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公开(公告)号:US11594285B2
公开(公告)日:2023-02-28
申请号:US17481892
申请日:2021-09-22
Applicant: Kioxia Corporation
Inventor: Takeshi Hioka , Tsukasa Kobayashi , Koji Kato , Yuki Shimizu , Hiroshi Maejima
IPC: G11C16/26 , G11C16/24 , G11C16/08 , H01L27/11568 , G11C16/10 , H01L27/11582 , G11C16/30
Abstract: According to one embodiment, a semiconductor memory device includes first and second memory cells; a first word line connected to the first and second memory cells; a first bit line connected to the first memory cell; a second bit line connected to the second memory cell; a first sense amplifier connected to the first bit line; a second sense amplifier connected to the second bit line; a voltage generation circuit; and a first row decoder which supplies a voltage to the first word line.
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公开(公告)号:US20220301615A1
公开(公告)日:2022-09-22
申请号:US17472361
申请日:2021-09-10
Applicant: Kioxia Corporation
Inventor: Hiroshi Maejima
IPC: G11C11/4091 , G11C11/4094 , G11C11/408 , G11C11/4074 , G11C5/06
Abstract: According to one embodiment, a semiconductor memory device includes a first bit line extending in a first direction and coupled to a first memory cell, a first pad coupled to the first bit line, a first sense amplifier coupled to the first pad, a second bit line being adjacent to the first bit line and extending in the first direction and coupled to a second memory cell, a second pad coupled to the second bit line, and a second sense amplifier coupled to the second pad. The first and second sense amplifiers are adjacent to each other and are arranged in a second direction intersecting the first direction. The first and second pads are adjacent to each other and are arranged in a third direction intersecting the first direction and the second direction.
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公开(公告)号:US12230327B2
公开(公告)日:2025-02-18
申请号:US18524458
申请日:2023-11-30
Applicant: Kioxia Corporation
Inventor: Hiroshi Maejima
Abstract: A semiconductor memory device includes a memory cell array having memory strings that include memory cells and first and second selection transistors. During a read operation, a controller applies a first voltage higher than ground to a source line, and a second voltage to a first and second selection gate lines that are connected to a selected memory string. The second voltage is also applied to the first selection gate lines connected to non-selected memory strings during a first period of the read operation. A third voltage higher than ground and lower than the second voltage is applied to the first selection gate lines connected to non-selected memory strings during a second period of the read operation subsequent to the first period.
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公开(公告)号:US12211544B2
公开(公告)日:2025-01-28
申请号:US18239140
申请日:2023-08-29
Applicant: Kioxia Corporation
Inventor: Hiroshi Maejima
IPC: G11C7/12 , G11C5/06 , G11C11/4074 , G11C11/408 , G11C11/4091 , G11C11/4094 , G11C16/04 , G11C16/24 , G11C16/26 , G11C7/18 , H10B43/10
Abstract: A memory device includes a first memory cell provided above a substrate; a first bit line coupled to the first memory cell and extending in a first direction; a first sense amplifier configured to sense a voltage of the first bit line; a second memory cell provided above the substrate; a second bit line adjacent to the first bit line and extending in the first direction, the second bit line being coupled to the second memory cell; a second sense amplifier configured to sense a voltage of the second bit line; and a third memory cell provided above the substrate. A third bit line not adjacent to the second bit line extends in the first direction, and is coupled to the third memory cell; and a third sense amplifier is configured to sense a voltage of the third bit line. The first and second sense amplifiers belong to a first sense amplifier group, are adjacent to each other and are arranged in a second direction intersecting the first direction. The third sense amplifier belongs to a second sense amplifier group. The first and second sense amplifier groups are adjacent to each other and are arranged in the first direction.
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公开(公告)号:US12183400B2
公开(公告)日:2024-12-31
申请号:US18340977
申请日:2023-06-26
Applicant: Kioxia Corporation
Inventor: Hiroshi Maejima
Abstract: A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block.
