公开(公告)号：US20090052412A1

公开(公告)日：2009-02-26

申请号：US11844255

申请日：2007-08-23

Applicant: Rajneesh Kumar ,  Robert B. O'Hara, JR. ,  Kalyan Dharanipragada

Inventor： Rajneesh Kumar ,  Robert B. O'Hara, JR. ,  Kalyan Dharanipragada

IPC: H04Q7/24

CPC classification number: H04W36/02

Abstract: A packet loss reduction system. In particular implementations, a method includes responsive to indications of roaming intent of a wireless client relative to currently associated wireless access point, determining if a traffic stream associated with the wireless client is to be proactively buffered by one or more potential wireless access points; conditionally transmitting a command to the one or more potential wireless access points to cause the potential, wireless access points to set up resources to proactively buffer packets of the traffic stream; duplicating received packets of the traffic stream destined for the wireless client; and transmitting the duplicate packets to the potential wireless access points for storage in a proactive stream buffer.

Abstract translation: 一个丢包减少系统。 在特定实现中，一种方法包括响应于无线客户端相对于当前相关无线接入点的漫游意图的指示，确定与无线客户端相关联的业务流是否被一个或多个潜在无线接入点主动缓存; 有条件地向所述一个或多个潜在无线接入点发送命令以使所述潜在无线接入点建立资源以主动缓冲所述业务流的分组; 复制目的地为无线客户端的业务流的接收分组; 以及将重复分组发送到潜在的无线接入点以存储在主动流缓冲器中。

公开(公告)号：US07462294B2

公开(公告)日：2008-12-09

申请号：US11739701

申请日：2007-04-25

Applicant: Rajneesh Kumar ,  Steven P Ostrander

Inventor： Rajneesh Kumar ,  Steven P Ostrander

IPC: C09K5/08 ,  C09K5/10 ,  C09K5/14 ,  H01B1/00 ,  H05K7/20

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract translation: 提供了一种导热混合物，其用于制备导热配方，例如具有高导热性和较低粘度的糊状物。 该糊料用于在电子部件和冷却装置之间提供热导体连接，以增加部件和冷却电子部件的装置之间的传热速率。 制剂含有各种粒度范围内的导热颗粒的混合物，通常分散在含有抗氧化剂和分散剂的非水电介质载体中，导热颗粒混合物在混合物中基于粒度范围以体积百分数特别相关， 通过颗粒尺寸比各个粒径范围。 该混合物可用于制造其他类似产品，例如热凝胶，粘合剂，浆料和复合材料，用于电子和化妆品，药​​品，汽车和类似产品。

公开(公告)号：US20080220998A1

公开(公告)日：2008-09-11

申请号：US11683825

申请日：2007-03-08

Applicant: Claudius Feger ,  Jeffrey D. Gelorme ,  Sushumna Iruvanti ,  Rajneesh Kumar ,  Ijeoma M. Nnebe

Inventor： Claudius Feger ,  Jeffrey D. Gelorme ,  Sushumna Iruvanti ,  Rajneesh Kumar ,  Ijeoma M. Nnebe

IPC: C10M101/04 ,  H01L23/34

CPC classification number: H01L23/3737 ,  C10M169/02 ,  C10M171/02 ,  C10M2201/0413 ,  C10M2201/053 ,  C10M2201/0613 ,  C10M2201/0623 ,  C10M2201/1006 ,  C10M2201/1023 ,  C10M2203/1025 ,  C10M2203/1045 ,  C10M2205/02 ,  C10M2205/04 ,  C10M2207/401 ,  C10M2209/084 ,  C10M2209/102 ,  C10M2209/103 ,  C10M2209/1033 ,  C10M2211/083 ,  C10M2217/044 ,  C10M2229/02 ,  C10M2229/025 ,  C10N2220/00 ,  C10N2220/082 ,  C10N2220/084 ,  C10N2220/086 ,  C10N2230/00 ,  C10N2230/02 ,  C10N2230/08 ,  C10N2240/20 ,  C10N2250/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A reversible thermal thickening grease for microelectronic packages, in which the grease contains filler particles; at least one polymer; and a binder; in which the filler particles are dispersed within the binder, in which one or more segments of the at least one polymer may be attached to the filler particles prior to dispersion in the binder, and in which the polymer collapses at temperatures below a Theta temperature and swells at temperatures above a Theta temperature. During the operation of a microelectronic package, grease pump-out and air proliferation are minimized with use of the reversible thermal thickening grease, while grease fluidity is retained under repetitive thermal stresses.

