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31.发明授权Heat resistant polybenzoxazole from bis-((aminohydroxyphenyl)hexafluoroisopropyl)diphenyl ether 失效来自双 - （（氨基羟基苯基）六氟异丙基）二苯基醚的耐热聚苯并恶唑
公开(公告)号：US4939215A
公开(公告)日：1990-07-03
申请号：US327761
申请日：1989-03-23
CPC分类号： G02F1/133723 , C08G69/26 , C08G69/32 , C08G73/22 , G03F7/0233 , G03F7/037 , H01B3/303 , Y10T428/10
摘要： Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.
摘要翻译： 衍生自至少一种选自未取代的和取代的4,4'-双[2-（4-氨基-3-羟基苯基）六氟异丙基）]二苯基醚4,4'-二胺的二胺的耐热，可成形的羟基和/或烷氧基取代的聚酰胺 ' - 双 - [2-（3-氨基-4-羟基苯基）六氟异丙基]二苯醚和二羧酸或其衍生物例如 其酸卤素或酯。 本发明的聚酰胺可以被热固化以形成对于水解，化学和辐射攻击是稳定的较高耐热性的聚苯并恶唑。 本发明的聚酰胺可以通过模制，挤出和溶剂浇铸方法形成成型制品，优选在溶剂或稀释剂的存在下，然后任选地转化成耐热不溶性聚苯并恶唑。 这些成型制品在飞机，电子和其他商业应用中是有用的，其中需要耐热，耐化学性和耐辐射性以及良好的机械和电学性能。
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32.发明授权Polymers prepared from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl] diphenyl ether dianhydride 失效由4,4'-双[2-（3,4-（二羧基苯基）六氟异丙基]二苯醚二酐制备的聚合物
公开(公告)号：US4931540A
公开(公告)日：1990-06-05
申请号：US124720
申请日：1987-11-24
IPC分类号： G03F7/037 , C07C65/24 , C08F290/00 , C08F299/00 , C08G69/40 , C08G73/10 , C08G73/12 , C08L79/08 , G03F7/038
CPC分类号： C07C65/24 , C08G69/40 , C08G73/105 , C08G73/1057 , C08G73/1064 , C08G73/12 , G03F7/0387
摘要： This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.
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公开(公告)号：US07582127B2
公开(公告)日：2009-09-01
申请号：US11670137
申请日：2007-02-01
CPC分类号： C09G1/02 , C09K3/1463 , C23F3/06 , H01L21/3212
摘要： The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
摘要翻译： 本发明提供了通过使用包含钨蚀刻剂，钨蚀刻抑制剂和水的组合物对包含钨的基材进行化学机械抛光的方法，其中所述钨抛光抑制剂是聚合物，共聚物或聚合物共混物，其包含在 至少一个包含至少一个含氮杂环或叔或季氮原子的重复基团。 本发明还提供了一种特别适用于抛光含钨衬底的化学机械抛光组合物。
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34.发明授权Polyamide containing the hexafluoroisopropylidene group and process of using to form a positive image 失效含有六氟异亚丙基的聚酰胺和使用形成正像的方法
公开(公告)号：US5240819A
公开(公告)日：1993-08-31
申请号：US667761
申请日：1991-03-11
CPC分类号： C08G69/32 , C08G69/26 , G03F7/0233 , Y10T428/31725 , Y10T428/31736
摘要： This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.
摘要翻译： 本发明是含有六氟异亚丙基的高温聚酰胺。 本发明的高温聚酰胺和光或辐射敏化剂提供改进的高温正性抗蚀剂，其可以在含水碱性显影剂中显影并热退火以形成适合用于微电子和印刷应用的耐热的聚恶唑消除结构。 本发明的正性光致抗蚀剂具有改进的涂料溶剂溶度和改进的感光速度。 本发明的聚酰胺可以通过常规的缩合反应制备; 例如 二胺和二酰氯的缩合。 此外，本发明的聚酰胺提供了除光刻胶区域之外的应用中具有优异粘合性能的高温保护涂层。
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公开(公告)号：US5101005A
公开(公告)日：1992-03-31
申请号：US348633
申请日：1989-05-18
IPC分类号： C08G73/10
CPC分类号： C08G73/105
摘要： The present invention provides cross-linkable polyimide polymers having at least one repeating unit of the sturcture of: ##STR1## wherein n is the number of repeating groups and A is a tetravalent aromatic organic radical wherein each pair of carbonyl groups are attached to adjacent carbons in the ring moiety A.It has been found that polyimides having the structure of formula I may be crosslinked at surprisingly low temperatures when heated from about 75 to about 110.degree. C. to form infusible and solvent resistant shapes, thereby rendering them useful in the preparation of films, laminates and composites where inertness to solvents is a prerequisite.
