公开(公告)号：US09674941B2

公开(公告)日：2017-06-06

申请号：US14816204

申请日：2015-08-03

Applicant: MediaTek Inc.

Inventor： Sheng-Ming Chang ,  Shih-Chieh Lin ,  Nan-Cheng Chen

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0219 ,  H05K1/0218 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K2201/0723 ,  H05K2201/09672 ,  H05K2201/09709 ,  H05K2201/10522 ,  H05K2201/10674

Abstract: A printed circuit board for mobile platforms includes a core substrate having a first side, a ground plane covering on the first side, a first insulating layer covering the ground plane, and a plurality of first signal traces and a plurality of first ground traces, alternatively arranged on the first insulating layer, a second insulating layer connecting to the first insulating layer, and a plurality of second signal traces separated from each other, disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto, wherein coverage of the ground plane is corresponding to disposition of the first signal trace, the first ground trace, the second signal trace and the second ground trace.

公开(公告)号：US09331054B2

公开(公告)日：2016-05-03

申请号：US14188881

申请日：2014-02-25

Applicant: MediaTek Inc.

Inventor： Sheng-Ming Chang ,  Tung-Hsien Hsieh ,  Nan-Cheng Chen

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18 ,  H05K1/18

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/15183 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first device-attach surface of the first semiconductor package. The second package includes a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface. A dynamic random access memory (DRAM) device is mounted on the second device-attach surface. A decoupling capacitor is mounted on the second device-attach surface. Conductive structures are disposed on the second bump-attach surface of the second package, connecting to the first bump-attach surface of the first body of the first semiconductor package.

Abstract translation: 半导体封装组件包括第一半导体封装。 第一半导体封装包括具有第一器件附着表面和与第一器件附着表面相对的第一凸起附着表面的第一本体。 第二半导体封装被结合到第一半导体封装的第一器件附着表面。 第二包装包括具有第二装置附着表面的第二主体和与第二装置附接表面相对的第二凸起附着表面。 动态随机存取存储器（DRAM）装置安装在第二装置附接表面上。 去耦电容器安装在第二器件附着表面上。 导电结构设置在第二封装的第二凸起附接表面上，连接到第一半导体封装的第一主体的第一凸起附着表面。