公开(公告)号：US07499451B2

公开(公告)日：2009-03-03

申请号：US11134822

申请日：2005-05-20

申请人： Kazuhiro Suzuki

发明人： Kazuhiro Suzuki

IPC分类号： H04L12/28

CPC分类号： H04L67/08 ,  H04L29/12254 ,  H04L61/2038 ,  H04L67/1002

摘要： A cluster system 1 for providing a plurality of virtual computer nodes to a client 5 has real nodes 3a, 3b and 3c for executing an application, and a coordinator node 2 for assigning the real IP address that is the IP address of the real node with the IP address of the virtual computer node, and the real nodes 3a, 3b and 3c and the coordinator node 2 store the IP management table of a corresponding table of the virtual IP address and the real IP address, and perform communication using the virtual IP address based on the IP management table.

摘要翻译： 用于向客户端5提供多个虚拟计算机节点的集群系统1具有用于执行应用的实际节点3a，3b和3c，以及用于将作为真实节点的IP地址的真实IP地址分配给的协调器节点2， 虚拟计算机节点的IP地址，真实节点3a，3b，3c和协调器节点2存储虚拟IP地址和真实IP地址的对应表的IP管理表，并使用虚拟IP进行通信 基于IP管理表的地址。

公开(公告)号：US20090050988A1

公开(公告)日：2009-02-26

申请号：US12195587

申请日：2008-08-21

申请人： Kazuhiro Suzuki ,  Michihiko Nishigaki ,  Yutaka Onozuka ,  Hiroshi Yamada ,  Kazuhiko Itaya ,  Hideyuki Funaki

发明人： Kazuhiro Suzuki ,  Michihiko Nishigaki ,  Yutaka Onozuka ,  Hiroshi Yamada ,  Kazuhiko Itaya ,  Hideyuki Funaki

IPC分类号： H01L29/84 ,  H01L21/00

CPC分类号： B81C1/00269 ,  B81C2203/0145

摘要： A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere.

摘要翻译： MEMS器件包括形成在半导体衬底上的MEMS单元和设置有孔并用于密封MEMS单元的盖。 孔用密封材料密封，形状为球形或半球形。

公开(公告)号：US20080258316A1

公开(公告)日：2008-10-23

申请号：US12105553

申请日：2008-04-18

申请人： Akihiro Tamba ,  Kazuhiro Suzuki ,  Koji Sasaki ,  Shinji Hiramitsu ,  Hirokazu Inoue

发明人： Akihiro Tamba ,  Kazuhiro Suzuki ,  Koji Sasaki ,  Shinji Hiramitsu ,  Hirokazu Inoue

IPC分类号： H01L23/48

CPC分类号： H01L24/48 ,  H01L23/295 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05647 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48747 ,  H01L2224/48799 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/83205

摘要： A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4±0.05 mmφ, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K.

摘要翻译： 一种功率半导体模块，其具有功率半导体芯片的表面和通过铝线连接的外部电路图案，并用环氧树脂密封，铝线的线径为0.4±0.05mmφ，线膨胀系数 模块额定温度范围内的环氧树脂为15〜20ppm / K。

公开(公告)号：US07424203B2

公开(公告)日：2008-09-09

申请号：US11074044

申请日：2005-03-07

申请人： Kazuhiro Suzuki

发明人： Kazuhiro Suzuki

IPC分类号： H04N5/91

CPC分类号： H04N5/783 ,  H04N5/765 ,  H04N5/775 ,  H04N5/85 ,  H04N9/7921 ,  H04N9/8042

摘要： In the case that the video and audio information obtained from the digital broadcast or a digital recording medium coded according to a predetermined information processing rule is digitally transmitted, the normal reproduction and special reproduction are performed reproducibly as in the case of an analog signal processing equipment. A data reproduction transmission apparatus for reproducing the video and audio information coded according to a predetermined information processing rule provided with a decoding means 2 for decoding the coded data that includes the video and audio information, a data conversion means 3 for converting the digital data obtained from the decoding means 2 to the video and audio information that is acceptable for an analog signal processing equipment, and a data restructuring means 4 for restructuring coded data or decoded digital data that includes at least the video and audio information to the coded data that is acceptable for a digital signal processing equipment.

摘要翻译： 在从数字广播获得的视频和音频信息或根据预定信息处理规则编码的数字记录介质被数字地传输的情况下，如模拟信号处理设备的情况那样，可再现地执行正常再现和特殊再现 。 一种用于再现根据设置有用于解码包括视频和音频信息的编码数据的解码装置2的预定信息处理规则编码的视频和音频信息的数据再现发送装置，用于转换所获得的数字数据的数据转换装置3 从解码装置2到模拟信号处理设备可接受的视频和音频信息，以及用于将至少包含视频和音频信息的编码数据或解码数字数据重新编码到数据的编码数据的数据重组装置4， 数字信号处理设备可接受。

公开(公告)号：US20080181353A1

公开(公告)日：2008-07-31

申请号：US11858822

申请日：2007-09-20

申请人： Masako Ogata ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Kazuhiko Itaya

