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公开(公告)号：US09472429B2
公开(公告)日：2016-10-18
申请号：US14339867
申请日：2014-07-24
发明人： Shingo Eguchi , Yohei Monma , Atsuhiro Tani , Misako Hirosue , Kenichi Hashimoto , Yasuharu Hosaka
CPC分类号： H01L21/67132 , H01L21/02244 , H01L21/02252 , H01L21/67092 , H01L21/707 , H01L27/1266
摘要： An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate, the release layer and the element formation layer are formed. The support base material which can be peeled later is fixed to the upper surface of the element formation layer. The element formation layer is transformed through the support base material, and peeling is generated at an interface between the element formation layer and the release layer. Peeling is performed while the liquid is being supplied so that the element formation layer and the release layer which appear sequentially by peeling are wetted with the liquid such as pure water. Electric charge generated on the surfaces of the element formation layer and the release layer can be diffused by the liquid, and discharge by peeling electrification can be eliminated.
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公开(公告)号：US20150325812A1
公开(公告)日：2015-11-12
申请号：US14802642
申请日：2015-07-17
发明人： Shunpei Yamazaki , Shingo Eguchi
CPC分类号： H01L51/5256 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3276 , H01L51/0097 , H01L51/5237 , H01L51/5246 , H01L2251/5338 , H01L2251/558
摘要： A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
摘要翻译： 提供了高度可靠的发光装置。 由于外部施加的物理力量对元件的损害被抑制。 或者，在FPC的压接过程中，抑制由于热而与柔性基板接触的树脂和布线的损坏。 当包含有机EL元件的柔性发光器件变形时，不产生应力应变的中性平面位于晶体管和有机EL元件附近。 或者，发光装置的最外表面的硬度高。 或者，使用具有10ppm / K以下的热膨胀系数的基板作为与与FPC连接的端子部分重叠的基板。
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公开(公告)号：US20150301388A1
公开(公告)日：2015-10-22
申请号：US14732960
申请日：2015-06-08
发明人： Shingo Eguchi , Yutaka Shionoiri
IPC分类号： G02F1/1343 , G02F1/1333 , G02F1/1335
CPC分类号： G02F1/13439 , G02F1/133345 , G02F1/133514 , G02F1/133555 , G02F1/136227 , G02F2001/136222
摘要： An object of the present invention is to provide a transflective liquid crystal display device having an excellent visibility obtained by optimizing the arrangement of a color filter, which would become a problem in the process of fabricating transparent and reflective liquid crystal display devices, for the transflective liquid crystal display device. In the present invention, the arrangement of a color filter is optimized for improving the visibility of the transflective liquid crystal display device. In addition, the structure, which allows the formation of color filters without increasing the capacitance that affects on a display, is fabricated. Furthermore, in the process of fabricating the transflective liquid crystal display device, an uneven structure is additionally formed without particularly increasing an additional patterning step for the formation of such an uneven structure.
摘要翻译： 本发明的目的是提供一种半透射型液晶显示装置，其具有通过优化滤色器的布置而获得的良好的可见度，该滤色器在制造透明和反射型液晶显示装置的过程中将成为半透反射 液晶显示装置。 在本发明中，为了提高半透射型液晶显示装置的可视性，优化滤色器的配置。 此外，制造了允许形成滤色器而不增加影响显示器的电容的结构。 此外，在制造半透射型液晶显示装置的过程中，另外形成不均匀结构，而不特别增加用于形成这种不均匀结构的附加图案化步骤。
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公开(公告)号：US09111195B2
公开(公告)日：2015-08-18
申请号：US13958816
申请日：2013-08-05
发明人： Tomoyuki Aoki , Susumu Sekiguchi , Shingo Eguchi
CPC分类号： G06K19/07794 , G06K19/077 , G06K19/07773 , H01F5/003 , H01F41/041 , H01Q1/2225 , H01Q7/00 , Y10T29/49016 , Y10T29/49018
摘要： In an antenna and a semiconductor device including the antenna, an object is to reduce the distance between electrodes of a capacitor as much as possible, reduce the area of the electrode of the capacitor as much as possible, and prevent the suppression of response sensitivity and a response range of the semiconductor device. The present invention relates to an antenna including an antenna coil provided over a first region of a base and a capacitor which uses a second region of the base as a dielectric body and which has electrodes provided for opposite planes of the second region of the base, wherein the second region of the base is thinner than the first region of the base, and also relates to a semiconductor device including the antenna.
