摘要:
In one aspect, the invention includes an apparatus having a semiconductor substrate receiving device with at least one extension configured to hold a semiconductor substrate within a liquid bath. The device is configured to have at least a portion of the extension at least periodically placed within the liquid bath. The extension includes a conductive material at least partially coated with an insulative protective material. The insulative protective material is configured to protect the portion of the conductive material which is in the bath from physically contacting the liquid of the bath. The apparatus also includes an electrode within the bath, and an electrical connection between the electrode and the conductive material of the extension. Additionally, the apparatus has a monitor configured to monitor a current flow state of a circuit that includes the electrode, conductive material of the extension, and liquid bath to determine if the circuit is in a closed state or in an open state. In another aspect, the invention includes methods for determining if a protective coating on a semiconductor substrate receiving device has been compromised.
摘要:
A silicon etching method includes providing a substrate assembly including an exposed silicon region and an exposed oxide region. An etch composition including an ammonium fluoride component, an inorganic acid component, and an oxidizing agent is also provided. The etch composition has a pH in the range of about 7.0 to about 8.0. The substrate assembly is exposed to the etch composition. Exposing the substrate assembly to the etch composition may result in etching the exposed silicon region at an etching rate that is greater than about 3 times the etching rate of the exposed oxide region and/or etching the silicon region at an etch rate greater than about 9 Å/minute. The etching method may be used in forming isolation structures. Further, etch compositions for performing the desired etch are provided.
摘要:
In one aspect, the invention includes a method of etching, comprising: a) forming a material over a substrate, the material comprising a lower portion near the substrate and an upper portion above the lower portion; b) providing a quantity of detectable atoms within the material, the detectable atoms being provided at a different concentration in the lower portion than in the upper portion; c) etching into the material and forming etching debris; and d) detecting the detectable atoms in the debris. In another aspect, the invention includes a method of etching, comprising: a) providing a semiconductor wafer substrate, the substrate having a center and an edge; b) forming a material over the substrate, the material comprising detectable atoms; c) etching into the material and forming etching debris; d) detecting the detectable atoms in the debris; and e) estimating a degree of center-to-edge uniformity of the etching from the detecting.
摘要:
The invention includes methods of forming a conductive silicide layers on silicon comprising substrates, and methods of forming conductive silicide contacts. In one implementation, a method of forming a conductive silicide layer on a silicon comprising substrate includes reacting oxygen with silicon of a silicon comprising substrate to form oxides of silicon from silicon of the substrate. The oxides of silicon include stoichiometric silicon dioxide and substoichiometric silicon dioxide. The stoichiometric silicon dioxide and substoichiometric silicon dioxide are exposed to ozone to transform at least some of the substoichiometric silicon dioxide to stoichiometric silicon dioxide. After the exposing, a conductive metal silicide is formed in electrical connection with silicon of the silicon comprising substrate. In one implementation, a method of forming a conductive silicide layer on a silicon comprising substrate includes reacting oxygen with silicon of a silicon comprising substrate to form oxides of silicon from silicon of the substrate. The oxides of silicon include stoichiometric silicon dioxide and substoichiometric silicon dioxide. The stoichiometric silicon dioxide and substoichiometric silicon dioxide are exposed to O.sub.2 plasma to transform at least some of the substoichiometric silicon dioxide to stoichiometric silicon dioxide. After the exposing, a metal is reacted with silicon of the substrate to form a conductive metal silicide.
摘要:
An analytical system-on-a-chip can be used as an analytical imaging device, for example, for detecting the presence of a chemical compound. A layer of analytical material is formed on a transparent layer overlying a solid state image sensor. The analytical material can react in known ways with at least one reactant to block light or to allow light to pass through to the array. The underlying sensor array, in turn, can process the presence, absence or amount of light into a digitized signal output. The system-on-a-chip may also include software that can detect and analyze the output signals of the device.
摘要:
A software refreshed memory device comprises a plurality of memory cells that must be periodically refreshed to avoid losing data. Preferably, the memory cells can avoid losing data even though the time interval between successive memory refresh operations is relatively long, as compared to the time interval between successive memory refresh operations in a conventional volatile memory device, such as a DRAM. A processor can perform periodic memory refresh operations by executing a set of memory refresh instructions implemented in software, rather than in hardware. Accordingly, the memory device can advantageously be simplified, because the need for memory refresh circuitry and for a unique refresh control signal are advantageously eliminated. Moreover, the processor executing the memory refresh instructions can typically perform more sophisticated algorithms, as compared to memory refresh circuitry implemented in hardware, for determining when to perform a memory refresh operation. For example, the processor can determine whether each individual memory cell needs to be refreshed, thereby advantageously avoiding performing unnecessary refresh operations on memory cells that do not need to be refreshed.
摘要:
A programmable multiple data state memory cell including a first electrode layer formed from a first conductive material, a second electrode layer formed from a second conductive material, and a first layer of a metal-doped chalcogenide material disposed between the first and second electrode layers. The first layer providing a medium in which a conductive growth can be formed to electrically couple together the first and second electrode layers. The memory cell further includes a third electrode layer formed from a third conductive material, and a second layer of a metal-doped chalcogenide material disposed between the second and third electrode layers, the second layer providing a medium in which a conductive growth can be formed to electrically couple together the second and third electrode layers.
摘要:
The invention includes a switchable circuit device. The device comprises a first conductive layer and a porous silicon matrix over the first conductive layer. A material is dispersed within pores of the porous silicon matrix, and the material has two stable states. A second conductive layer is formed over the porous silicon matrix. A current flow between the first and second conductive layers is influenced by which of the stable states the material is in.
摘要:
A method for moving resist stripper across the surface of a semiconductor substrate that includes applying a wet chemical resist stripper, such as an organic or oxidizing wet chemical resist stripper, to at least a portion of a photomask positioned over the semiconductor substrate. A carrier fluid, such as a gas, is then directed toward the semiconductor substrate so as to move the resist stripper across the substrate. The carrier fluid may be directed toward the substrate as the resist stripper is being applied thereto or following application of the resist stripper. A system for effecting the method is also disclosed.
摘要:
A silicon etching method includes providing a substrate assembly including an exposed silicon region and an exposed oxide region. An etch composition including an ammonium fluoride component, an inorganic acid component, and an oxidizing agent is also provided. The etch composition has a pH in the range of about 7.0 to about 8.0. The substrate assembly is exposed to the etch composition. Exposing the substrate assembly to the etch composition may result in etching the exposed silicon region at an etching rate that is greater than about 3 times the etching rate of the exposed oxide region and/or etching the silicon region at an etch rate greater than about 9 Å/minute. The etching method may be used in forming isolation structures. Further, etch compositions for performing the desired etch are provided.