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    LIGHT-EMITTING DEVICE
    32.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20110254046A1

    公开(公告)日：2011-10-20

    申请号：US13174183

    申请日：2011-06-30

    申请人： Chia-Liang Hsu ,  Chih-Chiang Lu ,  Chien-Fu Huang ,  Chun-Yi Wu

    发明人： Chia-Liang Hsu ,  Chih-Chiang Lu ,  Chien-Fu Huang ,  Chun-Yi Wu

    IPC分类号： H01L33/62

    CPC分类号： H01L33/385 ,  H01L24/24 ,  H01L24/82 ,  H01L33/20 ,  H01L33/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The present invention is related to a light-emitting device. The present invention illustrates a vertical light-emitting device in one embodiment, comprising the following elements: a conductive substrate includes a through-hole, a patterned semiconductor structure disposed on a first surface of the substrate, a first bonding pad and a second bonding pad disposed on a second surface of the substrate, a conductive line passing through the through-hole connecting electrically the semiconductor structure layer, and an insulation layer on at least one sidewall of the through-hole insulates the conductive line form the substrate. The present invention illustrates a horizontal light-emitting device in another embodiment, comprising the following elements: a substrate includes a first tilted sidewall, a patterned semiconductor structure disposed on a first surface of the substrate, a first conductive line is disposed on at least the first tilted sidewall of the substrate and connecting electrically the patterned semiconductor structure.

    摘要翻译： 本发明涉及一种发光装置。 本发明示出了一个实施例中的垂直发光器件，其包括以下元件：导电衬底包括通孔，设置在衬底的第一表面上的图案化半导体结构，第一焊盘和第二焊盘 设置在所述基板的第二表面上，穿过所述半导体结构层电连接的所述通孔的导电线以及所述通孔的至少一个侧壁上的绝缘层将所述导线与所述基板绝缘。 本发明示出了另一实施例中的水平发光器件，其包括以下元件：衬底包括第一倾斜侧壁，设置在衬底的第一表面上的图案化半导体结构，第一导线设置在至少 基板的第一倾斜侧壁和电连接图案化的半导体结构。

    LIGHT-EMITTING ELEMENT AND THE MANUFACTURING METHOD THEREOF
    34.
    发明申请
    LIGHT-EMITTING ELEMENT AND THE MANUFACTURING METHOD THEREOF 有权
    发光元件及其制造方法

    公开(公告)号：US20110121291A1

    公开(公告)日：2011-05-26

    申请号：US13022098

    申请日：2011-02-07

    申请人： Shih-I Chen ,  Chia-Liang Hsu ,  Chiu-Lin Yao ,  Tzu-Chieh Hsu ,  Chien-Fu Huang

    发明人： Shih-I Chen ,  Chia-Liang Hsu ,  Chiu-Lin Yao ,  Tzu-Chieh Hsu ,  Chien-Fu Huang

    IPC分类号： H01L33/10

    CPC分类号： H01L33/46 ,  H01L33/0079 ,  H01L33/145 ,  H01L33/22 ,  H01L33/38

    摘要： A light-emitting element includes a light-emitting stack for emitting light and a substrate structure including: a first substrate disposed under the light-emitting stack and having a first surface facing the light-emitting stack; and a second substrate disposed under the light-emitting stack and having a second surface facing the light-emitting stack; and a reflective layer formed between the first substrate and the second substrate and having an inclined angle not perpendicular to the first surface.

    摘要翻译： 发光元件包括用于发光的发光叠层和基板结构，包括：第一基板，设置在所述发光堆叠下方，并具有面向所述发光叠层的第一表面; 以及第二基板，其设置在所述发光堆叠下方并且具有面向所述发光叠层的第二表面; 以及形成在第一基板和第二基板之间并具有不垂直于第一表面的倾斜角度的反射层。

    Light-emitting device
    35.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号：US07837374B2

    公开(公告)日：2010-11-23

    申请号：US12003880

    申请日：2008-01-03

    申请人： Chia-Liang Hsu ,  Shu-Ting Hsu

    发明人： Chia-Liang Hsu ,  Shu-Ting Hsu

    IPC分类号： F21V33/00

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/54 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

    摘要： This application relates to a light-emitting device comprising a light channel having an upper surface, a lower surface opposite to the upper surface, an inner surface intersecting with each of the upper and lower surface by different angles, and an escape surface; and a light-emitting element having a bottom surface substantially parallel to the inner surface and emitting light traveling inside the light channel toward the escape surface. In an embodiment, the escape surface of the light-emitting device is an inclined plane with lens array thereon.

