公开(公告)号：US20210005384A1

公开(公告)日：2021-01-07

申请号：US16809917

申请日：2020-03-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Taek Jung LEE ,  Min Gon LEE ,  Jin Kyung JOO ,  Ji Hong JO ,  Jae Yeol CHOI

IPC: H01G4/236 ,  H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12

Abstract: A multilayer ceramic capacitor has a body including first and second internal electrodes laminated with a dielectric layer interposed therebetween, and having fifth and sixth surfaces opposing each other, third and fourth surfaces opposing each other, and first and second surfaces opposing each other. A first through-electrode penetrates through the body to be connected to the first internal electrode, and a second through-electrode penetrates through the body to be connected to the second internal electrode. First and second external electrodes are disposed on the first and second surfaces, respectively, and third and fourth external electrodes are disposed on the first and second surfaces, respectively, to be spaced apart from the first and second external electrodes. Each of the first to fourth external electrodes is a respective sintered electrode including nickel.

公开(公告)号：US20190172645A1

公开(公告)日：2019-06-06

申请号：US16270745

申请日：2019-02-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Pil LEE ,  Hyo Youn LEE ,  Sung Kwon AN ,  Seung Woo SONG ,  Taek Jung LEE ,  Jin Kyung JOO

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/248 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10636

Abstract: A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.

公开(公告)号：US20190148068A1

公开(公告)日：2019-05-16

申请号：US16018767

申请日：2018-06-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Pil LEE ,  Jin Kyung JOO ,  Young Key KIM ,  Taek Jung LEE

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/38 ,  H01G4/30

Abstract: A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be electrically connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to thereby be electrically connected to the third internal electrode; and a third external electrode disposed on the body to be electrically connected to the connection electrode.

公开(公告)号：US20180068794A1

公开(公告)日：2018-03-08

申请号：US15487997

申请日：2017-04-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Taek Jung LEE ,  Jin Kyung JOO ,  Hyo Youn LEE ,  Won Young LEE ,  Sung Kwon AN ,  Jae Yeol CHOI ,  Jin Man JUNG

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/236 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01G4/236

Abstract: A capacitor component includes a plurality of unit laminates, each comprising a body with a stacked structure including a plurality of internal electrodes and connection electrodes that extend in a stacking direction of the body and electrically connect to the plurality of internal electrodes, and pad portions between adjacent unit laminates to electrically connect the respective connection electrodes of the unit laminates above and below the pad portions to each other.

公开(公告)号：US20180027656A1

公开(公告)日：2018-01-25

申请号：US15449147

申请日：2017-03-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Man JUNG ,  Jin Kyung JOO ,  Ik Hwan CHANG ,  Taek Jung LEE ,  Won Young LEE ,  Yong Won SEO ,  Jin Woo CHUN

IPC: H05K1/18 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/10015 ,  Y02P70/611 ,  Y02P70/613

Abstract: A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1×Td and D2×Td are greater than 20 μm2, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.

公开(公告)号：US20160007486A1

公开(公告)日：2016-01-07

申请号：US14754261

申请日：2015-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Suk KIM ,  Taek Jung LEE ,  Byeung Gyu CHANG ,  Doo Young KIM ,  Byoung Hwa LEE

IPC: H05K5/00 ,  H05K3/00 ,  H05K3/30 ,  H05K5/04

CPC classification number: H05K3/30 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/52 ,  H01L23/055 ,  H01L23/24 ,  H01L23/31 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/181 ,  H05K5/0095 ,  H01L2924/00012

Abstract: There is provided a package substrate including: a substrate on which a circuit layer and an insulating layer are stacked; a metal post provided in an outside region of at least any one of an upper surface and a lower surface of the substrate; an electronic component mounted in a cavity formed by the metal post; and a metal lid bonded to an upper portion of the metal post.

Abstract translation: 提供一种封装基板，包括：基板，其上层叠有电路层和绝缘层; 设置在所述基板的上表面和下表面中的至少任一个的外部区域中的金属柱; 安装在由所述金属柱形成的空腔中的电子部件; 以及金属盖，其结合到金属柱的上部。