摘要:
There is provided a particle-enhanced immunoassay method for cystatin C in a human body fluid, which has higher specificity and is easily automatable at low cost as compared with conventional assay methods that use large amounts of polyclonal antibodies having low specificity or monoclonal antibodies having high specificity but having poor agglutinability.Disclosed is an assay method specific to cystatin C in a human body fluid, which is a particle-enhanced immunoassay method utilizes a combination of antibody-coated particles in which some insoluble carrier particles are coated with anti-human cystatin C monoclonal antibodies of one type which have high affinity and in which some other insoluble carrier particles are coated with anti-human cystatin C monoclonal antibodies of one type which recognize an epitope different from that of the monoclonal antibody of the first-mentioned type and which have relatively low affinity, wherein the binding amount of the anti-human cystatin C monoclonal antibodies relative to the total weight of the particles being coated with the corresponding antibodies is less than 5% by weight.
摘要:
A semiconductor device including a first material layer adjacent to a second material layer, a first via passing through the first material layer and extending into the second material layer, and a second via extending into the first material layer, where along a common cross section parallel to an interface between the two material layers, the first via has a cross section larger than that of the second via.
摘要:
Provided are an agglutination-inhibition assay and a reagent for agglutination-inhibition assay, which can be used for measuring a ligand in a sample at high sensitivity in a wide range from the low-concentration range to the high-concentration range and have good reproducibility of measurement. Specifically, provided are an agglutination-inhibition assay and a reagent for agglutination-inhibition assay, in which used are an insoluble carrier particle carrying a ligand, a specific receptor in the free-form and an insoluble carrier particle carrying a specific receptor which binds to a different site on the ligand than the receptor in the free-form.
摘要:
A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.
摘要:
A golf club head according to this invention includes a hollow head body, cylindrical body, weight member, and fixing member. The hollow head body has a projection formed along the periphery of the sole, a recess formed inside the projection, and an opening formed in the projection so as to extend from the toe side to the back side. The cylindrical body is provided in the recess of the head body, and includes its one end which engages with the inner wall of the projection on the heel side, and its other end which extends to the vicinity of the opening and can move along the opening. The weight member is retractably, detachably inserted in the cylindrical body. The fixing member is a detachable member which fixes the other end of the cylindrical body onto the projection.
摘要:
A focal plane shutter includes: a shutter substrate having an opening; a blade for opening and closing the opening; a drive member swingably supported for driving the blade; a drive spring for driving the drive member; and an adjustment mechanism for adjusting an urging force of the drive spring. One end of the drive spring is engaged with the drive member. The adjustment mechanism includes: an adjustment member engaging the other end of the drive spring and rotatably supported to adjust the urging force of the drive spring; and an engagement member abutting the adjustment member to stop rotation of the adjustment member. The adjustment member has a clearance portion for avoiding abutment against the engagement member at a given rotational position.
摘要:
Disclosed herein is a semiconductor device having a vertical MOS transistor having a channel of a first conductivity type and formed by burying a gate electrode in a semiconductor substrate, a planar MOS transistor having a channel of the first conductivity and having a gate electrode formed on the semiconductor substrate, and a planar MOS transistor having a channel of a second conductivity and having a gate electrode formed on the semiconductor substrate, the semiconductor device, including other circuit element(s), other than a transistor, formed either below or above the vertical MOS transistor having the channel of the first conductivity type.
摘要:
A solid-state imaging device includes a plurality of pixels, each of which includes a photoelectric converter section formed on a first substrate to generate and accumulate signal charges corresponding to incident light, a charge accumulation capacitor section formed on the first substrate or a second substrate to temporarily hold the signal charges transferred from the photoelectric converter section, and a plurality of MOS transistors formed on the second substrate to transfer the signal charges accumulated in the charge accumulation capacitor section, connection electrodes formed on the first substrate, and connection electrodes formed on the second substrate and electrically connected to the connection electrodes formed on the first substrate.
摘要:
A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
摘要:
In an anomaly monitoring device, in which an output signal from an encoder is input as an analog input signal via a wiring system, for detecting anomalies in the encoder or the wiring system, provided are a voltage level based device, a pulse number based device and a pulse width based device. The voltage level based device detects anomalies when the voltage level of the analog input signal exists within a prescribed range. The pulse number based device detects anomalies when the difference in the numbers of pulses of digital signals corresponding to the analog input signals is equal to or greater than a prescribed threshold value. The pulse width based device detects anomalies when the pulse width of the digital signals, measured from a combined signal of the digital signals or each of the digital signals, is different from the pulse width in a past control period.