Abstract translation: 用于微电子封装的可逆热增稠润滑脂，其中润滑脂含有填料颗粒; 至少一种聚合物; 和粘合剂; 其中所述填料颗粒分散在所述粘合剂内，其中所述至少一种聚合物的一个或多个链段可以在分散在所述粘合剂中之前附着到所述填料颗粒上，并且其中所述聚合物在低于所述陶瓷温度的温度下塌陷， 在高于Theta温度的温度下膨胀。 在微电子封装的运行过程中，使用可逆的热增稠润滑脂使润滑脂泵出和空气扩散最小化，同时在重复的热应力下保持润滑脂的流动性。

公开(公告)号：US20080192634A1

公开(公告)日：2008-08-14

申请号：US11673494

申请日：2007-02-09

Applicant: Rajneesh Kumar ,  David Sheldon Stephenson

Inventor： Rajneesh Kumar ,  David Sheldon Stephenson

IPC: H04L12/26

CPC classification number: H04L65/80 ,  H04L47/10 ,  H04L47/14 ,  H04L47/2416 ,  H04L47/26 ,  H04L47/283 ,  H04L47/286 ,  H04L47/32 ,  H04W88/08

Abstract: A method and software to cause a processor to implement a method to set a packet age limit in an access point of a wireless network for communicating time-sensitive data with an associated wireless client station. One method includes the client station sending feedback to the access point so that the access point can set its packet age limit. Another method includes the access point setting its packet age limit according to feedback from the associated client station and/or according to information determined at the access point about the network.

Abstract translation: 一种使处理器实现在无线网络的接入点中设置分组年龄限制的方法和软件，用于与相关联的无线客户站通信时间敏感数据。 一种方法包括客户端向接入点发送反馈，使得接入点可以设置其分组时限。 另一种方法包括接入点根据来自相关联的客户端的反馈和/或根据在接入点处确定的关于网络的信息来设置其分组年龄限制。

公开(公告)号：US20080160985A1

公开(公告)日：2008-07-03

申请号：US11619590

申请日：2007-01-03

Applicant: Girish S. Variyath ,  Vikram Jayaraman ,  Rajneesh Kumar ,  Aseem B. Asthana ,  Ashish Chotai ,  Sravan Vadlakonda

Inventor： Girish S. Variyath ,  Vikram Jayaraman ,  Rajneesh Kumar ,  Aseem B. Asthana ,  Ashish Chotai ,  Sravan Vadlakonda

IPC: H04Q7/20

CPC classification number: H04W76/10 ,  H04W4/029 ,  H04W80/10

Abstract: In one embodiment, a first endpoint initiates a voice communication with an undetermined second endpoint. A second endpoint is selected that is within a predetermined proximity of a location and voice communication between the first s endpoint and the second endpoint is initiated. The second endpoint may be selected based on preset conditions, such as for example a buddy list definition.

Abstract translation: 在一个实施例中，第一端点发起与未确定的第二端点的语音通信。 选择在位置的预定接近度内的第二端点，并且启动在第一端点和第二端点之间的语音通信。 可以基于预设条件（例如好友列表定义）来选择第二端点。

公开(公告)号：US20060268749A1

公开(公告)日：2006-11-30

申请号：US11351853

申请日：2006-02-10

Applicant: Shahriar Rahman ,  Jan Kruys ,  Rajneesh Kumar

Inventor： Shahriar Rahman ,  Jan Kruys ,  Rajneesh Kumar

IPC: H04L12/28

CPC classification number: H04W40/02 ,  H04L45/02 ,  H04L45/18 ,  H04L45/306 ,  H04L45/48 ,  H04L47/125 ,  H04L47/14 ,  H04L47/15 ,  H04L47/24 ,  H04W84/12 ,  Y02D70/1222 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/22 ,  Y02D70/30

Abstract: An apparatus for, a method of, and a computer carrier medium carrying code to cause a processor to execute a method. The method includes running a plurality of instances of a wireless spanning tree protocol in a wireless mesh node, each instance substantially conforming to the IEEE 802.1 standard. Running an instance of wireless spanning tree protocol including the wireless mesh point wirelessly transmitting BPDU information to other wireless mesh points of the network or wirelessly receiving BPDU information from other wireless mesh points, the BPDU information encapsulated in one or more control/management frames, e.g., beacon or probe response frames of a wireless network standard, the BPDU information relating to a spanning tree topology for the instance.

公开(公告)号：US08492910B2

公开(公告)日：2013-07-23

申请号：US13358910

申请日：2012-01-26

Applicant: Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

Inventor： Michael A. Gaynes ,  Rajneesh Kumar ,  Thomas E. Lombardi ,  Steve Ostrander

IPC: H01L23/28

CPC classification number: H01L21/563 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.

