公开(公告)号：US08119206B2

公开(公告)日：2012-02-21

申请号：US12437263

申请日：2009-05-07

申请人： Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  Joseph Zinter, Jr. ,  Michael J. Rooks ,  Brian Richard Sundolf ,  Jon Alfred Casey

发明人： Gareth Geoffrey Hougham ,  Xiao Hu Liu ,  S. Jay Chey ,  Joseph Zinter, Jr. ,  Michael J. Rooks ,  Brian Richard Sundolf ,  Jon Alfred Casey

IPC分类号： B05D1/36

CPC分类号： H01R13/2414 ,  B32B15/08 ,  H01R43/007 ,  H05K1/0271 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0218 ,  H05K2201/068 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/12535 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/31609

摘要： A method of forming a negative coefficient of thermal expansion particle includes flattening a hollow sphere made of a first material, annealing the flattened hollow sphere at a reference temperature above a predetermined maximum use temperature to set a stress minimum of the flattened hollow sphere, and forming a coating made of a second material on the flattened hollow sphere at the reference temperature, the second material having a lower coefficient of thermal expansion than that of the first material, the negative coefficient of thermal expansion particle characterized by volumetric contraction when heated.

摘要翻译： 形成负系数的热膨胀粒子的方法包括使由第一材料制成的中空球平坦化，在高于预定最大使用温度的基准温度下退火扁平空心球以设定扁平中空球的应力最小值，以及形成 在参考温度下在平坦的中空球体上由第二材料制成的涂层，第二材料具有比第一材料的热膨胀系数低的热膨胀系数，其特征在于加热时的体积收缩。

公开(公告)号：US20110037489A1

公开(公告)日：2011-02-17

申请号：US12540487

申请日：2009-08-13

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

IPC分类号： G01R31/02 ,  C23F1/00 ,  G03F7/20

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

公开(公告)号：US20090263991A1

公开(公告)日：2009-10-22

申请号：US12497903

申请日：2009-07-06

申请人： Gareth Geoffrey Hougham ,  S. Jay Chey ,  James Patrick Doyle ,  Xiao Hu Liu ,  Christopher V. Jahnes ,  Paul Alfred Lauro ,  Nancy C. LaBianca ,  Michael J. Rooks

发明人： Gareth Geoffrey Hougham ,  S. Jay Chey ,  James Patrick Doyle ,  Xiao Hu Liu ,  Christopher V. Jahnes ,  Paul Alfred Lauro ,  Nancy C. LaBianca ,  Michael J. Rooks

IPC分类号： H01R4/58 ,  B32B37/02

CPC分类号： B81B3/0035 ,  H01L2924/0002 ,  Y10T428/249986 ,  H01L2924/00

摘要： A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.

摘要翻译： 一种制造负热膨胀系统装置的方法包括用可热分解的聚合物涂覆晶片，将可分解的聚合物图案化成重复的圆盘图案，将可分解的聚合物从晶片上释放出来并形成一张重复图案的圆盘，将薄片悬挂在 用于无电解分解的接种化合物的第一溶液，从第一溶液中除去片材，将片材悬浮在第二溶液中以将第一层材料无电沉积到片材上，从第二溶液中除去片材，将片材悬浮在第三溶液中 沉积具有比第一层材料低的TCE值的第二层材料，将图案化的盘彼此分离，并对图案化的盘进行热退火以分解可分解聚合物并产生空腔以代替可分解的聚合物。

公开(公告)号：US07456640B2

公开(公告)日：2008-11-25

申请号：US11355726

申请日：2006-02-16

申请人： Ronald Richard Breton ,  S. Jay Chey ,  Steven Alan Cordes ,  Matthew Farinelli ,  Michael David Fregeau ,  Sherif Ahmed Goma ,  Gene T. Patrick ,  Mohammed S. Shaikh

发明人： Ronald Richard Breton ,  S. Jay Chey ,  Steven Alan Cordes ,  Matthew Farinelli ,  Michael David Fregeau ,  Sherif Ahmed Goma ,  Gene T. Patrick ,  Mohammed S. Shaikh

IPC分类号： G01R31/02

CPC分类号： G01R1/07378 ,  G01R31/2863

摘要： An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate including a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

摘要翻译： 一种用于测试集成电路装置的装置包括具有多个探针的探针装置，包括具有第一表面的产品基底的第一基底和设置在其第一表面上的电触点阵列，以及设置在探针和 用于将探针电耦合到布置在产品基板的第一表面上的相应的电触点的第一基板。

公开(公告)号：US07130141B2

公开(公告)日：2006-10-31

申请号：US10401565

申请日：2003-03-31

申请人： S. Jay Chey ,  Hendrik F. Hamann ,  Martin Patrick O'Boyle ,  H. Kumar Wickramasinghe

发明人： S. Jay Chey ,  Hendrik F. Hamann ,  Martin Patrick O'Boyle ,  H. Kumar Wickramasinghe

IPC分类号： H05B1/02 ,  G11B5/02

CPC分类号： G11B5/3136 ,  G11B5/10 ,  G11B5/1871 ,  G11B5/58 ,  G11B5/60 ,  G11B5/6011 ,  G11B5/6064 ,  G11B9/00 ,  G11B11/00 ,  G11B11/16 ,  G11B2005/001 ,  G11B2005/0013 ,  G11B2005/0021

摘要： An information processing assembly includes at least one heater suitable for information processing, and a controller for controlling the at least one heater by at least one of adjusting a power to the at least one heater to match a target power level, and changing a polarity of an electrical current supplied to the heater.

