摘要:
An apparatus for correcting positional deviation of the light source emitting light beams in an image recording apparatus is disclosed which corrects change of the image size (dimensions of the image) on the photosensitive member due to positional deviations of beam spots on the photosensitive member on account of physical distortions caused by external vibration, temperature change, and the like. Changes in the diameter of detective light beams are measured by photodetecting portions 5.sub.R and 5.sub.L and piezoelectric devices 6a and 6b are driven based on the results of the detection, whereby the semiconductor laser array 1 is moved so that the multiplication b/a for the image size may be kept constant.
摘要翻译:公开了一种用于校正图像记录装置中的光源发射光束的位置偏差的装置,其用于校正由于光敏部件上光束部件上的光束点的位置偏差导致的感光部件上的图像尺寸(尺寸)的变化 由外部振动,温度变化等引起的物理失真。 通过光检测部5R和5L测量检测光束的直径变化,并且基于检测结果来驱动压电器件6a和6b,由此使半导体激光器阵列1移动,使得图像的乘法b / a 尺寸可能保持不变。
摘要:
The method applies to manufacture of a semiconductor laser device which comprises a semiconductor substrate and a plurality of semiconductor layers piled sequentially one on top of another on the semiconductor substrate, the semiconductor layers including at least a first clad layer; an active layer interposed between a pair of optical waveguide layers, and a second clad layer. In the present manufacturing method, a first impurity diffusion source film is applied on top of the semiconductor layers, an insulation film is applied on top of the first impurity diffusion source film, two layers consisting of the first impurity diffusion source film and insulation film are removed respectively into a stripe shape except for the areas of the semiconductor layers in which impurities are to be diffused, a diffusion protect film to be etched selectively with respect to the insulation film is formed on the surfaces of the semiconductor layers and two layers, an impurity is thermally diffused from the first impurity diffusion source film, a diffusion protect film is etched selectively with respect to the insulation film, and a second impurity is diffused with the insulation film as a mask.
摘要:
Provided is a VCSEL array device that includes at least a first multilayer reflective film, an active layer, and a second multilayer reflective film, formed on a substrate that extends in a longitudinal direction. Plural mesa portions are formed on the substrate by selectively removing at least a portion of the first multilayer reflective film, active layer, and second multilayer reflective film. A selectively oxidized region is formed in at least one of the first multilayer reflective film and the second multilayer reflective film. The VCSEL array device further includes an interlayer insulating film that covers at least a side portion and a bottom portion of the mesa portions, and a surface protecting film that covers the interlayer insulating film. The surface protecting film has plural grooves formed along a longitudinal direction of the substrate in which at least a portion of the surface protecting film is removed.
摘要:
A surface-emitting semiconductor array device includes a substrate, a plurality of light-emitting portions, an electrode pad portion formed on the substrate and disposed through the plurality of light-emitting portions and a dividing groove, and having a plurality of electrode pads formed on an insulating film, and a plurality of metal wirings for connecting each of the plurality of light-emitting portions to a corresponding electrode pad through the dividing groove, the dividing groove has a wave-shaped side wall formed on the substrate.
摘要:
A moving-object measuring interferometric apparatus comprises: a light beam output section outputting a measuring beam; an interference optical system obtaining interference light by projecting the measuring beam onto an object and by allowing light reflected from the object or transmitted light having passed through the object to interfere with reference light; an image pickup section obtaining image information by receiving the interference light on an image pickup surface; and an image pickup timing control section setting a momentary image pickup period during which the object is regarded as being stationary to be contained in a light reception acceptable period of the image pickup surface and controlling the interference light to enter the image pickup surface only during the momentary image pickup period.
摘要:
Provided is a VCSEL array device that includes at least a first multilayer reflective film, an active layer, and a second multilayer reflective film, formed on a substrate that extends in a longitudinal direction. Plural mesa portions are formed on the substrate by selectively removing at least a portion of the first multilayer reflective film, active layer, and second multilayer reflective film. A selectively oxidized region is formed in at least one of the first multilayer reflective film and the second multilayer reflective film. The VCSEL array device further includes an interlayer insulating film that covers at least a side portion and a bottom portion of the mesa portions, and a surface protecting film that covers the interlayer insulating film. The surface protecting film has plural grooves formed along a longitudinal direction of the substrate in which at least a portion of the surface protecting film is removed.
摘要:
A half mirror 4 divides a luminous flux emitted from a low-coherence light source 1 into two luminous fluxes, a secondary reference plate 6 is held integrally with a reference plate 16, and a secondary sample 8 is held integrally with a sample 17. A first luminous flux which is obtained through dividing by the half mirror 4 is reflected at a mirror 5 and which reaches a secondary reference surface 6a, is reflected at the secondary reference surface 6a, returns along the same optical path, and is transmitted through the half mirror 4. The second luminous flux reaches a secondary sample surface 8a, is reflected at the secondary sample surface 8a, returns along the same optical path, and is combined with the first luminous flux at the half mirror 4. The optical path length difference between the first luminous flux and the second luminous flux coincides with approximately twice the optical distance between a reference surface 16a and a sample surface 17a.
摘要:
A surface emitting semiconductor laser diode includes a semiconductor substrate, a first reflective film provided on the semiconductor substrate, a second reflective film provided above the first reflective film, an active region, a tunnel junction region, and a current funneling layer. The active region, the tunnel junction region, and the current funneling layer are provided in series between the first and second reflective films, the active region being interposed by the tunnel junction region and the current funneling layer.
摘要:
A surface emitting semiconductor laser diode of a tunnel junction type includes a semiconductor substrate, a first reflector, a second reflector, an active region disposed in series between the first and second reflectors, and a tunnel junction region disposed in series between the first and second reflectors. The tunnel junction region includes a first semiconductor layer of a first conductive type and a second semiconductor layer of a second conductive type that forms a junction with the first semiconductor layer, the first semiconductor layer being composed of a supper-lattice layer that at least partially includes aluminum and is partially oxidized.
摘要:
The light source is a low-coherence light source, and the optical path is regulated so that the reflected light from the upper surface of each metal wire and that from the reference surface interfere with each other during the first measuring operation, and so that the reflected light from the small regional surface of the conductive layer and that from the reference surface interfere with each other during the second measuring operation. The light detecting surface is divided into a plurality of detecting unit regions, and obtains interference fringe information corresponding to the upper surfaces of the metal wires or the general shape of the first or second virtual contact surface engaged with the small regional surfaces of the conductive layer on the basis of the light intensity averaged and detected with respect to the detecting unit regions.