摘要:
A highly crystalline aluminum nitride multi-layered substrate comprising a single-crystal α-alumina substrate, an aluminum oxynitride layer and a highly crystalline aluminum nitride film as the outermost layer which are formed in the mentioned order, wherein the aluminum oxynitride layer has a threading dislocation density of 6.3×107/cm2 or less and a crystal orientation expressed by the half-value width of its rocking curve of 4,320 arcsec or less; and a production process thereof.
摘要翻译:包含按照上述顺序形成的单晶α-氧化铝基板,氮氧化铝层和高结晶氮化铝膜作为最外层的高结晶氮化铝多层基板,其中,氮氧化铝层具有螺纹 位错密度为6.3×10 7 / cm 2以下,由其摇摆曲线的半值宽度表示的晶体取向为4,320arcsec以下; 及其制造方法。
摘要:
A semiconductor test circuit includes an input terminal, a controller, a setting circuit, a command generator, a transmission path switching circuit and a comparator. The input terminal receives a serial data including a command code and a control data. The controller receives a control signal and outputs an internal control signal based on the control signal. The setting circuit receives the serial data and outputs it in response to the internal control signal. The command generator generates an interface signal based on the serial data received from the setting circuit. The switching circuit has ports, receives the signal from one of the ports and outputs the received signal to another one of the ports in response to the internal control signal and the command code. The comparator compares the interface signal received from the command generator with the signal received from the switching circuit.
摘要:
A single crystalline aluminum nitride laminated substrate comprising a single crystalline α-Al2O3 substrate such as a sapphire substrate, an aluminum oxynitride layer formed on the substrate and a single crystalline aluminum nitride film as the outermost layer, wherein the dislocation density in the single crystalline aluminum nitride is 108/cm2 or less.The above single crystalline aluminum nitride laminated substrate is formed by nitriding the substrate by heating in the presence of carbon, nitrogen and carbon monoxide.The above single crystalline aluminum nitride film has a law dislocation density, little lattice mismatching and excellent crystallinity. A Group III element nitride film having excellent luminous efficiency can be formed on this aluminum nitride film. The above laminated substrate is used in a base substrate for a Group III element nitride film, a light emitting device and a surface acoustic wave device.
摘要翻译:包括单晶α-Al 2 O 3 N 3衬底的单晶氮化铝层压衬底,例如蓝宝石衬底,形成在衬底上的氧氮化铝层和单晶 氮化铝膜作为最外层,其中单晶氮化铝中的位错密度为10 8 / cm 2以下。 上述单晶氮化铝层压基板是通过在碳,氮和一氧化碳的存在下加热氮化基板而形成的。 上述单晶氮化铝膜具有定位密度,晶格不匹配和结晶度极好的特点。 可以在该氮化铝膜上形成具有优异发光效率的III族元素氮化物膜。 上述层叠基板用于III族元素氮化物膜的基底基板,发光元件和弹性表面波元件。
摘要:
A highly crystalline aluminum nitride multi-layered substrate comprising a single-crystal α-alumina substrate, an aluminum oxynitride layer and a highly crystalline aluminum nitride film as the outermost layer which are formed in the mentioned order, wherein the aluminum oxynitride layer has a threading dislocation density of 6.3×107/cm2 or less and a crystal orientation expressed by the half-value width of its rocking curve of 4,320 arcsec or less; and a production process thereof.
摘要翻译:包含按照上述顺序形成的单晶α-氧化铝基板,氮氧化铝层和高结晶氮化铝膜作为最外层的高结晶氮化铝多层基板,其中,氮氧化铝层具有螺纹 位错密度为6.3×10 7 / cm 2以下,由其摇摆曲线的半值宽度表示的晶体取向为4,320arcsec以下; 及其制造方法。
摘要:
A single crystalline aluminum nitride laminated substrate comprising a single crystalline &agr;-Al2O3 substrate such as a sapphire substrate, an aluminum oxynitride layer formed on the substrate and a single crystalline aluminum nitride film as the outermost layer, wherein the dislocation density in the single crystalline aluminum nitride is 108/cm2 or less. The above single crystalline aluminum nitride laminated substrate is formed by nitriding the substrate by heating in the presence of carbon, nitrogen and carbon monoxide. The above single crystalline aluminum nitride film has a law dislocation density, little lattice mismatching and excellent crystallinity. A Group III element nitride film having excellent luminous efficiency can be formed on this aluminum nitride film. The above laminated substrate is used in a base substrate for a Group III element nitride film, a light emitting device and a surface acoustic wave device.
摘要翻译:包括单晶Al-Al 2 O 3衬底(例如蓝宝石衬底),形成在衬底上的氧氮化铝层和单晶氮化铝膜作为最外层的单晶氮化铝层压衬底,其中单晶铝中的位错密度 氮化物为10 8 / cm 2以下。上述单晶氮化铝层叠基板通过在碳,氮和一氧化碳的存在下加热氮化基板而形成。上述单晶氮化铝膜具有 法位错密度小,晶格不匹配,结晶性好。 可以在该氮化铝膜上形成具有优异发光效率的III族元素氮化物膜。 上述层叠基板用于III族元素氮化物膜的基底基板,发光元件和弹性表面波元件。
摘要:
An interface circuit controls access to a dynamic random-access memory having multiple banks, each bank having multiple rows of memory cells, according to received address signals. The address signals are decoded in such a way that when access to a consecutive series of addresses crosses from a first row to a second row, these two rows are always disposed in separate banks. The second row is activated during access to the first row, and the first row is precharged during access to the second row, enabling access to proceed without interruption across the row boundary. In particular, burst access can proceed from row to row continuously.
摘要:
A clock feeding circuit for an integrated circuit includes logic circuit regions, a clock signal source, an input buffer connected to the source, and delay adjusting circuits. Each logic circuit region has a plurality of logic circuits, a buffer circuit for receiving the clock signal and providing it to the logic circuits, and interconnections wiring the logic circuits to the buffer circuit such that clock skew is minimized in the region. The adjusting circuits are disposed between the buffer and the respective logic circuit regions. Each adjusting circuit is composed of a plurality of delay elements, the number of which is pre-selected to determine the delay of the clock signal passing through it. A method for designing the integrated circuit includes (a) creating a schematic representation of the integrated circuit, (b) determining a layout and interconnections of each region, by which the clock skew in the regions is minimized among the logic circuits of each region, including simulating transmission of a clock signal from the clock source to each region to determine delays times of the clock signal from the clock source to the logic circuits; and (c) determining adjustments to the delay circuits which provide a minimum difference among time delays for the clock signal to reach one logic circuit in each region.