公开(公告)号：US07928378B2

公开(公告)日：2011-04-19

申请号：US12216160

申请日：2008-06-30

申请人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

发明人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

IPC分类号： G01N23/20

CPC分类号： H01J37/222 ,  G01N23/225 ,  G01N23/2251 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0216 ,  H01J2237/082 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2813 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/3025 ,  H01L2924/00

摘要： A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.

摘要翻译： 本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过具有至少一个自由度的平台26-1连续移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。 因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

公开(公告)号：US07297949B2

公开(公告)日：2007-11-20

申请号：US11528595

申请日：2006-09-28

申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

IPC分类号： H01J37/26 ,  H01J37/28

CPC分类号： G03F7/70616 ,  G01N23/225 ,  H01J37/05 ,  H01J37/06 ,  H01J37/073 ,  H01J37/075 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/226 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0435 ,  H01J2237/057 ,  H01J2237/06316 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/248 ,  H01J2237/2482 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.

摘要翻译： 检查装置及使用该检查装置的半导体装置的制造方法。 检查装置用于诸如晶片的样品的缺陷检查，线宽测量，表面电位测量等。 在检查装置中，多个带电粒子从初级光学系统传送到样品，从样品发射的二次带电粒子与主光学系统分离，并通过二次光学系统引入到检测器。 在移动样品的同时进行带电粒子的照射。 带电粒子的照射点沿着样品的移动方向排列成N行，沿着与其垂直的方向排列成M列。 带电粒子的每一列照射点在垂直于样品的移动方向的方向上连续移动预定量。

公开(公告)号：US20070194235A1

公开(公告)日：2007-08-23

申请号：US11783780

申请日：2007-04-12

申请人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

发明人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

IPC分类号： G01N23/00

CPC分类号： H01J37/222 ,  G01N23/225 ,  G01N23/2251 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0216 ,  H01J2237/082 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2813 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/3025 ,  H01L2924/00

摘要： A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.

摘要翻译： 本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过至少一个自由度的阶段26-1连续地移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。 因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

公开(公告)号：US20070057186A1

公开(公告)日：2007-03-15

申请号：US11528595

申请日：2006-09-28

申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

IPC分类号： G21K7/00

CPC分类号： G03F7/70616 ,  G01N23/225 ,  H01J37/05 ,  H01J37/06 ,  H01J37/073 ,  H01J37/075 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/226 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0435 ,  H01J2237/057 ,  H01J2237/06316 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/248 ,  H01J2237/2482 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.

公开(公告)号：US07135676B2

公开(公告)日：2006-11-14

申请号：US09891611

申请日：2001-06-27

申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima ,  Toru Takagi

IPC分类号： H01J37/28

CPC分类号： G03F7/70616 ,  G01N23/225 ,  H01J37/05 ,  H01J37/06 ,  H01J37/073 ,  H01J37/075 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/226 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0435 ,  H01J2237/057 ,  H01J2237/06316 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/248 ,  H01J2237/2482 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： An inspection apparatus and a semiconductor device manufacturing method using the same. The inspection apparatus is used for defect inspection, line width measurement, surface potential measurement or the like of a sample such as a wafer. In the inspection apparatus, a plurality of charged particles is delivered from a primary optical system to the sample, and secondary charged particles emitted from the sample are separated from the primary optical system and introduced through a secondary optical system to a detector. Irradiation of the charged particles is conducted while moving the sample. Irradiation spots of the charged particles are arranged by N rows along a moving direction of the sample and by M columns along a direction perpendicular thereto. Every row of the irradiation spots of the charged particles is shifted successively by a predetermined amount in a direction perpendicular to the moving direction of the sample.

