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公开(公告)号：US5525649A
公开(公告)日：1996-06-11
申请号：US442703
申请日：1995-05-17
摘要： Disclosed herein in are a magnetic paint composed of a kneaded composition comprising fine magnetic iron based alloy particles, acicular fine magnetic iron oxide particles or plate-like fine magnetic ferrite particles, a binder resin and an organic solvent, the solid content of the fine magnetic iron based alloy particles, the acicular fine magnetic iron oxide particles or plate-like fine magnetic ferrite particles and the binder resin in the kneaded composition being from 65 to 85% by weight, the binder resin being from 5 to 30% by weight based on the fine magnetic iron based alloy particles, the acicular fine magnetic iron oxide particles or plate-like fine magnetic ferrite particles, and a gloss at 45.degree. after dispersion for 6 hours being not less than 120% when formed into a coating film; and a method of preparing the same.
摘要翻译： 本发明公开了一种磁性涂料，其由包含细磁铁基合金颗粒，针状细磁铁氧化物颗粒或板状细磁铁氧体颗粒，粘合剂树脂和有机溶剂的捏合组合物组成，精细磁性固体含量 铁基合金粒子，针状细磁铁氧体粒子或板状细磁铁氧体粒子和捏合组合物中的粘合剂树脂为65〜85重量％，粘合剂树脂为5〜30重量％，基于 细磁铁基合金颗粒，针状细磁铁氧体颗粒或板状细磁铁氧体颗粒，分散6小时后45度的光泽度在形成涂膜时不小于120％; 及其制备方法。
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公开(公告)号：US5259155A
公开(公告)日：1993-11-09
申请号：US879573
申请日：1992-05-07
申请人： Hisao Ishida , Akihiro Nishimura , Koji Sato
发明人： Hisao Ishida , Akihiro Nishimura , Koji Sato
摘要： In a bonder tool cleaning mechanism in a bonding machine, a coarse grindstone, a finishing grindstone and a wire brush are provided on a cleaning section, and when a bonding tool is moved above the cleaning section and then moved down to come into contact with the grindstones and brush, the cleaning section oscillates horizontally so that grindstones and brush clean the bonding tool.
摘要翻译： 在粘合机中的粘合剂工具清洁机构中，在清洁部上设置有粗磨石，精加工磨石和钢丝刷，并且当粘合工具在清洁部分上方移动然后向下移动以与其接触时 磨石和刷子，清洁部分水平摆动，使磨石和刷子清洁粘合工具。
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公开(公告)号：US4887758A
公开(公告)日：1989-12-19
申请号：US302473
申请日：1989-01-26
申请人： Yasunobu Suzuki , Motohiko Kato , Akio Bando , Hisao Ishida , Akihiro Nishimura
发明人： Yasunobu Suzuki , Motohiko Kato , Akio Bando , Hisao Ishida , Akihiro Nishimura
CPC分类号： H01L21/67138 , H01L24/97 , H01L2224/50
摘要： An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.
摘要翻译： 用于将固态器件的引线连接或接合到引线框架等的装置，其中通过冲头从薄膜载体冲出的固态装置首先由吸附粘合头拾起并保持。 然后将升降臂纵向和横向地驱动，使得其上具有固态装置的吸附粘合头移动到第一粘结台上方的位置。 然后，升降臂通过垂直驱动机构降低，由吸附粘合头保持的固态装置压靠指定的引线框架。 第一接合工具被降低并且同时将固态器件的两个相对侧上的引线键合到引线框架。 然后，第一接合工具被升高，并且吸附粘合头被升高并且移回到冲头上方的位置。 馈送固态器件的两侧的引线框架，并且在第二接合位置，固态器件的另外两个相对侧上的引线被连接到引线框架上 粘接工具。
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公开(公告)号：US08720232B2
公开(公告)日：2014-05-13
申请号：US10333732
申请日：2002-05-23
申请人： Akihiro Nishimura
发明人： Akihiro Nishimura
IPC分类号： C03B37/02
CPC分类号： C03B37/0209 , Y02P40/57
摘要： An apparatus is provided for producing continuous glass filaments by spinning molten glass through nozzles of a bushing and cooling the thus-spun filaments with fins joined to one or more cooled manifolds and arranged in a proximity of the nozzles. Each manifold is provided at at least three locations thereof with at least one inlet port and at least one outlet port for coolant, respectively, with a proviso that the total number of the inlet and outlet ports is the same as the number of the locations of the manifold. Without using a complex construction, this invention makes it possible to provide the fins with improved durability and to produce the glass filaments with improved quality. In particular, the present invention can be applied to large bushings each of which is equipped with a number of nozzles.
