Abstract:
Settings are provided by a chassis management controller to an expansion card in a multi-slot server chassis. The chassis management controller in a multi-slot server chassis provides an operating parameter to a server management controller in a server, and the server management controller writes the operating parameter to a port expander of an expansion card installed on the server. The operating parameter is written to the port expander prior to expansion card power up, and the expansion card uses the operating parameter after power up to derive one or more SERDES value. The SERDES value is used to program an ASIC chip comprising a SERDES converter on the expansion card. In one example, the operating parameter is determined by the capabilities of a chassis midplane at the slot where the compute node is installed.
Abstract:
A multijunction solar cell including a first solar subcell having a first band gap and a first short-circuit current; a second solar subcell disposed over the first solar subcell and having a second band gap greater than the first band gap and a second short-circuit current greater than the first short-circuit current by an amount in the range of 2% to 6%; a third solar subcell disposed over the second solar subcell and having a third band gap greater than the second band gap and a third short-circuit current less than the first short-circuit current by an amount in the range of 2% to 6%; and a fourth solar subcell disposed over the third solar subcell having a fourth band gap greater than the third band gap, and a fourth short-circuit current less than the third short-circuit current by an amount in the range of 6% to 10%, so that at an “end of life” state of the multijunction solar cell in an AM0 space environment the short-circuit current of each of the subcells are substantially identical.
Abstract:
A photovoltaic solar cell for producing energy from the sun including a germanium substrate including a first photoactive junction and forming a bottom solar subcell; a gallium arsenide middle cell disposed on said substrate; an indium gallium phosphide top cell disposed over the middle cell; and a surface grid including a plurality of spaced apart grid lines, wherein the grid lines have a thickness greater than 7 microns, and each grid line has a cross-section in the shape of a trapezoid with a cross-sectional area between 45 and 55 square microns.
Abstract:
Tuning a switching power supply, the power supply including a switching transistor; a filter circuit; a pulse generator that drives the switching transistor; a programmable filter connected to the output of the filter circuit; a digital signal processor (‘DSP’) connected to the output of the filter circuit, the DSP configured to program the programmable filter; and a tuning control circuit connected to the output of the filter circuit, to the pulse generator, and to the DSP; including calculating by the DSP, from sampled voltage values of a tuning pulse driven through the filter circuit by the pulse generator, the actual impedance of the filter circuit; and programming, by the DSP, the programmable filter, setting the combined impedance of the filter circuit and the programmable filter to the design impedance of the filter circuit.
Abstract:
A system and method for implementing a bus. In one embodiment, the system includes a bus switch operative to couple to a bus, and a plurality of trace segments coupled to the bus switch, where the trace segments have different lengths. The bus switch is operative to connect one of the trace segments to the bus based on at least one system requirement, and the selected trace segment cancels signal reflections on the bus.
Abstract:
Printed circuit boards for countering signal distortion are disclosed that include: a conductive pathway on a printed circuit board between a transmitter and a receiver, the conductive pathway comprised of traces and vias connected together for conductive transfer of a signal from the transmitter to the receiver; a parasitic element on the printed circuit board, the parasitic element having a parasitic effect that distorts the signal; and one or more passive elements mounted adjacent to the conductive pathway without connecting to the conductive pathway, the passive elements having a corrective effect to reduce the distortion from the parasitic effect on the signal.
Abstract:
A multi-memory module circuit topology is disclosed that includes a memory controller, a plurality of memory modules connected to the memory controller through a memory bus, and a resonator connected to the plurality of memory modules in a starburst topology. A method for reducing impedance discontinuities in a multi-memory module circuit is disclosed that includes providing a plurality of memory modules connected to a memory controller through a memory bus, selecting a starburst topology, and connecting a resonator to the plurality of memory module in dependence upon the selected starburst topology. An additional method for reducing impedance discontinuities in a multi-memory module circuit is disclosed that includes providing by a resonator a predetermined discontinuity reducing impedance at a predetermined location in the multi-memory module circuit between at least two memory modules, the multi-memory module circuit having a plurality of components of logically arranged around the predetermined location.
Abstract:
An electronic system includes a circuit board formed from a composite material. The composite material includes fibers embedded within a substrate and the fibers are oriented substantially orthogonal to one another. A plurality of traces are formed on the board, and the plurality of traces are oriented relative to at least one of the fibers at an angle between about 17.5° and about 27.5° or between about 20.0° and about 25.0°. A pair of the traces are oriented substantially orthogonal to one another, and a pair of the traces are oriented relative to one another at an angle of about 45.0°. The fibers are fiberglass, and the substrate is an epoxy resin. The fibers have a different dielectric constant than the substrate.
Abstract:
Method and computer program product for using an RFID antenna of a cooking appliance to read a plurality of cooking instruction sets from a single RFID tag associated with a food product that is positioned to be cooked by the cooking appliance. The cooking appliance selects one of the plurality of cooking instruction sets that the cooking appliance is capable of performing. Furthermore, the cooking appliance may then automatically cook the food product by controlling the cooking appliance according to the selected cooking instruction set. The selection of a cooking instruction set may consider the temperature of the food product or a determination whether the food product is frozen. Alternatively, cooking appliance settings may be interpolated between two cooking instruction sets or calculated on the basis of physical property information about the food product.
Abstract:
A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.