摘要翻译： 信息处理组件包括至少一个适于信息处理的加热器，以及控制器，用于通过至少一个调节至少一个加热器的功率以匹配目标功率电平来控制至少一个加热器，以及改变至少一个加热器的极性 提供给加热器的电流。

公开(公告)号：US09335346B2

公开(公告)日：2016-05-10

申请号：US13608706

申请日：2012-09-10

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G01R1/067

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

公开(公告)号：US08595919B2

公开(公告)日：2013-12-03

申请号：US13095973

申请日：2011-04-28

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Kang-I Tsang

IPC分类号： B23P19/00

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

摘要翻译： 提供了一种用于晶片的晶片级测试探针中的硅芯座，包括主体，第一和第二相对面以及通过主体形成的通孔阵列，以在第一和第二面之间延伸通过 分别与第一和第二表面上的每个通孔相关联的引线对可彼此电连接。

公开(公告)号：US20120329295A1

公开(公告)日：2012-12-27

申请号：US13608706

申请日：2012-09-10

申请人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

发明人： S. Jay Chey ,  Dustin M. Fregeau ,  Donna S. Zupanski-Nielsen ,  Aparna Prabhakar ,  Pavan Samudrala ,  Mohammed S. Shaikh

IPC分类号： H05K1/02

CPC分类号： G01R1/06716 ,  G01R1/06733 ,  G01R1/06755 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

摘要翻译： 电连接包括由导电材料制成的第一电接触。 第一电触点在其中形成凹陷。 还包括具有小于1,000,000psi的杨氏模量的可变形垫，其承载在第一接触件上; 以及由导电材料制成的第二电接触件，其接触所述第一电触头并且至少部分地容纳在所述凹部中。 可变形焊盘至少部分地在第一电触头上引起至少一个横向力，以便引起第一电触点与第二电触点电连接。 还设想了这种接触件的阵列，悬臂接触件阵列也可以具有或不具有凹陷，并且由至少一个弹性垫支撑，杨氏模量小于72,500psi。

公开(公告)号：US20110199109A1

公开(公告)日：2011-08-18

申请号：US13095973

申请日：2011-04-28

申请人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

发明人： S. Jay Chey ,  Timothy C. Krywanczyk ,  Mohammed S. Shaikh ,  Matthew T. Tiersch ,  Cornelia Tsang

IPC分类号： G01R31/02 ,  G01R1/067

CPC分类号： G01R3/00 ,  G01R1/07378

摘要： A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

摘要翻译： 提供了一种用于晶片的晶片级测试探针中的硅芯座，包括主体，第一和第二相对面以及通过主体形成的通孔阵列，以在第一和第二面之间延伸通过 分别与第一和第二表面上的每个通孔相关联的引线对可彼此电连接。

公开(公告)号：US07883919B2

公开(公告)日：2011-02-08

申请号：US12497903

申请日：2009-07-06

申请人： Gareth Geoffrey Hougham ,  S. Jay Chey ,  James Patrick Doyle ,  Xiao Hu Liu ,  Christopher V. Jahnes ,  Paul Alfred Lauro ,  Nancy C. LaBianca ,  Michael J. Rooks

发明人： Gareth Geoffrey Hougham ,  S. Jay Chey ,  James Patrick Doyle ,  Xiao Hu Liu ,  Christopher V. Jahnes ,  Paul Alfred Lauro ,  Nancy C. LaBianca ,  Michael J. Rooks

IPC分类号： H01L21/00 ,  H01L21/30 ,  H01L21/44

CPC分类号： B81B3/0035 ,  H01L2924/0002 ,  Y10T428/249986 ,  H01L2924/00

摘要： A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.

摘要翻译： 一种制造负热膨胀系统装置的方法包括用可热分解的聚合物涂覆晶片，将可分解的聚合物图案化成重复的圆盘图案，将可分解的聚合物从晶片上释放出来并形成一张重复图案的圆盘，将薄片悬挂在 用于无电解分解的接种化合物的第一溶液，从第一溶液中除去片材，将片材悬浮在第二溶液中以将第一层材料无电沉积到片材上，从第二溶液中除去片材，将片材悬浮在第三溶液中 沉积具有比第一层材料低的TCE值的第二层材料，将图案化的盘彼此分离，并对图案化的盘进行热退火以分解可分解聚合物并产生空腔以代替可分解的聚合物。