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55 条记录 (耗时 0.032 秒)

    Large area transducer array
    32.
    发明授权
    Large area transducer array 有权
    大面积换能器阵列

    公开(公告)号：US07375420B2

    公开(公告)日：2008-05-20

    申请号：US11003054

    申请日：2004-12-03

    申请人： Rayette Ann Fisher ,  William Edward Burdick, Jr. ,  James Wilson Rose

    发明人： Rayette Ann Fisher ,  William Edward Burdick, Jr. ,  James Wilson Rose

    IPC分类号： H01L23/02

    CPC分类号： H01L27/14601

    摘要： A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a two-dimensional transducer array in the X-Y plane, a plurality of connectors disposed on the backside of the substrate where the connectors are electrically coupled to the transducer elements. Further, a stacked transducer array comprising an electronic device disposed in a first layer, a substrate including a front side and a backside, an electrical interconnect layer disposed on the substrate and a plurality of transducers disposed in a third layer where the transducers are electrically coupled to the electronic device disposed in the first layer.

    摘要翻译： 一种大面积传感器阵列，包括具有正面和背面的基底，多个换能器，设置在基板的前侧，并以XY平面中的二维换能器阵列的形式图案化，多个连接器被设置 在衬底的背面，其中连接器电耦合到换能器元件。 此外，堆叠的换能器阵列包括设置在第一层中的电子器件，包括正面和背面的衬底，设置在衬底上的电互连层和设置在第三层中的多个换能器，其中换能器电耦合 到设置在第一层中的电子设备。

    Amorphous hydrogenated carbon hermetic structure fabrication method
    35.
    发明授权
    Amorphous hydrogenated carbon hermetic structure fabrication method 失效
    无定形氢化碳密封结构制造方法

    公开(公告)号：US06548329B1

    公开(公告)日：2003-04-15

    申请号：US09561870

    申请日：2000-05-01

    申请人： Richard Joseph Saia ,  Kevin Matthew Durocher ,  James Wilson Rose

    发明人： Richard Joseph Saia ,  Kevin Matthew Durocher ,  James Wilson Rose

    IPC分类号： H01L2156

    CPC分类号： H01L23/49894 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    摘要： A hard layer of amorphous hydrogenated carbon (DLC) overlies a polymer film structure and a plurality of soft layers of DLC alternate with a plurality of hard layers of DLC over the barrier base to form a corrosion resistant structure. The polymer film structure and a circuit chip can be elements of a circuit module. The DLC and the polymer film structure can have vias extending to contact pads, and a pattern of electrical conductors can extend through the vias to the contact pads. In one embodiment the DLC forms a hermetic (and therefore corrosion resistant) seal over the polymer film structure.

    摘要翻译： 无定形氢化碳（DLC）的硬层覆盖聚合物膜结构，并且DLC的多个软层与阻挡基底上的多个DLC硬层交替以形成耐腐蚀结构。 聚合物膜结构和电路芯片可以是电路模块的元件。 DLC和聚合物膜结构可以具有延伸到接触焊盘的通孔，并且电导体的图案可以延伸穿过通孔到接触焊盘。 在一个实施方案中，DLC在聚合物膜结构上形成密封（因此是耐腐蚀的）密封。

    Detector array with a through-via interposer
    37.
    发明授权
    Detector array with a through-via interposer 有权
    带有通孔插入器的检测器阵列

    公开(公告)号：US08575558B2

    公开(公告)日：2013-11-05

    申请号：US12956139

    申请日：2010-11-30

    申请人： John Eric Tkaczyk ,  James Wilson Rose ,  Jonathan David Short ,  Charles Gerard Woychik

    发明人： John Eric Tkaczyk ,  James Wilson Rose ,  Jonathan David Short ,  Charles Gerard Woychik

    IPC分类号： G01T1/24

    CPC分类号： H01L31/085 ,  A61B6/4233 ,  G01T1/243 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14636 ,  H01L27/14661 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.