摘要翻译： 提供了一种用于通过将衬套的喷嘴旋转熔融玻璃并将如此纺丝的长丝与连接到一个或多个冷却歧管并布置在喷嘴附近并布置的翅片进行冷却来生产连续玻璃丝的装置。 每个歧管在其至少三个位置处分别设置有至少一个入口端口和至少一个用于冷却剂的出口端口，条件是入口端口和出口端口的总数量与 歧管。 本发明不需要使用复杂的结构，可以提供具有改善的耐久性的翅片，并且可以提高品质的玻璃丝。 特别地，本发明可以应用于各自配备有多个喷嘴的大型衬套。
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公开(公告)号：US08609150B2
公开(公告)日：2013-12-17
申请号：US13116615
申请日：2011-05-26
申请人： Hisaya Nishide , Shigeyuki Nishimura , Shigeru Mitani , Koji Minamida , Fumio Kanamori , Munekazu Ogawa , Shigehisa Kanbayashi , Toyoshi Tanimura , Koji Higuchi , Hidemasa Kominami , Tomohiro Okamoto , Akihiro Nishimura
发明人： Hisaya Nishide , Shigeyuki Nishimura , Shigeru Mitani , Koji Minamida , Fumio Kanamori , Munekazu Ogawa , Shigehisa Kanbayashi , Toyoshi Tanimura , Koji Higuchi , Hidemasa Kominami , Tomohiro Okamoto , Akihiro Nishimura
CPC分类号： A01N43/653 , A01N43/40 , A01N43/50 , A01N47/40 , A01N55/00 , C07D213/64 , A01N47/44 , A01N47/38 , A01N47/12 , A01N43/84 , A01N43/54 , A01N43/42 , A01N43/30 , A01N37/50 , A01N37/34 , A01N2300/00
摘要： A fungicidal composition containing, as active ingredients, (a) a benzoylpyridine derivative represented by the following formula or its salt: wherein X is a halogen atom, a nitro group, a substitutable hydrocarbon group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group, a hydroxyl group, a substitutable alkylthio group, a cyano group, a carboxyl group which may be esterified or amidated, or a substitutable amino group, n is 1, 2, 3 or 4; R1 is a substitutable alkyl group, R2′ is a substitutable alkyl group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group or a hydroxyl group, p is 1, 2 or 3, and R2″ is a substitutable alkoxy group or a hydroxyl group, provided that at least two of R2′ and R2″ optionally form a condensed ring containing an oxygen atom and (b) at least one other fungicide.
摘要翻译： 作为活性成分的（a）下式表示的苯甲酰基吡啶衍生物或其盐的杀真菌组合物，其中X为卤素原子，硝基，可取代的烃基，可取代的烷氧基，可取代的芳氧基， 可取代的环烷氧基，羟基，可取代的烷硫基，氰基，可被酯化或酰胺化的羧基，或可取代的氨基，n为1,2,3或4; R1是可取代的烷基，R2'是可取代的烷基，可取代的烷氧基，可取代的芳氧基，可取代的环烷氧基或羟基，p是1,2或3，R2“是可取代的烷氧基 基团或羟基，条件是R2'和R2“中的至少两个任选地形成含有氧原子的稠环和（b）至少一种其它杀真菌剂。
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公开(公告)号：US20060194849A1
公开(公告)日：2006-08-31
申请号：US11414401
申请日：2006-05-01
申请人： Hisaya Nishide , Shigeyuki Nishimura , Shigeru Mitani , Koji Minamida , Fumio Kanamori , Munekazu Ogawa , Shigehisa Kanbayashi , Toyoshi Tanimura , Koji Higuchi , Hidemasa Kominami , Tomohiro Okamoto , Akihiro Nishimura
发明人： Hisaya Nishide , Shigeyuki Nishimura , Shigeru Mitani , Koji Minamida , Fumio Kanamori , Munekazu Ogawa , Shigehisa Kanbayashi , Toyoshi Tanimura , Koji Higuchi , Hidemasa Kominami , Tomohiro Okamoto , Akihiro Nishimura
IPC分类号： A01N43/40
CPC分类号： A01N43/653 , A01N43/40 , A01N43/50 , A01N47/40 , A01N55/00 , C07D213/64 , A01N47/44 , A01N47/38 , A01N47/12 , A01N43/84 , A01N43/54 , A01N43/42 , A01N43/30 , A01N37/50 , A01N37/34 , A01N2300/00
摘要： A fungicidal composition containing, as active ingredients, (a) a benzoylpyridine derivative represented by the following formula or its salt: wherein X is a halogen atom, a nitro group, a substitutable hydrocarbon group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group, a hydroxyl group, a substitutable alkylthio group, a cyano group, a carboxyl group which may be esterified or amidated, or a substitutable amino group, n is 1, 2, 3 or 4; R1 is a substitutable alkyl group, R2′ is a substitutable alkyl group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group or a hydroxyl group, p is 1, 2 or 3, and R2″ is a substitutable alkoxy group or a hydroxyl group, provided that at least two of R2′ and R2″ optionally form a condensed ring containing an oxygen atom and (b) at least one other fungicide.