发明人： Masako Ogata ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Kazuhiko Itaya

IPC分类号： G01B7/14

CPC分类号： H03K17/955 ,  G01D5/2417 ,  H03K2217/960755

摘要： A sensor device for detecting a positional relationship between a first member and a second member, includes a first charge-holding electrode provided on a surface of the first member and holding a charge, a second charge-holding electrode provided on the surface of the first member and holding a charge differing from the charge held by the first charge-holding electrode, a first charge-induced electrode provided on a surface of the second member, the first charge-induced electrode having a charge induced therein in accordance with the charge held by the first charge-holding electrode, when the first charge-holding electrode approaches the first charge-induced electrode, a second charge-induced electrode provided on the surface of the second member, the second charge-induced electrode having a charge induced therein in accordance with the charge held by the second charge-holding electrode, when the second charge-holding electrode approaches the second charge-induced electrode.

摘要翻译： 一种用于检测第一构件和第二构件之间的位置关系的传感器装置，包括设置在第一构件的表面上并保持电荷的第一电荷保持电极，设置在第一构件和第二构件的表面上的第二电荷保持电极 并且保持与第一电荷保持电极所保持的电荷不同的电荷，设置在第二部件的表面上的第一电荷感应电极，第一电荷感应电极根据电荷保持在其中诱导电荷 通过第一电荷保持电极，当第一电荷保持电极接近第一电荷感应电极时，设置在第二元件的表面上的第二电荷感应电极，其中在其中引入电荷的第二电荷感应电极 根据第二电荷保持电极保持的电荷，当第二电荷保持电极接近第二电荷感应电极时。

公开(公告)号：US07372132B2

公开(公告)日：2008-05-13

申请号：US11062867

申请日：2005-02-23

申请人： Kazuhiro Suzuki ,  Toshiaki Morita ,  Hisayuki Imamura ,  Junichi Watanabe ,  Mitsuaki Chiba

发明人： Kazuhiro Suzuki ,  Toshiaki Morita ,  Hisayuki Imamura ,  Junichi Watanabe ,  Mitsuaki Chiba

IPC分类号： H01L23/34

CPC分类号： H05K3/0061 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/488 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0215 ,  H05K2201/2036 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate 2 with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate 3a is bonded to the surface side of the silicon nitride plate 2, and a prescribed circuit pattern is formed on the copper plate 3a. Tin-silver-copper cream solder layers 4a and 4b with a thickness of 200 μm are formed at a prescribed location on the circuit pattern 3a on which a semiconductor element 6 is mounted and at a prescribed location of a base plate 1 on which the circuit board 1a is disposed. Nickel particles 5 having a maximum particle size of 100 μm and an average particle size of 70 μm are dispersed in the solder 4a on the base plate 1 of good thermal conductivity. A semiconductor element (chip) 6, the circuit board 1a, and the base plate 1 are disposed on predetermined locations. Thereafter, they are set in a reflow oven (not shown in the drawings) for reflow soldering. After the inside of the reflow oven is replaced by a nitrogen atmosphere, the reflow oven is heated to 280° C. At the time when solder is melted, the inside of the oven is decompressed to 1 Pa, nitrogen is introduced, and the reflow oven is cooled to about room temperature, thereby completing the solder bonding step. After flux is washed, an outer case 7 with an insert-molded outlet terminal 8 is adhered to the base plate 1 and a predetermined connection is conducted via an aluminum bonding wire 9. Then, silicone gel 10 is injected into a package delimited via the base plate 1 and the outer case 7, and the silicone gel 10 is heat-hardened, thereby completing a resin encapsulated semiconductor device A.

公开(公告)号：US07308205B2

公开(公告)日：2007-12-11

申请号：US10397428

申请日：2003-03-27

申请人： Shinobu Ozeki ,  Akira Toshima ,  Masao Funada ,  Kenichi Kobayashi ,  Hidenori Yamada ,  Takeshi Kamimura ,  Yoshihide Sato ,  Junji Okada ,  Takehiro Niitsu ,  Shinya Kyozuka ,  Kazuhiro Sakai ,  Kazuhiro Suzuki ,  Tomo Baba ,  Tsutomu Hamada ,  Masaru Kijima ,  Osamu Takanashi ,  Masaaki Miura ,  Osamu Ueno

发明人： Shinobu Ozeki ,  Akira Toshima ,  Masao Funada ,  Kenichi Kobayashi ,  Hidenori Yamada ,  Takeshi Kamimura ,  Yoshihide Sato ,  Junji Okada ,  Takehiro Niitsu ,  Shinya Kyozuka ,  Kazuhiro Sakai ,  Kazuhiro Suzuki ,  Tomo Baba ,  Tsutomu Hamada ,  Masaru Kijima ,  Osamu Takanashi ,  Masaaki Miura ,  Osamu Ueno

IPC分类号： H04B10/00

CPC分类号： H04B10/803

摘要： In an optical transmission apparatus in which a plurality of nodes are optically connected to one another via an optical transmission path, a light signal which is coded so that a mixture ratio of 1 and 0 constituting data is made close to 50% is transmitted through the optical transmission path. When a light signal is not emitted from all of the nodes, a dummy signal which is an AC-like signal is emitted to the optical transmission path. Therefore, an optoelectric conversion section can be always set to an active state, and the signal recognizability can be prevented from being lowered.