    摘要翻译： 提出了一种形成传感器堆叠的方法。 该方法包括提供具有第一侧和第二侧的衬底。 此外，该方法包括在衬底的第一侧上设置具有第一侧和第二侧的集成电路，其中集成电路包括设置在集成电路的第一侧上的第一多个接触焊盘。 该方法还包括提供具有多个传感器元件的传感器阵列，其中每个传感器元件具有第一侧和第二侧，并且其中传感器阵列包括设置在传感器的第二侧上的第二多个接触垫 数组。 此外，该方法包括设置具有一个或多个中介层元件和一个或多个通孔的插入件，该通孔设置在传感器阵列的一个或多个传感器元件与集成电路之间，以将传感器阵列远离集成的第一侧 电路，使得所述一个或多个传感器元件的平面在局部垂直于传感器堆叠法线，其中所述插入器被配置为将所述传感器阵列中的所述传感器元件的第二侧可操作地耦合到所述集成电路的第一侧。 此外，该方法包括将集成电路的第一侧上的第一多个接触焊盘操作地耦合到传感器阵列的第二侧上的第二多个接触焊盘，以形成可瓦片传感器堆叠。

    DETECTOR ARRAY WITH A THROUGH-VIA INTERPOSER
    39.
    发明申请
    DETECTOR ARRAY WITH A THROUGH-VIA INTERPOSER 有权
    检测器阵列与通过间断器通过

    公开(公告)号：US20120133054A1

    公开(公告)日：2012-05-31

    申请号：US12956139

    申请日：2010-11-30

    申请人： John Eric Tkaczyk ,  James Wilson Rose ,  Jonathan David Short ,  Charles Gerard Woychik

    发明人： John Eric Tkaczyk ,  James Wilson Rose ,  Jonathan David Short ,  Charles Gerard Woychik

    IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L21/02

    CPC分类号： H01L31/085 ,  A61B6/4233 ,  G01T1/243 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14636 ,  H01L27/14661 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.

    摘要翻译： 提出了一种形成传感器堆叠的方法。 该方法包括提供具有第一侧和第二侧的衬底。 此外，该方法包括在衬底的第一侧上设置具有第一侧和第二侧的集成电路，其中集成电路包括设置在集成电路的第一侧上的第一多个接触焊盘。 该方法还包括提供具有多个传感器元件的传感器阵列，其中每个传感器元件具有第一侧和第二侧，并且其中传感器阵列包括设置在传感器的第二侧上的第二多个接触垫 数组。 此外，该方法包括设置具有一个或多个中介层元件和一个或多个通孔的插入件，该通孔设置在传感器阵列的一个或多个传感器元件与集成电路之间，以将传感器阵列远离集成的第一侧 电路，使得所述一个或多个传感器元件的平面在局部垂直于传感器堆叠法线，其中所述插入器被配置为将所述传感器阵列中的所述传感器元件的第二侧可操作地耦合到所述集成电路的第一侧。 此外，该方法包括将集成电路的第一侧上的第一多个接触焊盘操作地耦合到传感器阵列的第二侧上的第二多个接触焊盘，以形成可瓦片传感器堆叠。

    Interface assembly for thermally coupling a data acquisition system to a sensor array
    40.
    发明授权
    Interface assembly for thermally coupling a data acquisition system to a sensor array 有权
    用于将数据采集系统热耦合到传感器阵列的接口组件

    公开(公告)号：US07586096B2

    公开(公告)日：2009-09-08

    申请号：US11560873

    申请日：2006-11-17

    申请人： Oliver Richard Astley ,  James Wilson Rose ,  Joe James Lacey ,  Jonathan David Short ,  Ashutosh Joshi

    发明人： Oliver Richard Astley ,  James Wilson Rose ,  Joe James Lacey ,  Jonathan David Short ,  Ashutosh Joshi

    IPC分类号： G01T1/24

    CPC分类号： G01T1/17 ,  G01T1/2985

    摘要： An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

    摘要翻译： 提供了一种用于传感器阵列的接口组件。 接口组件可以由热耦合到传感器阵列的集成电路封装构成。 接口组件可以包括用于控制传感器阵列的温度的温度控制系统。 温度控制系统包括温度传感器，用于感测传感器阵列的每个传感器的温度变化从初始温度超过预定阈值。 温度控制器耦合到每个温度传感器，并且在传感器温度变化超过预定阈值时从温度传感器接收输出信号。 温度校正装置耦合到每个温度控制器，并且在从温度控制器接收到控制信号时使传感器温度变化落在预定阈值内。