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公开(公告)号：US20240385064A1
公开(公告)日：2024-11-21
申请号：US18692654
申请日：2022-08-04
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Peter Schmollngruber , Thomas Friedrich
IPC: G01L9/00
Abstract: A micromechanical pressure sensor element. The micromechanical pressure sensor element includes: a substrate; and a layer structure formed on the substrate. The layer structure includes a top electrode, a bottom electrode, and a movable central electrode arranged between the top and bottom electrodes. The central electrode is formed in flat fashion without a stepped boundary section. The layer structure has a planar surface directly after the production of the central electrode.
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32.发明公开公开(公告)号：US20240290839A1
公开(公告)日：2024-08-29
申请号：US18693231
申请日：2023-02-14
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Peter Schmollngruber
IPC: H01L29/06 , H01L21/02 , H01L21/306 , H01L21/3065
CPC classification number: H01L29/0684 , H01L21/02675 , H01L21/30604 , H01L21/3065
Abstract: A method for forming a layer structure surrounding at least one recess. The method includes: structuring a multitude of depressions in a first semiconductor layer of the later layer structure such that the depressions form at least one contiguous recess, including a plurality of depressions, in the first semiconductor layer, into which wall structures structured out of the first semiconductor layer by means of the depressions project; at least partially areally covering the at least one recess by forming at least one second semiconductor layer from the at least one identical material to the first semiconductor layer; and introducing a medium through at least one medium supply opening into the at least one recess, which medium chemically reacts with the projecting wall structures.
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公开(公告)号：US11905166B2
公开(公告)日：2024-02-20
申请号：US17446898
申请日：2021-09-03
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Peter Schmollngruber , Thomas Friedrich , Andreas Scheurle , Joachim Fritz , Sophielouise Mach
CPC classification number: B81C1/00158 , B81B3/0021 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C2201/016 , B81C2201/0132 , H04R3/00
Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.
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公开(公告)号：US20230375424A1
公开(公告)日：2023-11-23
申请号：US18247926
申请日：2021-11-15
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Peter Schmollngruber , Thomas Friedrich
CPC classification number: G01L9/0072 , G01L19/14
Abstract: A sensor device. The sensor device includes a housing component with a gas-tight internal volume, at least one electrode structure arranged in the internal volume in an adjustable and/or bendable manner, at least one counter electrode fixedly disposed on and/or in the housing component, and an electronic device configured to apply an electrical excitation voltage signal between the electrode structure and the counter electrode such that the at least one electrode structure is set in an oscillating motion relative to the housing component. The electronic device is configured to detect and/or determine the internal pressure in the internal volume and/or a change in the internal pressure while taking into consideration at least one sensor signal, which is dependent on an electric voltage or capacitance between the electrode structure and the counter electrode.
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Patent Agency Ranking
35.发明授权公开(公告)号：US11788912B2
公开(公告)日：2023-10-17
申请号：US16972588
申请日：2019-06-28
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Peter Schmollngruber
CPC classification number: G01L9/0048 , B81B3/0021 , B81C1/00182 , G01L9/005 , G01L9/0073 , G01L19/145 , B81B2201/0264 , B81B2203/0118 , B81B2203/0127 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81C2201/013 , B81C2201/0105
Abstract: A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure.
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36.发明公开公开(公告)号：US20230242393A1
公开(公告)日：2023-08-03
申请号：US18043374
申请日：2021-08-18
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Peter Schmollngruber , Thomas Friedrich
CPC classification number: B81B3/0086 , B81B3/001 , B81C1/00968 , B81C1/00698 , B81B2201/0228 , B81B2201/0257 , B81B2201/0264 , B81B2203/04 , B81C2201/0105 , B81B2201/0221
Abstract: A micromechanical component for a sensor or microphone device. An electrode surface of a first electrode structure is aligned with a second electrode structure. A substructure of the first electrode structure is entirely made of at least one electrically conductive material. The electrode surface and an opposite surface of the first electrode structure are outer surfaces of the substructure. A stop structure protruding from the electrode surface towards the second electrode structure is formed on the first electrode structure. The first electrode structure includes an insulating region which extends from the electrode surface to the opposite surface of the first electrode structure. The stop structure is formed either as a projection of the at least one insulating region protruding from the electrode surface towards the second electrode structure or is bordered by the at least one insulating region.
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公开(公告)号：US20220003621A1
公开(公告)日：2022-01-06
申请号：US17282736
申请日：2019-12-18
Applicant: Robert Bosch GmbH
Inventor： Thomas Friedrich , Christoph Hermes , Hans Artmann , Heribert Weber , Peter Schmollngruber , Volkmar Senz
Abstract: A micromechanical component for a capacitive pressure sensor device, including a diaphragm that is stretched with the aid of a frame structure in such a way that a cantilevered area of the diaphragm spans a framed partial surface, and including a reinforcement structure that is formed at the cantilevered area. A first spatial direction oriented in parallel to the framed partial surface is definable in which the cantilevered area has a minimal extension, and a second spatial direction oriented in parallel to the framed partial surface and oriented perpendicularly with respect to the first spatial direction is definable in which the cantilevered area has a greater extension. The reinforcement structure is present at a first distance from the frame structure in the first spatial direction, and at a second distance in the second spatial direction, the second distance being greater than the first distance.
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公开(公告)号：US20210354978A1
公开(公告)日：2021-11-18
申请号：US17315975
申请日：2021-05-10
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Joachim Fritz , Peter Schmollngruber , Sophielouise Mach , Thomas Friedrich
IPC: B81B3/00
Abstract: A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.
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公开(公告)号：US20210292160A1
公开(公告)日：2021-09-23
申请号：US17265451
申请日：2019-09-24
Applicant: Robert Bosch GmbH
Inventor： Friedjof Heuck , Jochen Tomaschko , Peter Schmollngruber , Thomas Friedrich , Volkmar Senz , Franziska Rohlfing
Abstract: A method for producing a wafer connection between a first and a second wafer. The method includes providing a first and second material for forming a eutectic alloy, providing a first wafer having a receiving structure for a die structure, filling the receiving structure with the first material, providing a second wafer having a die structure, the second material being situated on the die structure, providing a stop structure on the first and/or second wafer, so that when the two wafers are joined, a defined stop is provided, heating the first and second material at least to the eutectic temperature of the eutectic alloy, joining the first and second wafer so that the die structure is at least partly introduced into the receiving structure, the stop structure, the receiving structure, the die structure.
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