摘要翻译： 在包括天线的天线和半导体装置中，目的是尽可能地减小电容器的电极之间的距离，尽可能地减小电容器的电极的面积，并且防止响应灵敏度的抑制， 半导体器件的响应范围。 本发明涉及一种天线，包括设置在基座的第一区域上的天线线圈和使用基座的第二区域作为电介质体的电容器，并且具有设置在基座的第二区域的相对平面的电极， 其中所述基座的所述第二区域比所述基底的所述第一区域薄，并且还涉及包括所述天线的半导体器件。
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公开(公告)号：US09055654B2
公开(公告)日：2015-06-09
申请号：US13716113
申请日：2012-12-15
发明人： Shunpei Yamazaki , Shingo Eguchi
IPC分类号： H05B33/10
CPC分类号： H05B33/10
摘要： A film formation apparatus with which a deposited film to cover a deposition object having a three-dimensional curved surface can be formed and a method of forming a deposited film to cover a three-dimensional curved surface. The film formation apparatus includes a deposition source having deposition directivity, a deposition-source-moving mechanism which moves the deposition source, a deposition-object-holding mechanism which holds a deposition object having a three-dimensional curved surface, a deposition-direction-changing mechanism which changes the deposition direction, and a control portion which controls the deposition-source-moving mechanism and the deposition-direction-changing mechanism.
摘要翻译： 可以形成用于覆盖具有三维曲面的沉积物体的沉积膜的成膜装置和形成沉积膜以覆盖三维曲面的方法。 成膜装置包括具有沉积方向性的沉积源，移动沉积源的沉积源移动机构，保持具有三维曲面的沉积物的沉积物保持机构，沉积方向 - 改变沉积方向的改变机构，以及控制沉积源移动机构和沉积方向改变机构的控制部分。
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公开(公告)号：US20140138711A1
公开(公告)日：2014-05-22
申请号：US14162042
申请日：2014-01-23
发明人： Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
IPC分类号： H01L33/48
CPC分类号： H01L51/5246 , H01L27/14609 , H01L27/1463 , H01L27/14689 , H01L27/322 , H01L27/3244 , H01L27/3276 , H01L33/08 , H01L33/48 , H01L51/5243 , H01L51/5253 , H01L51/5278 , H01L2227/323 , H01L2251/5338 , H01L2251/5361 , H05B33/04 , H05B33/10 , H05B33/22
摘要： It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.
摘要翻译： 本发明的目的是以简单的方式提供具有高可靠性的柔性发光装置。 此外，其目的是提供一种每个安装有发光装置的电子装置或照明装置。 通过使用具有以下结构的发光装置，可以获得高可靠性的发光装置：包括发光元件的元件部分介于具有柔性的基板和相对于 可见光和金属基板; 并且设置在元件部分之上和之下的绝缘层在元件部分的外周彼此接触以密封元件部分。 此外，通过使用具有这种结构的发光装置安装电子装置或照明装置，可以获得具有高可靠性的电子装置或照明装置。
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公开(公告)号：US20240306423A1
公开(公告)日：2024-09-12
申请号：US18271350
申请日：2022-01-06
发明人： Shunpei Yamazaki , Shingo Eguchi , Hideki UOCHI
IPC分类号： H10K50/858 , H10K50/115 , H10K50/826
CPC分类号： H10K50/858 , H10K50/115 , H10K50/826
摘要： Provided is a novel light-emitting element. The light-emitting element includes an anode, an EL layer over the anode, and a cathode over the EL layer; a first layer is adjacent to a side surface of the EL layer, and a first portion is adjacent to the side surface of the first layer. The EL layer and the first portion are adjacent to each other with the first layer therebetween. A refractive index of the first portion is lower than a refractive index of the first layer. An angle θ between a bottom surface and the side surface of the EL layer is larger than 90°.