公开(公告)号：US20060138343A1

公开(公告)日：2006-06-29

申请号：US11360704

申请日：2006-02-24

申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Shoji Yoshikawa

发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Shoji Yoshikawa

IPC分类号： G21K5/10

CPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： An electron beam apparatus such as a sheet beam based testing apparatus has an electron-optical system for irradiating an object under testing with a primary electron beam from an electron beam source, and projecting an image of a secondary electron beam emitted by the irradiation of the primary electron beam, and a detector for detecting the secondary electron beam image projected by the electron-optical system; specifically, the electron beam apparatus comprises beam generating means 2004 for irradiating an electron beam having a particular width, a primary electron-optical system 2001 for leading the beam to reach the surface of a substrate 2006 under testing, a secondary electron-optical system 2002 for trapping secondary electrons generated from the substrate 2006 and introducing them into an image processing system 2015, a stage 2003 for transportably holding the substrate 2006 with a continuous degree of freedom equal to at least one, a testing chamber for the substrate 2006, a substrate transport mechanism for transporting the substrate 2006 into and out of the testing chamber, an image processing analyzer 2015 for detecting defects on the substrate 2006, a vibration isolating mechanism for the testing chamber, a vacuum system for holding the testing chamber at a vacuum, and a control system 2017 for displaying or storing positions of defects on the substrate 2006.

摘要翻译： 诸如基于片材束的测试装置的电子束装置具有电子光学系统，用于用来自电子束源的一次电子束照射待测物体，并且投射通过照射的二次电子束的图像 一次电子束和用于检测由电子 - 光学系统投影的二次电子束图像的检测器; 具体地，电子束装置包括用于照射具有特定宽度的电子束的光束产生装置2004，用于引导光束到达待测基板2006的表面的初级电子 - 光学系统2001，二次电子光学系统2002 用于捕获从衬底2006产生的二次电子并将它们引入到图像处理系统2015中，用于以等于至少一个的连续自由度可移动地保持衬底2006的阶段2003，用于衬底2006的测试室，衬底 用于将基板2006输送到测试室中的传送机构，用于检测基板2006上的缺陷的图像处理分析器2015，用于测试室的隔振机构，用于将测试室保持在真空的真空系统，以及 用于在基板2006上显示或存储缺陷位置的控制系统2017。

公开(公告)号：US07049585B2

公开(公告)日：2006-05-23

申请号：US09891612

申请日：2001-06-27

申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shin Oowada ,  Shoji Yoshikawa ,  Mutsumi Saito

发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shin Oowada ,  Shoji Yoshikawa ,  Mutsumi Saito

IPC分类号： H01J37/28

CPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： An electron beam apparatus such as a sheet beam based testing apparatus has an electron-optical system for irradiating an object under testing with a primary electron beam from an electron beam source, and projecting an image of a secondary electron beam emitted by the irradiation of the primary electron beam, and a detector for detecting the secondary electron beam image projected by the electron-optical system. Specifically, the electron beam apparatus comprises beam generating means 2004 for irradiating an electron beam having a particular width, a primary electron-optical system 2001 for leading the beam to reach the surface of a substrate 2006 under testing, a secondary electron-optical system 2002 for trapping secondary electrons generated from the substrate 2006 and introducing them into an image processing system 2015, a stage 2003 for transportably holding the substrate 2006 with a continuous degree of freedom equal to at least one, a testing chamber for the substrate 2006, a substrate transport mechanism for transporting the substrate 2006 into and out of the testing chamber, an image processing analyzer 2015 for detecting defects on the substrate 2006, a vibration isolating mechanism for the testing chamber, a vacuum system for holding the testing chamber at a vacuum, and a control system 2017 for displaying or storing positions of defects on the substrate 2006.

摘要翻译： 诸如基于片材束的测试装置的电子束装置具有电子光学系统，用于用来自电子束源的一次电子束照射待测物体，并且投射通过照射的二次电子束的图像 一次电子束和用于检测由电子 - 光学系统投影的二次电子束图像的检测器。 具体地，电子束装置包括用于照射具有特定宽度的电子束的光束产生装置2004，用于引导光束到达待测基板2006的表面的初级电子 - 光学系统2001，二次电子光学系统2002 用于捕获从衬底2006产生的二次电子并将它们引入到图像处理系统2015中，用于以等于至少一个的连续自由度可移动地保持衬底2006的阶段2003，用于衬底2006的测试室，衬底 用于将基板2006输送到测试室中的传送机构，用于检测基板2006上的缺陷的图像处理分析器2015，用于测试室的隔振机构，用于将测试室保持在真空的真空系统，以及 用于在基板2006上显示或存储缺陷位置的控制系统2017。

公开(公告)号：US20050121611A1

公开(公告)日：2005-06-09

申请号：US11037084

申请日：2005-01-19

申请人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

发明人： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

IPC分类号： G01N23/225 ,  G01Q30/02 ,  H01J37/06 ,  H01J37/073 ,  H01J37/18 ,  H01J37/20 ,  H01J37/22 ,  H01J37/244 ,  H01J37/28 ,  G01N23/00 ,  G21K7/00

CPC分类号： H01J37/222 ,  G01N23/225 ,  G01N23/2251 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0216 ,  H01J2237/082 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2813 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/3025 ,  H01L2924/00

摘要： A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.