摘要翻译： 在通过光传输路径将多个节点彼此光学连接的光传输装置中，将构成数据的1和0的混合比例编码为接近50％的光信号通过 光传输路径。 当不从所有节点发出光信号时，将发送类似于AC的信号的虚拟信号发送到光传输路径。 因此，可以将光电转换部分总是设置为有效状态，并且可以防止信号可识别性降低。

公开(公告)号：US20060277586A1

公开(公告)日：2006-12-07

申请号：US11272691

申请日：2005-11-15

申请人： Tomo Baba ,  Kazuhiro Suzuki ,  Hisayoshi Mori ,  Kazuhiro Sakai ,  Junji Okada ,  Masao Funada ,  Shinobu Ozeki ,  Shinya Kyozuka ,  Takehiro Niitsu ,  Hidenori Yamada

发明人： Tomo Baba ,  Kazuhiro Suzuki ,  Hisayoshi Mori ,  Kazuhiro Sakai ,  Junji Okada ,  Masao Funada ,  Shinobu Ozeki ,  Shinya Kyozuka ,  Takehiro Niitsu ,  Hidenori Yamada

IPC分类号： H04N7/173

CPC分类号： G09G5/006 ,  G09G2370/04 ,  G09G2370/047

摘要： A signal communication apparatus includes a transmission component, a reception component and an identification information storage component. The transmission component is connectable to an information processing device and a signal propagation medium, and transmits an inputted image signal through the connected signal propagation medium. The reception component is connectable with an image display device and the signal propagation medium, receives the image signal transmitted from the transmission component through the connected signal propagation medium, and outputs the image signal to the connected image display device. The identification information storage component is removably attached to the transmission component, and stores identification information for identifying the image display device. The information processing device acquires the identification information from the identification information storage component connected to the connected transmission component, and outputs the image signal to the connected transmission component in accordance with at least a portion of the acquired identification information.

摘要翻译： 信号通信装置包括发送部件，接收部件和识别信息存储部件。 传输组件可连接到信息处理设备和信号传播介质，并通过连接的信号传播介质发送输入的图像信号。 接收部件可与图像显示装置和信号传播介质连接，通过连接的信号传播介质接收从传输部件发送的图像信号，并将图像信号输出到连接的图像显示装置。 识别信息存储部件可移除地附接到传输部件，并且存储用于识别图像显示装置的识别信息。 信息处理装置从连接到所连接的传输部件的识别信息存储部件获取识别信息，并且根据获取的识别信息的至少一部分将图像信号输出到连接的传输部件。

公开(公告)号：US20060217056A1

公开(公告)日：2006-09-28

申请号：US11369923

申请日：2006-03-07

申请人： Osamu Gomi ,  Hitoshi Nakao ,  Kengo Honma ,  Motoki Itoda ,  Takahiro Tanaka ,  Kazuhiro Suzuki

发明人： Osamu Gomi ,  Hitoshi Nakao ,  Kengo Honma ,  Motoki Itoda ,  Takahiro Tanaka ,  Kazuhiro Suzuki

IPC分类号： F24F3/16 ,  B01L1/04

CPC分类号： F24F3/1603 ,  B01L1/04 ,  F24F1/0071

摘要： A fan/filter unit includes a casing having formed an air outlet port on a front side thereof and an air inlet port on a rear side thereof; a fan housed in the casing so as to face the air inlet port; a filter housed in the casing so as to face the air outlet port such that the air discharged by the fan in a widthwise direction of the casing is blown forward through the filter. The fan/filter unit has a shielding plate disposed between the fan and the filter as seen in a depthwise direction of the casing so that the shielding plate shields an associated flow of air flowing in a direction from the filter to the fan.

摘要翻译： 风扇/过滤器单元包括在其前侧形成有空气出口的壳体和在其后侧的空气入口; 风扇，其容纳在所述壳体中以面对所述进气口; 过滤器，其容纳在所述壳体中以面向所述排气口，使得由所述风扇沿所述壳体的宽度方向排出的空气通过所述过滤器向前吹。 风扇/过滤器单元在壳体的深度方向上具有设置在风扇和过滤器之间的屏蔽板，使得屏蔽板屏蔽沿着从过滤器到风扇的方向流动的相关气流。

公开(公告)号：USD520838S1

公开(公告)日：2006-05-16

申请号：US29230805

申请日：2005-05-27

申请人： Masanori Okada ,  Masato Sakai ,  Yoshitaka Suzuki ,  Takeshi Taniguchi ,  Hiroshi Haga ,  Kazuhiro Suzuki

设计人： Masanori Okada ,  Masato Sakai ,  Yoshitaka Suzuki ,  Takeshi Taniguchi ,  Hiroshi Haga ,  Kazuhiro Suzuki