    摘要翻译： 本申请涉及一种发光装置，包括具有上表面，与上表面相对的下表面的光通道，与上表面和下表面中的每一个以不同角度相交的内表面和逃逸表面; 以及发光元件，其具有基本上平行于内表面的底表面，并且发射在光通道内朝向逸出表面行进的光。 在一个实施例中，发光装置的逸出表面是其上具有透镜阵列的倾斜平面。

    Method for forming light-emitting device
    37.
    发明授权
    Method for forming light-emitting device 有权
    用于形成发光装置的方法

    公开(公告)号：US09276166B2

    公开(公告)日：2016-03-01

    申请号：US13446228

    申请日：2012-04-13

    申请人： Chia-Liang Hsu ,  Chih-Chiang Lu

    发明人： Chia-Liang Hsu ,  Chih-Chiang Lu

    IPC分类号： G01R31/26 ,  H01L21/66 ,  H01L33/00 ,  H01L27/15

    CPC分类号： H01L33/0095 ,  G01R31/2635 ,  H01L27/156

    摘要： A method for forming a light-emitting device of the present application comprises providing a wafer; forming a first plurality of light-emitting elements on the wafer; providing a first connection structure to connect each of the first plurality of light-emitting elements; and applying a current flow to one of the first plurality of light-emitting elements for testing at least one electrical property of the light-emitting element while no current flow is applied to the remaining of the first plurality of light-emitting elements.

    摘要翻译： 本申请的发光装置的形成方法包括提供晶片; 在晶片上形成第一组多个发光元件; 提供第一连接结构以连接所述第一多个发光元件中的每一个; 以及向所述第一多个发光元件中的一个施加电流，以测试所述发光元件的至少一个电特性，同时不向所述第一多个发光元件的剩余部分施加电流。

    LIGHT-EMITTING DEVICE
    39.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20130240924A1

    公开(公告)日：2013-09-19

    申请号：US13421898

    申请日：2012-03-16

    申请人： Ching-Huai Ni ,  Chia-Liang Hsu ,  Yi-Ming Chen

    发明人： Ching-Huai Ni ,  Chia-Liang Hsu ,  Yi-Ming Chen

    IPC分类号： H01L33/22

    CPC分类号： H01L33/382 ,  H01L33/22 ,  H01L33/24 ,  H01L33/30 ,  H01L33/32 ,  H01L2933/0016

    摘要： A light-emitting device comprises a substrate; a semiconductor stack comprising a first type semiconductor layer, a second type semiconductor layer and an active layer formed between the first type semiconductor layer and the second type semiconductor layer; a bonding layer formed between the substrate and the semiconductor stack; and a plurality of buried electrodes physically buried in the first type semiconductor layer.

    摘要翻译： 发光装置包括基板; 包括第一类型半导体层，第二类型半导体层和形成在第一类型半导体层和第二类型半导体层之间的有源层的半导体堆叠; 形成在所述基板和所述半导体叠层之间的接合层; 以及物理地埋在第一类型半导体层中的多个埋置电极。

    Light-emitting device
    40.
    发明授权
    Light-emitting device 有权

    公开(公告)号：US08513699B2

    公开(公告)日：2013-08-20

    申请号：US13174183

    申请日：2011-06-30

    申请人： Chia-Liang Hsu ,  Chih-Chiang Lu ,  Chien-Fu Huang ,  Chun-Yi Wu

    发明人： Chia-Liang Hsu ,  Chih-Chiang Lu ,  Chien-Fu Huang ,  Chun-Yi Wu

    IPC分类号： H01L33/62

    CPC分类号： H01L33/385 ,  H01L24/24 ,  H01L24/82 ,  H01L33/20 ,  H01L33/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The present invention is related to a light-emitting device. The present invention illustrates a vertical light-emitting device in one embodiment, comprising the following elements: a conductive substrate includes a through-hole, a patterned semiconductor structure disposed on a first surface of the substrate, a first bonding pad and a second bonding pad disposed on a second surface of the substrate, a conductive line passing through the through-hole connecting electrically the semiconductor structure layer, and an insulation layer on at least one sidewall of the through-hole insulates the conductive line form the substrate. The present invention illustrates a horizontal light-emitting device in another embodiment, comprising the following elements: a substrate includes a first tilted sidewall, a patterned semiconductor structure disposed on a first surface of the substrate, a first conductive line is disposed on at least the first tilted sidewall of the substrate and connecting electrically the patterned semiconductor structure.