Abstract translation: 提供一种制造芯片封装的方法。 芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。 该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

公开(公告)号：US20120217287A1

公开(公告)日：2012-08-30

申请号：US13036086

申请日：2011-02-28

Applicant: Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

Inventor： Rajneesh Kumar ,  Jae-Woong Nah ,  Eric D. Perfecto

IPC: B23K31/02 ,  B23K1/20

CPC classification number: B23K1/0016

Abstract: A first substrate mounted to a bonder head and a second substrate mounted to a base plate are held at different elevated temperatures at the time of bonding that provide a substantially matched thermal expansion between the second substrate and the first substrate relative to room temperature. Further, the temperature of the solder material portions and the second substrate is raised at least up to the melting temperature after contact. The distance between the first substrate and the second substrate can be modulated to enhance the integrity of solder joints. Once the distance is at an optimum, the bonder head is detached, and the bonded structure is allowed to cool to form a bonded flip chip structure. Alternately, the bonder head can control the cooling rate of solder joints by being attached to the chip during cooling step.

Abstract translation: 安装到接合头的第一衬底和安装到基板的第二衬底在接合时被保持在不同的升高的温度，从而相对于室温在第二衬底和第一衬底之间提供基本匹配的热膨胀。 此外，焊接材料部分和第二基板的温度至少升高到接触后的熔融温度。 第一基板和第二基板之间的距离可被调制以增强焊点的完整性。 一旦该距离处于最佳状态，就将分离头拆下，并使粘结结构冷却以形成结合的倒装芯片结构。 或者，焊接头可以在冷却步骤期间通过附接到芯片来控制焊点的冷却速度。

公开(公告)号：US08204029B2

公开(公告)日：2012-06-19

申请号：US12339473

申请日：2008-12-19

Applicant: David Sheldon Stephenson ,  Seema Nayak ,  Sudip Ghosal ,  Rajneesh Kumar

Inventor： David Sheldon Stephenson ,  Seema Nayak ,  Sudip Ghosal ,  Rajneesh Kumar

IPC: H04W4/00

CPC classification number: H04W36/0088 ,  H04L63/10 ,  H04W36/14 ,  H04W84/12

Abstract: A system and method are provided in which access point (AP) devices in a wireless local area network (WLAN) are typed or configured into one of three measurement and reporting roles: Monitor-Mode AP (MMAP), Portal AP (PAP), a Border AP (BAP) or an Interior AP (IAP). APs are assigned specific link measurement requirements according to their assigned type or role. In general, MMAPs and PAPs have the greatest measurement and reporting responsibilities, BAPs have less measurement and reporting responsibilities than PAPs and IAPs have the least measurement and reporting responsibilities. The APs generate measurements that are supplied to appropriate equipment to facilitate handover decisions with respect to a dual-mode wireless client device that roams between the WLAN and another network or vice versa. As a result, link measurements are only performed by APs in locations where such measurements are necessary for handover service, thus reducing the overall processing load on the WLAN infrastructure.

Abstract translation: 提供了一种系统和方法，其中无线局域网（WLAN）中的接入点（AP）设备被输入或配置为三个测量和报告角色之一：监视模式AP（MMAP），门户AP（PAP） 边界AP（BAP）或内部AP（IAP）。 AP根据其分配的类型或角色为特定的链路测量要求分配。 一般来说，MMAPs和PAPs具有最大的测量和报告责任，BAP的测量和报告责任比PAP更少，IAP具有最少的测量和报告责任。 AP产生提供给适当设备的测量结果，以便于相对于在WLAN和另一网络之间漫游的双模无线客户端设备进行切换决策，反之亦然。 因此，链路测量仅由AP在这种测量对于切换服务是必需的位置中执行，从而减少WLAN基础设施上的整体处理负担。

公开(公告)号：US07948905B2

公开(公告)日：2011-05-24

申请号：US12040346

申请日：2008-02-29

Applicant: Girish S. Variyath ,  Vikram Jayaraman ,  Karthikeyan Ganesan ,  Rajneesh Kumar

Inventor： Girish S. Variyath ,  Vikram Jayaraman ,  Karthikeyan Ganesan ,  Rajneesh Kumar

IPC: H04L12/26

CPC classification number: H04L41/5087 ,  H04L41/0681 ,  H04L41/145 ,  H04L41/5009 ,  H04W24/06

Abstract: A voice over WLAN diagnostic system. In particular implementations, a method includes simulating, in response to a triggering event, Voice over Internet Protocol (VoIP) communications with a remote diagnostics engine; gathering metric data characterizing one or more aspects of the simulated VoIP communications; and periodically transmitting diagnostic packets including the metric data to the remote diagnostics engine; wherein the simulating VoIP communications comprises transmitting diagnostic protocol packets that simulate VoIP communications to the remote diagnostic engine; and intercepting diagnostic protocol packets received from the diagnostics engine.

Abstract translation: WLAN诊断系统的语音。 在特定实施方式中，一种方法包括响应于触发事件来模拟与远程诊断引擎的互联网协议语音（VoIP）通信; 收集表征模拟VoIP通信的一个或多个方面的度量数据; 并且将包括所述度量数据的诊断分组周期性地发送到所述远程诊断引擎; 其中所述模拟VoIP通信包括向所述远程诊断引擎发送模拟VoIP通信的诊断协议分组; 并拦截从诊断引擎收到的诊断协议数据包。