公开(公告)号：US06325698B1

公开(公告)日：2001-12-04

申请号：US09387553

申请日：1999-09-01

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： B24B4900

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US08655478B2

公开(公告)日：2014-02-18

申请号：US12566224

申请日：2009-09-24

申请人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

发明人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

IPC分类号： G06F19/00 ,  G05B11/01 ,  G05B19/18 ,  B24B49/00 ,  B24B1/00 ,  G01D1/00

CPC分类号： B24B53/017

摘要： A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

摘要翻译： 一种方法用抛光件与金刚石修整器连接，金刚石修整器具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布的模拟进行模拟，以及在确定的修整条件下用金刚石修整器修整抛光构件来确定修整条件。 模拟包括计算根据推入抛光构件的金刚石颗粒的深度校正的滑动距离。

公开(公告)号：USRE39262E1

公开(公告)日：2006-09-05

申请号：US09821046

申请日：2002-02-28

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B29/02

CPC分类号： B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面区域更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定投影区域的位置。

公开(公告)号：US06315643B1

公开(公告)日：2001-11-13

申请号：US09344495

申请日：1999-06-25

申请人： Hirokuni Hiyama ,  Seiyo Maekawa ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Seiyo Maekawa ,  Yutaka Wada

IPC分类号： B24B100

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A polishing apparatus including a turntable having an upper polishing surface, at least one carrier for carrying an article with a surface to be polished in such a manner that the surface is engaged with the upper polishing surface of the turntable, and at least one slurry supply nozzle provided for the carrier and adapted to supply a slurry on the polishing surface of the turntable at a predetermined slurry supply point upstream of a line connecting the center axes of the turntable and the carrier in the direction of rotation of the turntable while the turntable and the carrier are rotated around their respective center axes with the surface of the article kept in engagement with the polishing surface. The nozzle is preferably positioned such that an angle is formed between the line connecting the center axis of the turntable and the center axis of the carrier and a line connecting the center axis of the carrier and the predetermined slurry supply point is in the range of from 5 degrees to 40 degrees.

摘要翻译： 一种抛光装置，包括具有上抛光表面的转台，至少一个载体，用于承载具有待抛光表面的制品，使得该表面与转台的上抛光表面接合，以及至少一个浆料供应 喷嘴，其设置用于载体，并且适于在转台的旋转方向上连接转台和载体的中心轴线的上游的预定浆料供应点处在转台的抛光表面上提供浆料，同时转盘和 载体围绕其各自的中心轴线旋转，同时制品的表面保持与抛光表面接合。 喷嘴优选地定位成使得在连接转盘的中心轴线和载体的中心轴线的线与连接载体的中心轴线与预定浆料供应点之间形成的角度在从 5度至40度。

公开(公告)号：US5888126A

公开(公告)日：1999-03-30

申请号：US590836

申请日：1996-01-24

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面区域更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：US5882244A

公开(公告)日：1999-03-16

申请号：US967767

申请日：1997-11-10

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Tamami Takahashi

IPC分类号： B24B37/00 ,  B24B37/013 ,  B24B37/015 ,  B24B49/14 ,  B24B49/00

CPC分类号： B24B37/015 ,  B24B49/14

摘要： A polishing apparatus makes it possible to accurately detect the temperature of a workpiece during polishing and to perform polishing end point determination on the basis of this detected temperature. The polishing apparatus polishes irregularities in a surface of a workpiece such as for example a semiconductor wafer to a flat and mirror-like finish. A top ring holding a semiconductor wafer is provided with a temperature sensor. Frictional heat generated in the semiconductor wafer by polishing is detected by the temperature sensor, and a polishing end point is determined on the basis of the detected temperature.

摘要翻译： 抛光装置使得可以精确地检测抛光期间工件的温度，并且基于该检测温度进行抛光终点确定。 抛光装置将诸如半导体晶片的工件的表面中的凹凸抛光到平坦的和镜面状的光洁度。 保持半导体晶片的顶环设置有温度传感器。 由温度传感器检测在半导体晶片中通过研磨产生的摩擦热，并且基于检测到的温度来确定研磨终点。

公开(公告)号：US06752692B2

公开(公告)日：2004-06-22

申请号：US09932987

申请日：2001-08-21

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： B24B4900

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US06406364B1

公开(公告)日：2002-06-18

申请号：US09355895

申请日：1999-10-25

申请人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

发明人： Norio Kimura ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kiyotaka Kawashima ,  Manabu Tsujimura ,  Takayoshi Kawamoto

IPC分类号： B24B5700

CPC分类号： B24B37/04 ,  B24B57/02 ,  Y10S451/91

摘要： The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.

摘要翻译： 本发明的目的是提供一种抛光装置，其能够以稳定的速度供给研磨粒子尺寸不变的抛光液。 公开了一种用于将抛光溶液输送到抛光装置（22）的装置（20）。 装置（20）包括：用于输送抛光溶液的溶液通道; 和超声波振动器（72）设置在溶液通道的至少一个位置。

公开(公告)号：US5838447A

公开(公告)日：1998-11-17

申请号：US683959

申请日：1996-07-19

申请人： Hirokuni Hiyama ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： G01B11/06 ,  G01B11/30 ,  G01N21/84

CPC分类号： B24B37/205 ,  B24B49/12 ,  G01B11/0683 ,  G01B11/306

摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer while detecting a thickness or a flatness of a surface layer of the workpiece on a real-time basis. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and such workpiece against the polishing cloth. The polishing apparatus also has a thickness detector for detecting the thickness of a surface layer of the workpiece supported by the top ring while the workpiece is being polished without exposing the workpiece. The thickness detector includes a sensor mounted in the turntable and including at least one light-emitting element for emitting light toward the surface layer of the workpiece and at least one light-detecting element for detecting light reflected from the surface layer of the workpiece.

摘要翻译： 抛光装置在实时检测工件的表面层的厚度或平坦度的同时对半导体晶片等工件进行抛光。 抛光装置包括：转台，其具有安装在其上表面上的抛光布，以及设置在转盘上方的顶环，用于将抛光的工件支撑在抛光布上。 抛光装置还具有厚度检测器，用于在工件抛光而不暴露工件的同时检测由顶环支撑的工件的表面层的厚度。 厚度检测器包括安装在转盘中的传感器，并且包括用于向工件的表面层发射光的至少一个发光元件和用于检测从工件的表面层反射的光的至少一个光检测元件。

公开(公告)号：US07527723B2

公开(公告)日：2009-05-05

申请号：US11035373

申请日：2005-01-14

申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

IPC分类号： B23H7/36 ,  B23H1/10 ,  B23H3/10

CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 μm.

摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对离子交换剂的变化操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中，对工件的电解处理在不超过10um的距离保持工件不与处理电极接触而靠近处理电极的同时进行。