公开(公告)号：US20140356055A1

公开(公告)日：2014-12-04

申请号：US14459383

申请日：2014-08-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Yasuyuki Seikmoto ,  Hidekiyo Takaoka ,  Daisuke Tsuruga

IPC: B23K20/00

CPC classification number: B23K20/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/42 ,  C21D9/50 ,  C22C9/00 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  Y10T403/478

Abstract: When a first joining object and a second joining object are joined to each other, the first joining object has a first metal composed of Sn or an alloy containing Sn, the second joining object has a second metal composed of an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu. The first joining object and the second joining object are subjected to heat treatment in a state of being in contact with each other to produce an intermetallic compound at an interface between both joining objects such that both joining object are joined to each other. An alloy containing Sn in an amount of 70% by weight or more is used as the first metal. An alloy containing Sn in an amount of 85% by weight or more is used as the first metal.

Abstract translation: 当第一接合对象和第二接合对象彼此接合时，第一接合对象具有由Sn或包含Sn的合金构成的第一金属，第二接合对象具有由包含至少一个选定的合金的合金构成的第二金属 来自Ni，Mn，Al和Cr以及Cu。 第一接合体和第二接合体在彼此接触的状态下进行热处理，以在两接合体之间的界面处形成金属间化合物，使得接合体彼此接合。 使用含有70重量％以上的Sn的合金作为第一金属。 使用含有85重量％以上的Sn的合金作为第一金属。

公开(公告)号：US20140345939A1

公开(公告)日：2014-11-27

申请号：US14460519

申请日：2014-08-15

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K1/00 ,  H01R4/02 ,  H05K13/04

CPC classification number: B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K35/0216 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0266 ,  B23K35/222 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/42 ,  C22C9/00 ,  C22C9/01 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  H01L21/52 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05647 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2924/01322 ,  H01R4/02 ,  H05K3/3436 ,  H05K3/3463 ,  H05K13/0465 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.

Abstract translation: 在将由第一金属组成的第一金属构件连接到由第二金属构成的第二金属构件之间插入有接合材料的情况下，所述接合材料包括熔点比第一金属低的熔点低熔点金属和/ 构成接合材料的低熔点金属是Sn或含有Sn的合金，第一金属和第二金属中的至少一种是金属或合金，其与形成金属间化合物的低熔点金属构成， 在第一金属构件和第二金属构件之间的接合材料的定位状态下，在低熔点金属熔融的温度下进行热处理。

公开(公告)号：US20130270001A1

公开(公告)日：2013-10-17

申请号：US13917706

申请日：2013-06-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02

CPC classification number: H01R4/02 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/36 ,  C22C1/0425 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C19/03 ,  C22C22/00 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and/or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the squares, except for squares in which only a Sn-based metal component exists, is 70% or more.

Abstract translation: 一种连接结构，其包括至少Cu-Sn金属间化合物，M-Sn金属间化合物和Cu-M-Sn金属间化合物（其中M为Ni和/或Mn）的区域存在于 用WDX分析连接部分的横截面时的连接部分。 此外，连接结构被构造成使得当连接部分的横截面分别在垂直方向和横向方向上被均匀地分成十个部分以形成总共100个分段平方时，平方的比例 除了存在仅Sn基金属成分的正方形以外，所有正方形的数量存在两种以上具有不同构成元素的金属间化合物的比例为70％以上。

公开(公告)号：US20130233618A1

公开(公告)日：2013-09-12

申请号：US13868259

申请日：2013-04-23

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02 ,  B23K1/00 ,  B23K35/24

CPC classification number: H01R4/02 ,  B22F1/0014 ,  B22F1/0059 ,  B22F1/025 ,  B22F7/064 ,  B22F7/08 ,  B23K1/00 ,  B23K35/025 ,  B23K35/24 ,  B23K35/262 ,  B23K35/302 ,  C22C1/0483 ,  C22C1/0491 ,  C22C9/00 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/04

Abstract: A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.

Abstract translation: 一种导电材料，其包含由第一金属和第二金属构成的金属成分，所述金属成分的熔点高于所述第一金属，所述第一金属为Sn或含有70重量％以上的Sn的合金， 第二金属是金属或合金，其与第一金属形成熔点为310℃以上的金属间化合物，并且其本身与在其周围产生的金属间化合物之间的晶格常数差为50％以上 第二金属。