Abstract:
In a dielectric resonator, through holes are formed between opposing two surfaces of a dielectric block, an outer conductor is provided on an outer peripheral surface of the dielectric block, and a plurality of inner conductors are formed on the inner surfaces of the through holes, isolated by non-conducting portions where the inner conductor is not provided. Near the open end of the inner conductor of the resonator hole, a non-conducting portion is formed by partially removing the inner conductor in the axial direction, at a position opposing to an adjacent through hole, or a position near the outer conductor, so as to increase odd mode or even mode characteristic impedance near the open end, whereby inductive coupling is adjustable.
Abstract:
A method of manufacturing a dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.
Abstract:
In a dielectric block, resonator holes have steps thereby providing a portion having a larger inner diameter and a portion having a smaller inner diameter, and the smaller inner diameter portion of each resonator hole is formed on the side of a short-circuited end surface. By forming the small inner diameter portions of the resonator holes relatively close to each other, the coupling between the two resonators becomes inductive coupling. By contrast, when small inner diameter portions are formed further apart from each other, the coupling between the two resonators becomes capacitive coupling. The coupling strength can be changed by adjusting the distance between the small inner diameter portions.
Abstract:
A dielectric resonator apparatus comprising a plurality of dielectric coaxial resonators has a dielectric block with first and second surfaces and a plurality of side surfaces located therebetween, and a plurality of cylindrical resonator holes are formed in parallel to each other so as to penetrate the dielectric block, each of the resonator holes having an opening at the first surface and another opening at the second surface. Further, an outer conductor is formed on the first and second surfaces and a plurality of side surfaces, and a plurality of inner conductors is formed on the plurality of resonator holes, respectively. Then a plurality of extending conductors is formed in the vicinity of the openings of the plurality of resonator holes, respectively, so as to extend from the outer conductor to the plurality of resonator holes and to form gaps between the plurality of extending conductors and the inner conductors, each of the inner conductors having open-circuit ends in the vicinity of both the openings of the resonator holes, thereby constituting a plurality of dielectric coaxial resonators. Furthermore, a pair of input and output electrodes is formed on the side surfaces so as to be electrically insulated from the outer conductor.
Abstract:
A semiconductor laser includes a first conductivity type semiconductor substrate; a double-heterojunction structure including a first conductivity type cladding layer, an active layer, and a second conductivity type cladding layer successively disposed on the semiconductor substrate; two parallel stripe grooves forming the double-heterojunction structure in a mesa shape; a first conductivity type mesa embedding layer, a second conductivity type current blocking layer, and a first conductivity type current blocking layer successively disposed on the semiconductor substrate and contacting opposite sides of the mesa; and impurity doped regions formed by adding an impurity through the surface of the first conductivity type current blocking layer. The impurity doped regions electrically separate an upper part of the mesa from the second conductivity type current blocking layer at opposite sides of the mesa. Since the second conductivity type current blocking layer is not in contact with the mesa structure, no leakage current path is formed in the laser structure.
Abstract:
A method of manufacturing a semiconductor laser includes sequentially forming a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on top of one another on a semiconductor substrate; forming a ridge in the second conductivity type semiconductor layer; forming a first insulating film on the second conductivity type semiconductor layer at a first temperature; forming a second insulating film on the first insulating film at a second temperature, lower than the first temperature; and forming an electrode on the second insulating film.
Abstract:
A semiconductor device has a two-dimensional slab photonic crystal structure in which a substrate supports a sheet-like slab layer including, sequentially stacked, a lower cladding layer, an active layer, and an upper cladding layer. A periodic refractive index profile structure, in surfaces of the stacked layers, introduces a linear defect region that serves as a waveguide. A p-type region and an n-type region in the slab layer define a pn junction surface at a predetermined angle with respect to the surfaces of the stacked layers in the slab layer.
Abstract:
A semiconductor device has a two-dimensional slab photonic crystal structure in which a substrate supports a sheet-like slab layer including, sequentially stacked, a lower cladding layer, an active layer, and an upper cladding layer. A periodic refractive index profile structure, in surfaces of the stacked layers, introduces a linear defect region that serves as a waveguide. A p-type region and an n-type region in the slab layer define a pn junction surface at a predetermined angle with respect to the surfaces of the stacked layers in the slab layer.
Abstract:
An optical waveguide ridge has a side with a flat portion extending uniformly from a top of the ridge to a surface of a semiconductor substrate, the flat portion being in contact with an exposed surface of the substrate. A p-type electrode extends from the top of the optical waveguide ridge downward in contact with a dielectric film on the flat portion of the optical waveguide ridge. The p-type electrode further extends over the dielectric film onto the exposed surface of the semiconductor substrate where an end of the electrode is a bonding pad.
Abstract:
A method of adjusting characteristics of a dielectric filter including the following steps: forming a dielectric filter having a dielectric body, the dielectric body having an outer surface; forming an external conductor on the outer surface of the dielectric body; and forming at least one hole extending through the dielectric body, the at least one hole having a respective inner surface, and a respective internal conductor and a respective non-conductive portion at the inner surface; the outer surface of the dielectric body comprising first and second end surfaces and a side surface extending between the first and second end surfaces; the at least one hole extending through the dielectric body between the first and second end surfaces; the respective inner conductor being formed as a respective pair of internal conductors conductively connected to the external conductor at respective ends of the at least one hole, the respective non-conductive portion at the inner surface of the at least one hole being spaced from both end surfaces, thereby separating the corresponding pair of internal conductors and defining a respective capacitance between the corresponding pair of internal conductors; and a predetermined portion of the outer surface of the dielectric body being formed with a shape such that a first portion of the external conductor at the predetermined portion of the outer surface is closer to at least one of the internal conductors in the at least one hole as compared with a second portion of the external conductor at a portion of the outer surface of the dielectric body other than the predetermined portion; the method further comprising the steps of: initially forming the respective inner conductor over an entire length of the inner surface of the corresponding hole; and thereafter grinding off a portion of the respective inner conductor with a grinding tool in order to form the non-conductive portion.