摘要:
A device for adsorbing water vapor from a gas stream. The device can be incorporated with an enclosure or garment in such a manner so as to enable water vapor to be adsorbed, thereby decreasing the relative humidity in the micrlimate surrounding the user. The water adsorption device is light-weight, has a high mass and volumetric energy capacity. A desiccant material is included within the water adsorption device to adsorb water vapor and a phase-change material is located in thermal communication with the desiccant to increase the loading capacity of the desiccant and maintain a cool gas stream by extracting the heat of adsorption from the desiccant.
摘要:
A continuous process for the conversion of sodium silicate to silicic acid, wherein a moving bed of a protonated ion exchange resin is contacted with an inlet stream of sodium silicate to provide an outlet stream of silicic acid. The outlet stream of silicic acid produced thereby can be processed into a variety of silica products. The outlet moving bed of spent sodium-enriched ion-exchange resin is continuously regenerated into protonated ion-exchange resin by contacting the spent resin with an inlet stream of acid of sufficient strength to exchange the sodium ions in the spent resin with a proton. The regenerated protonated ion-exchange resin is continuously recycled back into the sodium silicate stream for further production of silicic acid.
摘要:
Vacuum insulation panels and methods for making vacuum insulation panels. The panels include first and second spaced-apart sidewalls, where at least one of the sidewalls has a very smooth surface. The panels are particularly useful as insulation in applications where a smooth and aesthetically acceptable surface is required, such as in a refrigeration appliance. A method for making a vacuum insulation panel can include placing an insulative core material and a liner within a barrier envelope defining an enclosure, evacuating the enclosure, and sealing the envelope to form the vacuum insulation panel.
摘要:
A nanoporous dielectric film useful for the production of semiconductor devices, integrated circuits and the like, is provided, together with processes for producing these improved films. The films are produced by a process that includes (a) preparing a silicon-based, precursor composition including a porogen, (b) coating a substrate with the silicon-based precursor to form a film, (c) aging or condensing the film in the presence of water, (d) heating the gelled film at a temperature and for a duration effective to remove substantially all of said porogen, and wherein the applied precursor composition is substantially aged or condensed in the presence of water in liquid or vapor form, without the application of external heat or exposure to external catalyst.
摘要:
Processes for producing gel compositions comprising: esterifying a portion of the surface of a gel composition sufficient to produce a gel composition having a rod density of less than or equal to 0.15 g/cc, and/or a tap density of less than or equal to 0.2 g/cc through contact with at least one esterification agent and at least one catalyst. The processes may be utilized to produce low density gel compositions without the need for a supercritical drying step or thermal treatment.
摘要:
This pertains generally to precursors and deposition methods suited to aerogel thin film fabrication of nanoporous dielectrics. A method of forming a nanoporous dielectric on a semiconductor substrate is disclosed. By a method according to the present invention, a precursor sol is applied as a nongelling thin film 14 to a semiconductor substrate 10. This substrate may contain patterned conductors 12, gaps 13, and/or other structures. A portion of the solvent is evaporated from the thin film 14 to produce a reduced thickness film 18. Film 18 is gelled and may be aged. A surface modification agent is introduced to the reaction atmosphere in a vaporish form, e.g., a vapor, mist, aerosol, or similar form. The surface modifier can then diffuse into, condense onto, and/or settle onto the wet gel and then diffuse throughout the thin film. This vaporish introduction of the surface modification agent ensures that there are no strong fluid flows across the wafer that might damage the wet gel. It can also be compatible with standard processing equipment and can potentially be used with other reaction atmosphere controls that reduce premature drying of the gel.
摘要:
A process for producing surface modified metal oxide and/or organo-metal oxide compositions comprising esterifying at least a portion of the metal oxide and/or organo-metal oxide composition through contact with at least one esterification agent and at least one catalyst wherein the esterification agent and the catalyst are in the liquid phase. The process may be utilized to produce hydrophobic metal oxide and/or organo-metal oxide compositions at ambient temperature and/or ambient pressure conditions.
摘要:
This invention provides a process for making a semiconductor device with reduced capacitance between adjacent conductors. This process can include applying and gelling one or more solutions between and over conductors 24 and drying the wet gel to create at least porous dielectric sublayers 28 and 29. By varying the composition of the solutions, gelling conditions, drying temperature, composition of the solvents in the wet gel, or a combination of these approaches, the porosity of the sublayers may be tailored individually. A non-porous dielectric layer 30 may be formed over porous layer 28, which may complete an interlayer dielectric. A novel process for creating the porous dielectric layer is disclosed, which can be completed at vacuum or ambient pressures, yet results in porosity, pore size, and shrinkage of the dielectric during drying comparable to that previously attainable only by drying gels at supercritical pressure.
摘要:
This invention provides an improved porous structure for semiconductor devices and a process for making the same. This process may be applied to an existing porous structure 28, which may be deposited, for sample, between patterned conductors 24. The process may include baking the structure in a reducing atmosphere, preferably a forming gas, to dehydroxylate the pore surfaces. The process may include baking the structure in a halogen-containing atmosphere to bond halogens to the pore surfaces. It has been found that a porous structure treated in such a manner generally exhibits improved dielectric properties relative to an untreated sample.
摘要:
A silica-alumina composition characterized by having an essentially closed pore surface as measurable by low surface area consisting essentially of a range of alumina by weight therein of from about 40% to about 50% and the remainder by weight, silica, the surface area of said composition being substantially less in magnitude than that for silica-alumina compositions having a percentage by weight of alumina essentially outside of said range, and further characterized by having a skeletal density for percentages of alumina by weight within a portion of said range substantially less than the skeletal density of silica-alumina compositions having a percentage by weight of alumina substantially outside said portion of said range.