公开(公告)号：US20190334227A1

公开(公告)日：2019-10-31

申请号：US16344717

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Telesphor KAMGAING

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/02 ,  H04W88/08

Abstract: Embodiments of the invention include a base station that includes a central transceiver unit (CTU) having a plurality of transceiver cores and a substrate. A printed circuit board (PCB) supports the substrate and at least one antenna unit is coupled to the PCB with at least one of a cable and a waveguide. The at least one antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190288382A1

公开(公告)日：2019-09-19

申请号：US16464678

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS

IPC: H01Q1/38 ,  H01Q21/22 ,  H01Q21/00 ,  H01Q1/24

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190036004A1

公开(公告)日：2019-01-31

申请号：US16071992

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Valluri R. RAO ,  Baris BICEN

IPC: H01L41/113 ,  H01L41/047 ,  H01L41/253 ,  H01L41/29 ,  H01L41/316 ,  H01L41/332 ,  H01L41/317 ,  H01L27/20 ,  G01L1/16

Abstract: Embodiments of the invention include a piezoelectric sensor system. According to an embodiment of the invention, the piezoelectric sensor system may include a piezoelectric sensor, a signal conditioning circuit, and a light source each formed on an organic or flexible substrate. In embodiments of the invention, the piezoelectric sensor may be a discrete component or the piezo electric sensor may be integrated into the substrate. According to an embodiment, a piezoelectric sensor that is integrated into the substrate may comprise, a cavity formed into the organic substrate and a moveable beam formed over the cavity and anchored to the organic substrate. Additionally, the piezoelectric sensor may include a piezoelectric region formed over an end portion of the moveable beam and extending at least partially over the cavity. The piezoelectric sensor may also include a top electrode formed over a top surface of the piezoelectric region.

公开(公告)号：US20190006298A1

公开(公告)日：2019-01-03

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Brandon M. RAWLINGS ,  Feras EID

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

公开(公告)号：US20180212322A1

公开(公告)日：2018-07-26

申请号：US15745681

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS

IPC: H01Q1/52 ,  H01Q1/22

CPC classification number: H01Q1/521 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/525 ,  H01Q21/28

Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.

公开(公告)号：US20180097693A1

公开(公告)日：2018-04-05

申请号：US15283129

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H04L12/24 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187 ,  A61B5/0205 ,  A61B5/00

CPC classification number: H04L41/0816 ,  A61B5/02055 ,  A61B5/021 ,  A61B5/02405 ,  A61B5/08 ,  A61B5/145 ,  A61B5/4266 ,  A61B5/4824 ,  A61B5/7282 ,  A61B5/7285 ,  A61B2560/0462 ,  H01H57/00 ,  H01L41/0471 ,  H01L41/187 ,  H01L41/1873 ,  H01L41/1876 ,  H04L41/0886

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US20200066663A1

公开(公告)日：2020-02-27

申请号：US16465132

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Sasha N. OSTER

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52

Abstract: Embodiments of the invention include a microelectronic device that includes a first ultra thin substrate formed of organic dielectric material and conductive layers, a first mold material to integrate first radio frequency (RF) components with the first substrate, and a second ultra thin substrate being coupled to the first ultra thin substrate. The second ultra thin substrate formed of organic dielectric material and conductive layers. A second mold material integrates second radio frequency (RF) components with the second substrate.

公开(公告)号：US20190259622A1

公开(公告)日：2019-08-22

申请号：US16399703

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Sasha N. OSTER ,  Fay HUA ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Henning BRAUNISCH ,  Johanna M. SWAN

IPC: H01L21/285 ,  B82Y40/00 ,  H01L21/768 ,  H01L21/4763 ,  H01L21/033 ,  H01L25/16 ,  H05K1/16 ,  H05K3/28 ,  H01L23/66

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US20190165250A1

公开(公告)日：2019-05-30

申请号：US16097600

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Thomas L. SOUNART ,  Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: H01L41/09 ,  H01L41/113 ,  B81B3/00 ,  G01L9/00

Abstract: Embodiments of the invention include a pressure sensing device having a membrane that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material positioned in proximity to the membrane, and an electrode in contact with the piezoelectric material. The membrane deflects in response to a change in ambient pressure and this deflection causes a voltage to be generated in the piezoelectric material with this voltage being proportional to the change in ambient pressure.

公开(公告)号：US20190121038A1

公开(公告)日：2019-04-25

申请号：US16098406

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Johanna M. SWAN ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Feras EID ,  Baris BICEN ,  Thomas L. SOUNART ,  Shawna M. LIFF ,  Valluri R. RAO

IPC: G02B6/42

Abstract: Embodiments of the invention include an optoelectronic package that allows for in situ alignment of optical fibers. In an embodiment, the optoelectronic package may include an organic substrate. Embodiments include a cavity formed into the organic substrate. Additionally, the optoelectronic package may include an actuator formed on the organic substrate that extends over the cavity. In one embodiment, the actuator may include a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer. According to an additional embodiment of the invention, the actuator may include a first portion and a second portion. In order to allow for resistive heating and actuation driven by thermal expansion, a cross-sectional area of the first portion of the beam may be greater than a cross-sectional area of the second portion of the beam.