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36.发明授权Polyamide containing the hexafluoroisopropylidene group with O-quinone diazide in positive working photoresist 失效在正性光致抗蚀剂中含有六氟异亚丙基的聚酰胺与O-醌二叠氮化物
公开(公告)号：US5021320A
公开(公告)日：1991-06-04
申请号：US376684
申请日：1989-07-07
CPC分类号： G03F7/0233 , C08G69/26 , C08G69/32
摘要： This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.
摘要翻译： 本发明是含有六氟异亚丙基的高温聚酰胺。 本发明的高温聚酰胺和光或辐射敏化剂提供改进的高温正性抗蚀剂，其可以在含水碱性显影剂中显影并热退火以形成适合用于微电子和印刷应用的耐热的聚恶唑消除结构。 本发明的正性光致抗蚀剂具有改进的涂料溶剂溶度和改进的感光速度。 本发明的聚酰胺可以通过常规的缩合反应制备; 例如 二胺和二酰氯的缩合。 此外，本发明的聚酰胺提供了除光刻胶区域之外的应用中具有优异粘合性能的高温保护涂层。
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公开(公告)号：US4980447A
公开(公告)日：1990-12-25
申请号：US321021
申请日：1989-03-09
申请人： Dinesh N. Khanna
发明人： Dinesh N. Khanna
CPC分类号： C08G73/14 , C08G73/1085 , C08G73/22
摘要： The present invention provides polyamide-polyimide and polybenzoxazole-polyimide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkyl, perfluoroalkyl or perfluoroarylalkyl having from 1 to 10 carbon atoms and a carbon-carbon double bond directly linking the two aromatic groups, and R is selected from the group consisting of hydrogen, hydroxy and C.sub.1 to C.sub.4 alkoxy.The polyamide-polyimide polymers of this invention are prepared by reacting compounds of the above formula, alone or admixed with other aromatic diamines, with one or more aromatic tetarcarboxylic acids or anhydrides thereof. Polybenzoxazole-polyimide derivatives of such polyamide-polyimide polymers are prepared utilizing compounds of the above formula wherein R is hydroxy or C.sub.1 to C.sub.4 alkoxy, and by subjecting the resulting alkoxy or hydroxy-substituted polyamide-polyimide to a dehydrating and cyclizing reaction to form the oxazole linkage which gives rise to polybenzoxazole-polyimide polymer.
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38.发明授权
公开(公告)号：US4866155A
公开(公告)日：1989-09-12
申请号：US124743
申请日：1987-11-24
IPC分类号： G02B6/00 , B01D71/48 , B32B27/36 , C08G63/19 , C08G63/40 , C08G63/682 , C08J5/18 , C08L67/02 , C09D167/02 , D01F6/86 , G02B1/10
CPC分类号： B01D71/48 , C08G63/40 , C08G63/6826 , G02B1/105 , Y10T428/31786
摘要： Polyesters of 4,4'bis[2-(4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether having high transparency, high solvent solubility and excellent melt processability are prepared. They possess high thermal and radiation stability and are useful in the preparation of protective films, protective paints, films, fibers, diffusion membranes and shaped articles where high service temperature and radiation resistance are desired.
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39.发明授权Heat resistant polyamide and polybenzoxazole from bis-((amino-hydroxyphenyl)hexafluoroisopropyl)diphenyl ethers 失效双（（氨基 - 羟基苯基）六氟异丙基）二苯醚的耐热聚酰胺和聚苯并恶唑
公开(公告)号：US4845183A
公开(公告)日：1989-07-04
申请号：US124634
申请日：1987-11-24
CPC分类号： C08G73/22 , C08G69/26 , C08G69/32 , G02F1/133723 , G03F7/0233 , G03F7/037 , H01B3/303 , Y10T428/24736
摘要： Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.
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公开(公告)号：US4803147A
公开(公告)日：1989-02-07
申请号：US124742
申请日：1987-11-24
IPC分类号： C08G73/10 , C08G73/12 , C08L79/08 , G03F7/037 , H01L21/027 , H01L21/312 , G03C1/68
CPC分类号： C08G73/105 , C08G73/1039 , C08G73/123 , C08L79/08 , G03F7/037 , Y10S430/107
摘要： A photosensitive polyimide polymer composition comprising a solvent soluble polyimide condensation product of an aromatic dianhydride and an aromatic diamine, a polyfunctional ethylenically unsaturated monomer and a photoinitiator. The solvent soluble polyimides of the composition are prepared from at least one compound selected from 2,2-hexafluoro-bis-(3,4-dicarboxyphenyl)tetracarboxylic dianhydride; 1,1-bis-[4-(1,2-dicarboxyphenyl)]-1-phenyl-2,2,2-trifluoroethane dianhydride; 2,2-hexafluoro-bis(3-aminophenyl)propane; 2,2-hexafluoro-bis(4-aminophenyl)propane; 2,2-hexafluoro-bis-[4-(3-aminophenoxy)phenyl]propane; 2,2-hexafluoro-bis-[4-(4-aminophenoxy)phenyl]propane and 1,1-bis-(4-aminopheny)-1-phenyl-2,2,2-trifluoroethane or mixtures thereof.
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