公开(公告)号：US12033847B2

公开(公告)日：2024-07-09

申请号：US17294212

申请日：2019-10-31

Applicant: EBARA CORPORATION

Inventor： Toshio Mizuno ,  Yosuke Himori ,  Erina Baba ,  Tomoatsu Ishibashi ,  Itsuki Kobata

IPC: B24B9/06 ,  B24B37/34 ,  B24B41/06 ,  H01L21/02 ,  H01L21/304 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/02087 ,  B24B9/065 ,  B24B37/345 ,  B24B41/06 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67706 ,  H01L21/68764

Abstract: To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.

公开(公告)号：US11980998B2

公开(公告)日：2024-05-14

申请号：US16796903

申请日：2020-02-20

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Takashi Yamazaki ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC: B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/14 ,  B24D13/20

CPC classification number: B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/147 ,  B24D13/20

Abstract: An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.

公开(公告)号：US20220375775A1

公开(公告)日：2022-11-24

申请号：US17881508

申请日：2022-08-04

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Keita Yagi ,  Katsuhide Watanabe ,  Yoichi Shiokawa ,  Toru Maruyama ,  Nobuyuki Takahashi

IPC: H01L21/677 ,  H01L21/3105 ,  H01L21/67 ,  H01L21/311 ,  H01L21/306 ,  H01L21/321 ,  H01L21/3213 ,  B24B37/04 ,  H01L21/66 ,  B24B37/20 ,  H01L21/683

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

公开(公告)号：US20210308823A1

公开(公告)日：2021-10-07

申请号：US17206652

申请日：2021-03-19

Applicant: EBARA CORPORATION

Inventor： Katsuhide Watanabe ,  Itsuki Kobata

IPC: B24B37/10 ,  B24B37/32 ,  B24B37/013 ,  B24B49/04

Abstract: A polishing head system capable of precisely controlling a pressing force of a retainer member, such as a retainer ring, against a polishing pad. The polishing head system includes: a polishing head including an actuator configured to apply a pressing force to the workpiece, a retainer member arranged outside the actuator, and piezoelectric elements coupled to the retainer member; and a drive-voltage application device configured to apply voltages independently to the piezoelectric elements.

公开(公告)号：US20200294847A1

公开(公告)日：2020-09-17

申请号：US16814560

申请日：2020-03-10

Applicant: EBARA CORPORATION

Inventor： Atsuo Katagiri ,  Itsuki Kobata

IPC: H01L21/768 ,  H01L21/3105 ,  H01L21/321

Abstract: Planarization is performed on heterogeneous films with high accuracy. According to one embodiment, a method for processing a substrate is provided. The substrate is formed of an insulating film layer where a groove is formed, a barrier metal layer, and a wiring metal layer in order from a bottom in at least a part of a region. The method includes (3) while the wiring metal layer, the barrier metal layer, and the insulating film layer are exposed to the surface of the substrate: a step of bringing the surface of the substrate into contact with a catalyst; a step of supplying a process liquid between the catalyst and the surface of the substrate; and a step of flowing a current between the catalyst and the surface of the substrate.