摘要翻译： 作为活性成分的（a）下式表示的苯甲酰基吡啶衍生物或其盐的杀真菌组合物，其中X为卤素原子，硝基，可取代的烃基，可取代的烷氧基，可取代的芳氧基， 可取代的环烷氧基，羟基，可取代的烷硫基，氰基，可被酯化或酰胺化的羧基，或可取代的氨基，n为1,2,3或4; R 1是可取代的烷基，R 2'是可取代的烷基，可取代的烷氧基，可取代的芳氧基，可取代的环烷氧基或羟基， p是1,2或3，并且R 2'是可取代的烷氧基或羟基，条件是R 2'和R“中的至少两个 > 2“'任选地形成含有氧原子的稠环和（b）至少一种其它杀真菌剂。
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37.发明申请公开(公告)号：US20050031088A1
公开(公告)日：2005-02-10
申请号：US10887920
申请日：2004-07-12
申请人： Shoichi Okamura , Keiichi Fujii , Susumu Adachi , Shinya Hirasawa , Toshinori Yoshimuta , Koichi Tanabe , Shigeya Asai , Akihiro Nishimura
发明人： Shoichi Okamura , Keiichi Fujii , Susumu Adachi , Shinya Hirasawa , Toshinori Yoshimuta , Koichi Tanabe , Shigeya Asai , Akihiro Nishimura
摘要： A subtraction image is obtained, by a subtraction process (DSA process), from a live image and a mask image. A lag-behind part included in each X-ray detection signal is considered due to an impulse response formed of exponential functions. The lag-behind part is removed from each X-ray detection signal by a recursive computation to obtain a corrected X-ray detection signal. The live image and mask image are obtained from such corrected detection signals.
摘要翻译： 通过减法处理（DSA处理）从实时图像和掩模图像获得减法图像。 由于由指数函数形成的脉冲响应，考虑了每个X射线检测信号中包含的滞后部分。 通过递归计算从每个X射线检测信号中去除滞后部分，以获得校正的X射线检测信号。 从这种校正的检测信号获得实时图像和掩模图像。
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38.发明申请公开(公告)号：US20050031079A1
公开(公告)日：2005-02-10
申请号：US10885634
申请日：2004-07-08
申请人： Shoichi Okamura , Keiichi Fujii , Susumu Adachi , Shinya Hirasawa , Toshinori Yoshimuta , Koichi Tanabe , Shigeya Asai , Akihiro Nishimura
发明人： Shoichi Okamura , Keiichi Fujii , Susumu Adachi , Shinya Hirasawa , Toshinori Yoshimuta , Koichi Tanabe , Shigeya Asai , Akihiro Nishimura
IPC分类号： G01T1/00 , A61B6/00 , G01N23/00 , G01T1/17 , G03B42/02 , G06T1/00 , H04N5/225 , H04N5/325 , H05G1/08
CPC分类号： H04N5/325
摘要： A radiographic apparatus removes lag-behind parts from radiation detection signals taken from an FPD as X rays are emitted from an X-ray tube, on an assumption that the lag-behind part included in each X-ray detection signal is due to an impulse response formed of a plurality of exponential functions with different attenuation time constants. The lag-behind parts are removed by using impulse responses of the FPD corresponding, for example, to an X-ray dose used in a fluoroscopic image pickup and an X-ray dose used in a radiographic image pickup. X-ray images are created from corrected radiation detection signals with the lag-behind parts removed therefrom.