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公开(公告)号:US11942153B2
公开(公告)日:2024-03-26
申请号:US17552225
申请日:2021-12-15
Applicant: Kioxia Corporation
Inventor: Hiroshi Maejima
Abstract: According to one embodiment, a semiconductor memory device includes a first string unit including a first memory string including a first selection transistor and a first memory cell coupled to the first selection transistor, a second string unit including a second memory string including a second selection transistor and a second memory cell coupled to the second selection transistor, a first select gate line, a second select gate line, a first bit line, a second bit line, and a first word line. Both of the first select gate line and the second select gate line are selected in a first read operation. The first select gate line is selected and the second select gate line is not selected in a second read operation.
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公开(公告)号:US11756946B2
公开(公告)日:2023-09-12
申请号:US17847528
申请日:2022-06-23
Applicant: KIOXIA CORPORATION
Inventor: Tomoya Sanuki , Toshio Fujisawa , Hiroshi Maejima , Takashi Maeda
CPC classification number: H01L25/18 , G06F3/0604 , G06F3/0659 , G06F3/0679 , G11C16/10 , G11C16/26 , G11C16/30 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , G11C16/0483 , H01L2224/13016 , H01L2224/16057 , H01L2224/16145 , H01L2224/48106 , H01L2224/48145 , H01L2224/73207
Abstract: A semiconductor storage device includes a plurality of memory chips and a circuit chip. The plurality of memory chips and the circuit chip are stacked on each other. Each of the plurality of memory chips has a memory cell array that includes a plurality of memory cells. The circuit chip includes a data latch configured to store page data for writing or reading data into or from the memory cell array of each of the memory chips.
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公开(公告)号:US11756623B2
公开(公告)日:2023-09-12
申请号:US17565241
申请日:2021-12-29
Applicant: KIOXIA CORPORATION
Inventor: Hiroshi Maejima
IPC: G11C11/34 , G11C16/04 , G11C5/06 , G11C7/06 , H10B43/10 , H10B43/27 , H10B43/35 , H10B43/40 , G11C16/26 , G11C16/08 , H01L23/522 , H01L23/528
CPC classification number: G11C16/0483 , G11C5/063 , G11C7/06 , G11C16/08 , G11C16/26 , H01L23/528 , H01L23/5226 , H10B43/10 , H10B43/27 , H10B43/35 , H10B43/40
Abstract: A semiconductor storage device includes word lines extending in first and second directions, and separated from each other in a third direction, sense amplifier circuits that partially overlap the word lines in the third direction, memory strings intersecting the word lines and extending in the third direction, memory-side bit lines extending in the first direction, separated from each other in the second direction, and including first and second adjacent memory-side bit lines, circuit-side bit lines between the word lines and the sense amplifier circuits and partially overlapping the respective memory-side bit lines in the third direction, and contact plugs extending in the third direction and respectively connecting the memory-side bit lines and the circuit-side bit lines. The contact plugs include first and second contract plugs that are electrically connected to the first and second memory-side bit lines, respectively, and are not aligned along the first or second direction.
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公开(公告)号:US11417642B2
公开(公告)日:2022-08-16
申请号:US17006378
申请日:2020-08-28
Applicant: KIOXIA CORPORATION
Inventor: Tomoya Sanuki , Toshio Fujisawa , Hiroshi Maejima , Takashi Maeda
Abstract: A semiconductor storage device includes a plurality of memory chips and a circuit chip. The plurality of memory chips and the circuit chip are stacked on each other. Each of the plurality of memory chips has a memory cell array that includes a plurality of memory cells. The circuit chip includes a data latch configured to store page data for writing or reading data into or from the memory cell array of each of the memory chips.
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公开(公告)号:US11264106B2
公开(公告)日:2022-03-01
申请号:US17016580
申请日:2020-09-10
Applicant: Kioxia Corporation
Inventor: Hiroshi Maejima , Hidehiro Shiga , Masaki Kondo
IPC: G11C16/06 , G11C16/26 , H01L27/11556 , G11C16/04 , G11C16/34 , H01L27/11582 , G11C16/10
Abstract: A semiconductor memory device includes separate first and second word lines respectively facing first and second portions of a semiconductor and sandwiching the semiconductor; and first and second cell transistors respectively located in the first and second portions and respectively coupled to the first and second word lines. In a first operation, a first read is executed on the second cell transistor while a first voltage and a higher second voltage are being respectively applied to the first and second word lines. In a second operation, a second read is executed on the first cell transistor while a third voltage between the first and second voltages is being applied to the second word line.
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