摘要翻译： 本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过至少一个自由度的阶段26-1连续地移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。 因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

公开(公告)号：US07745784B2

公开(公告)日：2010-06-29

申请号：US11819026

申请日：2007-06-25

申请人： Mamoru Nakasuji ,  Tohru Satake ,  Kenji Watanabe ,  Takeshi Murakami ,  Nobuharu Noji ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shoji Yoshikawa ,  Toshifumi Kimba ,  Shin Oowada ,  Mitsumi Saito ,  Muneki Hamashima ,  Toru Takagi ,  Naoto Kihara ,  Hiroshi Nishimura

发明人： Mamoru Nakasuji ,  Tohru Satake ,  Kenji Watanabe ,  Takeshi Murakami ,  Nobuharu Noji ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shoji Yoshikawa ,  Toshifumi Kimba ,  Shin Oowada ,  Mitsumi Saito ,  Muneki Hamashima ,  Toru Takagi ,  Naoto Kihara ,  Hiroshi Nishimura

IPC分类号： H01J37/26

CPC分类号： H01J37/185 ,  G01N23/225 ,  G01N23/2251 ,  H01J37/06 ,  H01J37/073 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： The present invention provides an electron beam apparatus for evaluating a sample surface, which has a primary electro-optical system for irradiating a sample with a primary electron beam, a detecting system, and a secondary electro-optical system for directing secondary electron beams emitted from the sample surface by the irradiation of the primary electron beam to the detecting system.

摘要翻译： 本发明提供了一种用于评价样品表面的电子束装置，其具有用于用一次电子束照射样品的初级电光系统，检测系统和用于引导从二次电子束发射的二次电子束 通过将一次电子束照射到检测系统的样品表面。

公开(公告)号：US07888642B2

公开(公告)日：2011-02-15

申请号：US12188567

申请日：2008-08-08

申请人： Mamoru Nakasuji ,  Nabuharu Noji ,  Tohru Satake ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Takao Kato ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shoji Yoshikawa ,  Toshifumi Kimba ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima

发明人： Mamoru Nakasuji ,  Nabuharu Noji ,  Tohru Satake ,  Masahiro Hatakeyama ,  Kenji Watanabe ,  Takao Kato ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shoji Yoshikawa ,  Toshifumi Kimba ,  Shin Oowada ,  Mutsumi Saito ,  Muneki Hamashima

IPC分类号： H01J49/48 ,  G21K5/04

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G01N23/225 ,  H01J37/06 ,  H01J37/063 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/0435 ,  H01J2237/0635 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/2446 ,  H01J2237/24485 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

摘要： The present invention provides an electron beam apparatus for irradiating a sample with primary electron beams to detect secondary electron beams generated from a surface of the sample by the irradiation for evaluating the sample surface. In the electron beam apparatus, an electron gun has a cathode for emitting primary electron beams. The cathode includes a plurality of emitters for emitting primary electron beams, arranged apart from one another on a circle centered at an optical axis of a primary electro-optical system. The plurality of emitters are arranged such that when the plurality of emitters are projected onto a straight line parallel with a direction in which the primary electron beams are scanned, resulting points on the straight line are spaced at equal intervals.

摘要翻译： 本发明提供了一种用于用一次电子束照射样品的电子束装置，以通过用于评估样品表面的照射来检测从样品表面产生的二次电子束。 在电子束装置中，电子枪具有用于发射一次电子束的阴极。 阴极包括用于发射一次电子束的多个发射器，其以在主电光系统的光轴为中心的圆周彼此分开布置。 多个发射器被布置成使得当多个发射器投射到与一次电子束扫描的方向平行的直线上时，直线上的所得点以相等的间隔隔开。