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公开(公告)号：US11899296B2
公开(公告)日：2024-02-13
申请号：US17889425
申请日：2022-08-17
发明人： Shingo Eguchi , Hideaki Kuwabara , Kazune Yokomizo
IPC分类号： G02F1/1333 , G06F9/30 , G06F9/46 , G09F9/30 , G09F9/46 , H01L29/786 , H05B33/02 , H10K59/50 , H10K50/11 , H10K102/00 , H05B33/14 , H05B33/22
CPC分类号： G02F1/133308 , G02F1/1333 , G09F9/30 , G09F9/301 , G09F9/46 , H01L29/786 , H01L29/78603 , H05B33/02 , H10K50/11 , H10K59/50 , H05B33/14 , H05B33/22 , H10K2102/311
摘要： A semiconductor device including a large display portion with improved portability is provided. The display device includes a first display panel, a second display panel, and an adhesive layer. The area of the second display panel is larger than the area of the first display panel. The first display panel includes a first substrate, a second substrate, and a reflective liquid crystal element and a first transistor each positioned between the first substrate and the second substrate. The second display panel includes a first resin layer having flexibility, a second resin layer having flexibility, and a light-emitting element and a second transistor each positioned between the first resin layer and the second resin layer. The liquid crystal element has a function of reflecting light toward the second substrate side. The light-emitting element has a function of emitting light toward the second resin layer side. The first substrate and part of the second resin layer are bonded to each other with the adhesive layer.
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39.发明授权公开(公告)号：US11710760B2
公开(公告)日：2023-07-25
申请号：US16896521
申请日：2020-06-09
发明人： Koji Kusunoki , Shingo Eguchi , Takayuki Ikeda
IPC分类号： H01L27/15 , H01L33/50 , H01L33/62 , H01L29/66 , H01L29/786
CPC分类号： H01L27/153 , H01L29/66969 , H01L29/7869 , H01L33/505 , H01L33/62 , H01L2933/0041 , H01L2933/0066
摘要： One embodiment of the present invention is a display device including a first insulating layer, a second insulating layer, a first transistor, a second transistor, a first light-emitting diode, a second light-emitting diode, and a color conversion layer. The first insulating layer is over the first transistor and the second transistor. The first light-emitting diode and the second light-emitting diode are over the first insulating layer. The color conversion layer is over the second light-emitting diode. The color conversion layer is configured to convert light emitted from the second light-emitting diode into a light having a longer wavelength. The first transistor and the second transistor each include a metal oxide layer and a gate electrode. The metal oxide layer includes a channel formation region. A top surface of the gate electrode is level or substantially level with a top surface of the second insulating layer.
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公开(公告)号：US11635647B2
公开(公告)日：2023-04-25
申请号：US17889425
申请日：2022-08-17
发明人： Shingo Eguchi , Hideaki Kuwabara , Kazune Yokomizo
IPC分类号： G02F1/1333 , H01L29/786 , G09F9/46 , G09F9/30 , H01L27/32 , H05B33/02 , H01L51/50 , H05B33/14 , H05B33/22
摘要： A semiconductor device including a large display portion with improved portability is provided. The display device includes a first display panel, a second display panel, and an adhesive layer. The area of the second display panel is larger than the area of the first display panel. The first display panel includes a first substrate, a second substrate, and a reflective liquid crystal element and a first transistor each positioned between the first substrate and the second substrate. The second display panel includes a first resin layer having flexibility, a second resin layer having flexibility, and a light-emitting element and a second transistor each positioned between the first resin layer and the second resin layer. The liquid crystal element has a function of reflecting light toward the second substrate side. The light-emitting element has a function of emitting light toward the second resin layer side. The first substrate and part of the second resin layer are bonded to each other with the adhesive layer.
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