摘要翻译： 假设每个X射线检测信号中包含的滞后部分是由于脉冲而引起的，X射线从X射线管发射，从放射线检测信号中取出的放射线检测信号中的放射线照相设备 响应由具有不同衰减时间常数的多个指数函数形成。 通过使用FPD的脉冲响应来除去滞后部分，例如对应于例如在透视图像拾取中使用的X射线剂量和在放射线照相图像拾取中使用的X射线剂量。 从修正的放射线检测信号产生X射线图像，其中从其中移除滞后部分。
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39.发明授权Benzoylpyridine derivative or its salt, fungicide containing it as an active ingredient, its production process and intermediate for producing it 有权苯甲酰基吡啶衍生物或其盐，含有它作为活性成分的杀真菌剂，其制备方法和制备方法的中间体公开(公告)号：US06770662B2
公开(公告)日：2004-08-03
申请号：US10312040
申请日：2002-12-23
IPC分类号： A61K3144
CPC分类号： C07D213/64 , A01N43/40 , A01N47/06 , C07D213/30 , C07D213/50 , C07D213/57 , C07D213/61 , C07D213/643 , C07D213/70 , C07D213/73 , C07D213/74 , C07D213/79 , C07D213/80 , C07D213/82 , C07D213/84
摘要： The present invention relates to a fungicide containing a novel benzoylpyridine derivative or its salt. The present invention provides a fungicide containing a benzoylpyridine derivative represented by the formula (I) or its salt: wherein X is a halogen atom, a nitro group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group, a hydroxyl group, a substitutable hydrocarbon group, a substitutable alkylthio group, a cyano group, a carboxyl group which may be esterified or amidated, or a substitutable amino group; n is 1, 2, 3 or 4; R1 is a substitutable alkyl group; R2 is a substitutable alkyl group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group or a hydroxyl group; and m is 1, 2, 3 or 4, provided that when m is at least 2, R2 may contain an oxygen atom to form a condensed ring.
摘要翻译： 本发明涉及含有新的苯甲酰基吡啶衍生物或其盐的杀菌剂。本发明提供了含有式（I）表示的苯甲酰基吡啶衍生物或其盐的杀真菌剂：其中X是卤素原子，硝基，可取代的 烷氧基，可取代的芳氧基，可取代的环烷氧基，羟基，可取代烃基，可取代的烷硫基，氰基，可被酯化或酰胺化的羧基，或可取代的氨基; n为1,2,3或4; R 1是可取代的烷基; R 2是可取代的烷基，可取代的烷氧基，可取代的芳氧基，可取代的环烷氧基或羟基; 并且m为1,2,3或4，条件是当m为至少2时，R 2可含有氧原子以形成稠环。
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公开(公告)号：US06550136B1
公开(公告)日：2003-04-22
申请号：US09511368
申请日：2000-02-23
申请人： Hiroki Hata , Kenichi Yamane , Akihiro Nishimura , Noriaki Taneko
发明人： Hiroki Hata , Kenichi Yamane , Akihiro Nishimura , Noriaki Taneko
IPC分类号： H05K302
CPC分类号： H01L23/4985 , H01L21/4803 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48463 , H01L2224/85399 , H01L2924/00014 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H05K1/0293 , H05K3/0044 , H05K3/242 , H05K2201/09127 , H05K2201/09236 , H05K2203/0228 , H05K2203/049 , H05K2203/175 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention aims to provide a method of fabricating a printed wiring board characterized in that a printed wiring board is fabricated by perforating a slot by a router bit at a central part of a substrate. The method further includes cutting a wiring portion for electric plating by the router bit. According to the method, the occurrence of cut burr on the surfaces of the wiring pattern, caused by electric plating, is prevented, the product yield is promoted and the operational efficiency is improved. The invention also discloses a method of fabricating a printed wiring board by forming a conductor circuit by patterning a metal coating formed on a surface of an insulating substrate, successively subjecting the conductor circuit to a surface treatment by electric plating and thereafter perforating a slot by a router bit. The slot connects the substrate to a semiconductor chip at a central portion thereof by bonding wires. As per the method, a pattern of a wiring portion (a wiring pattern) for the electric plating at a location for perforating the slot is inclined at an acute angle relative to a face orthogonal to a moving direction of the router bit, preferably, an acute angle of approximately 15° or more and a width of the wiring portion for the electric plating being approximately 90 &mgr;m or more.
摘要翻译： 本发明的目的在于提供一种制造印刷电路板的方法，其特征在于，通过在基板的中心部分的路由器钻头穿孔来制造印刷布线板。 该方法还包括切割由路由器位电镀的布线部分。 根据该方法，防止了由电镀引起的布线图案表面上的切割毛刺的发生，提高了产品收率并提高了操作效率。 本发明还公开了一种制造印刷电路板的方法，该方法是通过对形成在绝缘基板表面上的金属涂层进行图案化形成导体电路，依次通过电镀对导体电路进行表面处理，然后通过 路由器位。 槽通过接合线将基板连接到其中心部分的半导体芯片。 根据该方法，用于穿孔的位置处的电镀的布线部分（布线图案）的图案相对于与路由器钻头的移动方向正交的面倾斜成锐角，优选为 约15°以上的锐角，电镀用配线部的宽度为约90μm以上。
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