SEMICONDUCTOR MEMORY DEVICES
    31.
    发明公开

    公开(公告)号:US20230367672A1

    公开(公告)日:2023-11-16

    申请号:US18226622

    申请日:2023-07-26

    CPC classification number: G06F11/1068

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    SEMICONDUCTOR MEMORY DEVICES AND METHODS OF OPERATING SEMICONDUCTOR MEMORY DEVICES

    公开(公告)号:US20230168819A1

    公开(公告)日:2023-06-01

    申请号:US17842981

    申请日:2022-06-17

    CPC classification number: G06F3/0626 G06F3/064 G06F3/0679 G06F11/1068

    Abstract: A semiconductor memory device includes a buffer die and a plurality of memory dies. An error correction code (ECC) engine in one of the memory dies performs an RS encoding on a main data to generate a parity data and performs a RS decoding, using a parity check matrix, on the main data and the parity data. The parity check matrix includes sub matrixes and each of the sub matrixes corresponds to two different symbols. Each of the sub matrixes includes two identity sub matrixes and two same alpha matrixes, the two identity sub matrixes are disposed in a first diagonal direction of the sub matrix and the two same alpha matrixes are disposed in a second diagonal direction. A number of high-level value elements in a y-th row of the parity check matrix is the same as a number of high-level value elements in a (y+p)-th row.

    Memory controller and memory system including the same

    公开(公告)号:US11269723B2

    公开(公告)日:2022-03-08

    申请号:US16988931

    申请日:2020-08-10

    Abstract: A memory controller controls a memory module including data chips and first and second parity chips. The memory controller includes an error correction code (ECC) engine. The ECC engine includes an ECC decoder and a memory to store a parity check matrix. The ECC decoder receives error information signals associated with the data chips, performs an ECC decoding on a codeword set from the memory module using the parity check matrix to generate a first syndrome and a second syndrome, and corrects bit errors in a user data set based on the error information signals and the second syndrome. The bit errors are generated by a row fault and uncorrectable using the first syndrome and the second syndrome. Each of the error information signals includes row fault information indicating whether the row fault occurs in at least one of memory cell rows in corresponding one of the data chips.

    Semiconductor memory devices and memory systems

    公开(公告)号:US11170868B2

    公开(公告)日:2021-11-09

    申请号:US16864787

    申请日:2020-05-01

    Abstract: A semiconductor memory device includes a memory cell array and an interface circuit including an error correction code (ECC) engine. The memory cell array includes a plurality of volatile memory cells, a normal cell region and a parity cell region. The interface circuit, in a write operation, receives main data and first parity data from an external device, the first parity data being generated based on a first ECC and stores the main data in the normal cell region and the first parity data in the parity cell region. The interface circuit, in a read operation, performs an ECC decoding on the main data using a second ECC, based on the first parity data to correct a first type of error in the main data. The second ECC has a parity check matrix which is the same as a parity check matrix of the first ECC.

    MEMORY CONTROLLER AND MEMORY SYSTEM INCLUDING THE SAME

    公开(公告)号:US20210208967A1

    公开(公告)日:2021-07-08

    申请号:US16988931

    申请日:2020-08-10

    Abstract: A memory controller controls a memory module including data chips and first and second parity chips. The memory controller includes an error correction code (ECC) engine. The ECC engine includes an ECC decoder and a memory to store a parity check matrix. The ECC decoder receives error information signals associated with the data chips, performs an ECC decoding on a codeword set from the memory module using the parity check matrix to generate a first syndrome and a second syndrome, and corrects bit errors in a user data set based on the error information signals and the second syndrome. The bit errors are generated by a row fault and uncorrectable using the first syndrome and the second syndrome. Each of the error information signals includes row fault information indicating whether the row fault occurs in at least one of memory cell rows in corresponding one of the data chips.

    Memory device and refresh method thereof

    公开(公告)号:US12236996B2

    公开(公告)日:2025-02-25

    申请号:US18197084

    申请日:2023-05-14

    Abstract: A memory device may include counters respectively corresponding to rows and each configured to count a number of accesses to a corresponding row, a refresh control circuit, a queue, and first flags respectively corresponding to the rows. The refresh control circuit may change a second flag set in a refresh period every refresh period, and determine whether to put an incoming row address into the queue based on a count value of a counter corresponding to a target row indicated by the incoming row address among the counters, a first flag value of a first flag corresponding to the target row among the first flags, and a second flag value of the second flag set in a current refresh period.

    Semiconductor memory devices
    38.
    发明授权

    公开(公告)号:US12066893B2

    公开(公告)日:2024-08-20

    申请号:US18226622

    申请日:2023-07-26

    CPC classification number: G06F11/1068

    Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

    MEMORY CONTROLLERS AND MEMORY SYSTEMS INCLUDING THE SAME

    公开(公告)号:US20240178861A1

    公开(公告)日:2024-05-30

    申请号:US18339490

    申请日:2023-06-22

    CPC classification number: H03M13/1111 H03M13/611

    Abstract: A memory controller to control a memory module including a plurality of data chips, a first parity chip and a second parity chip, includes a system error correction code (ECC) engine and a processor to control the system ECC engine. The system ECC engine includes an ECC decoder and a memory to store a parity check matrix. The ECC decoder selects one of a plurality of ECC decoding schemes based on decoding status flags and corrects a plurality of symbol errors in a read codeword set from the memory module by performing an ECC decoding on the read codeword set based on the selected decoding scheme and the parity check matrix. The decoding status flags are provided from the plurality of data chips and each of the decoding status flags indicates whether at least one error bit is detected in respective one of the plurality of data chips.

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