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公开(公告)号:US12211551B2
公开(公告)日:2025-01-28
申请号:US18177704
申请日:2023-03-02
Applicant: Kioxia Corporation
Inventor: Natsuki Sakaguchi , Takashi Maeda , Rieko Funatsuki , Hidehiro Shiga
Abstract: A control circuit of a semiconductor memory device performs a write operation on a memory cell transistor of the semiconductor memory device by performing a first pulse application operation of lowering a threshold voltage of the memory cell transistor, a precharge operation, and then a second pulse application operation. In the precharge operation, in a state in which first and second select transistors connected to the memory cell transistor are turned on, a bit line connected to the memory cell transistor is charged by applying a ground voltage to a word line connected to a gate of the memory cell transistor and applying a voltage higher than the ground voltage to a source line. In the second pulse application operation, in a state in which the first select transistor is turned on and the second select transistor is turned off, a program voltage is applied to the word line.
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公开(公告)号:US12159040B2
公开(公告)日:2024-12-03
申请号:US17899974
申请日:2022-08-31
Applicant: KIOXIA CORPORATION
Inventor: Rieko Funatsuki , Takashi Maeda , Sumiko Domae , Kazutaka Ikegami
IPC: G06F3/06
Abstract: A semiconductor memory device includes a semiconductor pillar including first and second memory cells electrically connected in series and formed on opposite sides of the semiconductor pillar, first word lines connected to the first memory cells, respectively, and second word lines connected to the second memory cells, respectively. A verify operation includes a channel clean operation for supplying a reference voltage to a semiconductor channel shared by the first and second memory cells followed by at least first and second sense operation for determining whether a threshold voltage of a target memory cell has reached first and second threshold voltage states, respectively, then a second channel clean operation for supplying the reference voltage to the semiconductor channel, and then at least a third sense operation for determining whether the threshold voltage of the target memory cell has reached a third threshold voltage state.
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公开(公告)号:US11967371B2
公开(公告)日:2024-04-23
申请号:US17806346
申请日:2022-06-10
Applicant: Kioxia Corporation
Inventor: Rieko Funatsuki , Takashi Maeda , Hidehiro Shiga
CPC classification number: G11C11/5642 , G11C11/5628 , G11C11/5671 , G11C16/0483 , G11C16/08 , G11C16/10 , G11C16/26 , G11C16/3459
Abstract: A semiconductor memory device includes i first word lines connected to the i first memory cells, i second word lines connected to the i second memory cells, a driver capable of supplying voltage to each of the i first word lines and each of the i second word lines, and a logic control circuit controlling both a write operation including a verify operation and a read operation including a verify operation. In the semiconductor memory device, when an order of performing a sense operation for determining whether or not a threshold voltage of the k-th first memory cell has reached a j-th threshold voltage in the verify operation is different from that of in the read operation, a voltage applied to the k-th first word line in the verify operation is different from a voltage applied to the k-th first word line in the read operation.
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公开(公告)号:US11929352B2
公开(公告)日:2024-03-12
申请号:US17984959
申请日:2022-11-10
Applicant: KIOXIA CORPORATION
Inventor: Hiroshi Maejima , Toshifumi Hashimoto , Takashi Maeda , Masumi Saitoh , Tetsuaki Utsumi
IPC: H01L25/065 , H01L23/00 , H01L25/18
CPC classification number: H01L25/0657 , H01L24/08 , H01L25/18 , H01L2224/08145 , H01L2225/06524 , H01L2924/1431 , H01L2924/14511
Abstract: A semiconductor memory device includes a memory chip. The memory chip includes a first region including a plurality of first memory cells and second memory cells, a second region different from the first region, a plurality of first word lines stacked apart from each other in a first direction in the first and second regions, a first pillar including a first semiconductor layer extending through the first word lines, and a first insulator layer provided between the first semiconductor layer and the first word lines, in the first region, the first memory cells being located at intersections of the first pillar with the first word lines, a first bonding pad in the second region, and a first transistor between the first word lines and the first bonding pad, and connected between one of the first word lines and the first bonding pad, in the second region.
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公开(公告)号:US12211557B2
公开(公告)日:2025-01-28
申请号:US18176507
申请日:2023-03-01
Applicant: Kioxia Corporation
Inventor: Kyosuke Sano , Kazutaka Ikegami , Takashi Maeda
Abstract: A semiconductor memory device includes a first memory pillar and a sequencer. The first memory pillar is sandwiched between a first word line and a second word line, sandwiched between a third word line and a fourth word line, sandwiched between a fifth word line and a sixth word line, includes a first memory cell facing the first word line, a second memory cell facing the second word line, a third memory cell facing the third word line, a fourth memory cell facing the fourth word line, a fifth memory cell facing the fifth word line and a sixth memory cell facing the sixth word line. The sequencer executes an erase operation on the first to sixth memory cells to enable execution of a primary write operation for the first memory cell and a primary write operation for the second memory cell at different timings.
