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    Monolithic integration device and micro total analysis system comprising a micro-fluidic flow channel
    32.
    发明授权
    Monolithic integration device and micro total analysis system comprising a micro-fluidic flow channel 有权

    公开(公告)号：US10712260B2

    公开(公告)日：2020-07-14

    申请号：US16078197

    申请日：2016-06-02

    Applicant: GOERTEK INC.

    Inventor： Quanbo Zou

    IPC: G01N21/25 ,  G01N21/05 ,  G01N21/64 ,  G01N21/03 ,  G01N21/77

    Abstract: The present invention discloses a monolithic integration device and micro Total Analysis System. The monolithic integration device for sensing comprises: a micro-LED; an optical detector; and a sensing channel, wherein the micro-LED is coupled with the sensing channel and is configured for emitting light into the sensing channel, and the optical detector is coupled with the sensing channel and is configured for sensing the light which is emitted by the micro-LED and travels through at least one part of the sensing channel. An embodiment of this invention proposes a new monolithic integration device for sensing with built-in light source and optical detection system.

    Micro-LED transfer method and manufacturing method
    33.
    发明授权
    Micro-LED transfer method and manufacturing method 有权

    公开(公告)号：US10566494B2

    公开(公告)日：2020-02-18

    申请号：US16064917

    申请日：2015-12-23

    Applicant: Goertek Inc.

    Inventor： Quanbo Zou

    IPC: H01L21/67 ,  H01L33/00 ,  H01L25/075 ,  H01L21/683 ,  H01L23/00 ,  H01L33/48

    Abstract: A micro-LED transfer method and a manufacturing method are disclosed. The micro-LED transfer method comprises: coating a sacrificial layer on a carrier substrate, wherein micro-LEDs are bonded on the carrier substrate through a first bonding layer (S1100); patterning the sacrificial layer to expose micro-LEDs to be picked up (S1200); bonding the micro-LEDs to be picked up with a pickup substrate through a second bonding layer (S1300); removing the sacrificial layer by undercutting (S1400); lifting-off the micro-LEDs to be picked up from the carrier substrate (S1500); bonding the micro-LEDs on the pickup substrate with a receiving substrate through a third bonding layer (S1600); and lifting-off the micro-LEDs from the pickup substrate (S1700).

    LASER PROJECTION DEVICE AND LASER PROJECTION SYSTEM
    34.
    发明申请
    LASER PROJECTION DEVICE AND LASER PROJECTION SYSTEM 审中-公开

    公开(公告)号：US20200014892A1

    公开(公告)日：2020-01-09

    申请号：US16491120

    申请日：2017-03-07

    Applicant: GOERTEK INC.

    Inventor： Zhe Wang ,  Xiaoyang Zhang ,  Quanbo Zou

    IPC: H04N9/31 ,  G02B26/10 ,  G02B26/08

    Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device comprises an optical fiber scanner and a MEMS scanning mirror; an optical fiber is disposed on the optical fiber scanner and the optical fiber is used to deliver laser beams needed by projection; the optical fiber scanner drives the optical fiber to scan in a first plane and enables the laser beam to project to the MEMS scanning mirror; and the MEMS scanning mirror makes scanning movement about a first axis and reflects the laser beam to a predetermined area to form a projection image; wherein the first axis is located in the first plane, or the first axis is parallel to the first plane. The present disclosure achieves laser projection by enabling the optical fiber scanner and the MEMS scanning mirror to scan simultaneously in different directions.

    Assembling method, manufacturing method, device and electronic apparatus of flip-die
    37.
    发明授权
    Assembling method, manufacturing method, device and electronic apparatus of flip-die 有权

    公开(公告)号：US10224307B2

    公开(公告)日：2019-03-05

    申请号：US15531243

    申请日：2015-07-14

    Applicant: Goertek, Inc.

    Inventor： Quanbo Zou ,  Zhe Wang

    IPC: H01L33/62 ,  H01L23/00 ,  H01L21/50 ,  H01L21/66 ,  H01L25/075 ,  H01L21/683

    Abstract: The present invention discloses a assembling method, a manufacturing method, an device and an electronic apparatus of flip-die. The method for assembling a flip-die, comprises: temporarily bonding the flip-die onto a laser-transparent first substrate, wherein bumps of the flip-die are located on the side of the flip-die opposite to the first substrate; aligning the bumps with pads on a receiving substrate; irradiating the original substrate with laser from the first substrate side to lift-off the flip-die from the first substrate; and attaching the flip-die on the receiving substrate. A faster assembly rate can be achieved by using the present invention. A smaller chip size can be achieved by using the present invention. A lower profile can be achieved by using the present invention.

    MEMS device and electronic apparatus
    40.
    发明授权
    MEMS device and electronic apparatus 有权

    公开(公告)号：US11262376B2

    公开(公告)日：2022-03-01

    申请号：US16078213

    申请日：2016-06-02

    Applicant: GOERTEK INC.

    Inventor： Quanbo Zou

    IPC: G01P3/36 ,  G01P15/093 ,  B81B5/00 ,  B81C1/00

    Abstract: The present invention discloses a MEMS device and electronic apparatus. The MEMS device comprises: a micro-LED; and a movable member, wherein the micro-LED is mounted on the movable member and is configured for moving with the movable member. According to an embodiment of this invention, the signal detection of a MEMS device can be simplified and/or the contents of signals produced by the MEMS device can be enriched.

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