第二导电半导体层电绝缘的电极和设置在第二导电半导体层下面的金属支撑层，绝缘体 电极和电极，并且包括电连接到电极的第一导电区域，电连接到第二导电半导体层的第二导电区域和设置在第一和第二导电区域之间并绝缘第一导电区域的绝缘区域 从第二导电区域开始。

    LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME
    36.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号：US20100219432A1

    公开(公告)日：2010-09-02

    申请号：US12738051

    申请日：2008-10-13

    申请人： Geun Ho Kim ,  Yong Seon Song ,  Yu Ho Won

    发明人： Geun Ho Kim ,  Yong Seon Song ,  Yu Ho Won

    IPC分类号： H01L33/08 ,  H01L33/00

    CPC分类号： H01L27/156 ,  H01L33/0079 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/24

    摘要： Disclosed is a light emitting device. The light emitting device comprises a conductive substrate, an insulating layer on the conductive substrate, a plurality of light emitting device cells on the insulating layer, a connection layer electrically interconnecting the light emitting device cells, a first contact section electrically connecting the conductive substrate with at least one light emitting device cell, and a second contact section on the at least one light emitting device cell.

    摘要翻译： 公开了一种发光器件。 发光器件包括导电衬底，导电衬底上的绝缘层，绝缘层上的多个发光器件单元，电连接发光器件单元的连接层，将导电衬底与 至少一个发光器件单元，以及在所述至少一个发光器件单元上的第二接触部。

    Light emitting device package and method for manufacturing the same
    37.
    发明申请
    Light emitting device package and method for manufacturing the same 有权
    发光器件封装及其制造方法

    公开(公告)号：US20080149962A1

    公开(公告)日：2008-06-26

    申请号：US11706251

    申请日：2007-02-15

    申请人： Geun Ho Kim ,  Seung Yeob Lee ,  Yu Ho Won

    发明人： Geun Ho Kim ,  Seung Yeob Lee ,  Yu Ho Won

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L23/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, and a method for manufacturing the same are disclosed. The method includes forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.

    摘要翻译： 公开了能够实现发光效率提高和耐热性降低的发光器件封装及其制造方法。 该方法包括在第一基板中形成安装孔，在第二基板中形成通孔，在通孔中形成金属膜，在第二基板的上表面和下表面上形成至少一对金属层，使金属 层与金属膜电连接，将第一衬底接合到第二衬底，并且在安装孔中安装至少一个发光器件，使得发光器件电连接到形成在第二衬底的上表面上的金属层 第二基板。

    Light emitting device package and lighting system
    39.
    发明授权
    Light emitting device package and lighting system 有权
    发光装置封装和照明系统

    公开(公告)号：US08791495B2

    公开(公告)日：2014-07-29

    申请号：US12984369

    申请日：2011-01-04

    申请人： Geun Ho Kim

    发明人： Geun Ho Kim

    IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/56

    CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： Disclosed is a light emitting device package. The light emitting device package includes a body; first and second electrode layers on the body; a light emitting device electrically connected to the first and second electrode layers on the body; a luminescent layer on the light emitting device; and an encapsulant layer including particles on the luminescent layer, wherein an effective refractive index of the encapsulant layer has a deviation of 10% or less with respect to an effective refractive index of the luminescent layer.

    摘要翻译： 公开了一种发光器件封装。 发光器件封装包括主体; 身体上的第一和第二电极层; 电连接到主体上的第一和第二电极层的发光器件; 发光装置上的发光层; 以及包含所述发光层上的粒子的密封剂层，其中，所述密封层的有效折射率相对于所述发光层的有效折射率偏离10％以下。