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公开(公告)号:US11967833B2
公开(公告)日:2024-04-23
申请号:US18104349
申请日:2023-02-01
Applicant: Kioxia Corporation
Inventor: Takashi Maeda
IPC: G11C16/04 , G11C16/08 , G11C16/10 , G11C16/14 , G11C16/16 , G11C16/26 , H02J50/12 , H10B43/27 , H10B43/35 , G11C5/14 , G11C16/30
CPC classification number: H02J50/12 , G11C16/0483 , G11C16/08 , G11C16/10 , G11C16/14 , G11C16/16 , G11C16/26 , H10B43/27 , H10B43/35 , G11C5/145 , G11C16/30 , H02J2310/48
Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.
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公开(公告)号:US11769554B2
公开(公告)日:2023-09-26
申请号:US17447464
申请日:2021-09-13
Applicant: Kioxia Corporation
Inventor: Kyosuke Sano , Kazutaka Ikegami , Takashi Maeda , Rieko Funatsuki
CPC classification number: G11C16/26 , G11C16/0483 , G11C16/30 , H10B41/10 , H10B41/27 , H10B43/10 , H10B43/27
Abstract: A semiconductor memory device of embodiments includes: a substrate; a memory pillar; first to sixth conductive layers provided above the substrate; first to sixth memory cells formed between the first to sixth conductive layers and the memory pillar, respectively; and a control circuit. The control circuit applies a first voltage to the first, second, a sixth conductive layer and applies a second voltage to the third, fifth conductive layer, then applies a third voltage to the first conductive layer, applies a fourth voltage to the sixth conductive layer, and applies a fifth voltage to the second conductive layer, and then applies a sixth voltage to the first conductive layer, applies a seventh voltage to the sixth conductive layer, and applies an eighth voltage lower than the fifth voltage to the second conductive layer.
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公开(公告)号:US11574663B2
公开(公告)日:2023-02-07
申请号:US17109853
申请日:2020-12-02
Applicant: Kioxia Corporation
Inventor: Keisuke Nakatsuka , Tomoya Sanuki , Takashi Maeda , Go Shikata , Hideaki Aochi
IPC: G11C7/10 , G11C7/08 , H01L27/11573 , G11C16/26 , H01L27/11529 , G11C7/18
Abstract: A data latch circuit includes a first n-channel transistor and a first p-channel transistor. A gate of the first n-channel transistor and a gate of the first p-channel transistor are a common gate.
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公开(公告)号:US11411016B2
公开(公告)日:2022-08-09
申请号:US17005535
申请日:2020-08-28
Applicant: KIOXIA CORPORATION
Inventor: Tomoya Sanuki , Keisuke Nakatsuka , Hiroshi Maejima , Kenichiro Yoshii , Takashi Maeda , Hideo Wada
IPC: H01L27/11565 , H01L25/18 , H01L25/00 , H01L23/00 , H01L27/11578 , H01L27/11575 , H01L27/1157 , H01L27/11563 , H01L27/11568
Abstract: A semiconductor memory device includes a first chip and a second chip overlaid on the first chip. The second chip includes a memory cell array provided between a second semiconductor substrate and the first chip in a first direction, and first and second wires between the memory cell array and the first chip. The memory cell array includes three or more stacked bodies regularly arranged in a second direction perpendicular to the first direction and semiconductor layers extending in the stacked bodies in the first direction. Each of the stacked bodies includes gate electrodes stacked in the first direction. The first and second wires are aligned in the second direction with a gap therebetween.
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公开(公告)号:US11282578B2
公开(公告)日:2022-03-22
申请号:US16906140
申请日:2020-06-19
Applicant: Kioxia Corporation
Inventor: Rieko Funatsuki , Takahiko Hara , Takashi Maeda
IPC: G11C16/26 , G11C16/04 , H01L27/115
Abstract: A semiconductor storage apparatus includes a memory cell array including a plurality of memory string structures each including a pair of memory string formation sections each formed by a channel formation film and a charge storage film and including a select gate transistor and a plurality of memory cell transistors connected in series and a partial conductive layer configured to electrically connect the memory string formation sections. During a reading operation of a memory cell transistor, at least one of the plurality of memory cell transistors and the select gate transistor belonging to the memory string formation section is turned off such that a channel of a memory cell transistor is fixed to a potential of a source line or a potential of bit lines.
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