Method to Manufacture Multi-Layer Electrical Article
    38.
    发明申请
    Method to Manufacture Multi-Layer Electrical Article 审中-公开
    多层电气制造方法

    公开(公告)号:US20160052183A1

    公开(公告)日:2016-02-25

    申请号:US14782435

    申请日:2014-03-18

    Abstract: A process for making a multilayered article, the process comprising the steps of: (A) Providing a mold comprising: (1) A mold housing comprising (a) at least one injection port, and (b) defining a mold cavity within which are positioned two deformable, pre-molded polymeric sheets; and (2) A removable, hollow core equipped with at least one vent, the removable, hollow core positioned between and space apart from the two polymeric sheets; (B) injecting under high pressure a viscous, crosslinkable, thermoplastic polymer into the mold cavity between the two polymeric sheets and around the removable core, (C) Drawing a vacuum on the mold cavity through both the vent in the mold housing and the vent in the removable, hollow core before, during and/or after the polymer has been injected into the mold; (D) Forming a less than fully cured multilayered article in the mold cavity; and (E) Removing the less than fully cured multilayer article from the mold cavity.

    Abstract translation: 一种制造多层制品的方法,所述方法包括以下步骤:(A)提供模具,其包括:(1)模具外壳,其包含(a)至少一个注射口,和(b)限定模腔, 定位两个可变形的预成型聚合物片; 和(2)可拆卸的中空芯,其配备有至少一个通风口,所述可移除的空心芯位于两个聚合物片之间并且与两个聚合物片材间隔开; (B)在高压下将粘性的可交联的热塑性聚合物注入到两个聚合物片之间的模腔内并且在可移除的芯部周围;(C)通过模具外壳中的排气口和通风口在模腔上抽真空 在聚合物已经注入模具之前,之中和/或之后的可移除的中空芯中; (D)在模腔中形成少于完全固化的多层制品; 和(E)从模腔中去除少于完全固化的多层制品。

    Electronic device module comprising an ethylene multi-block copolymer
    39.
    发明授权
    Electronic device module comprising an ethylene multi-block copolymer 有权
    包括乙烯多嵌段共聚物的电子器件模块

    公开(公告)号:US09169340B2

    公开(公告)日:2015-10-27

    申请号:US13667722

    申请日:2012-11-02

    Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

    Abstract translation: 电子设备模块包括:A.至少一个电子设备,例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料,聚合物材料包含乙烯多嵌段共聚物。 通常,聚烯烃材料是密度小于约0.90克/立方厘米(g / cc)的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件,或者它可以层压到器件的一个表面。 任选地,聚合物材料还可以包含焦烧抑制剂,并且该共聚物可以保持未交联或可以交联。

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