SEMICONDUCTOR DEVICE
    32.
    发明申请

    公开(公告)号:US20190341495A1

    公开(公告)日:2019-11-07

    申请号:US16513826

    申请日:2019-07-17

    Abstract: To provide a transistor having a high on-state current. A semiconductor device includes a first insulator containing excess oxygen, a first oxide semiconductor over the first insulator, a second oxide semiconductor over the first oxide semiconductor, a first conductor and a second conductor which are over the second oxide semiconductor and are separated from each other, a third oxide semiconductor in contact with side surfaces of the first oxide semiconductor, a top surface and side surfaces of the second oxide semiconductor, a top surface of the first conductor, and a top surface of the second conductor, a second insulator over the third oxide semiconductor, and a third conductor facing a top surface and side surfaces of the second oxide semiconductor with the second insulator and the third oxide semiconductor therebetween. The first oxide semiconductor has a higher oxygen-transmitting property than the third oxide semiconductor.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20190035937A1

    公开(公告)日:2019-01-31

    申请号:US16024967

    申请日:2018-07-02

    Abstract: A semiconductor device having a reduced amount of oxygen vacancy in a channel formation region of an oxide semiconductor is provided. Further, a semiconductor device which includes an oxide semiconductor and has improved electric characteristics is provided. Furthermore, a methods for manufacturing the semiconductor device is provided. An oxide semiconductor film is formed; a conductive film is formed over the oxide semiconductor film at the same time as forming a low-resistance region between the oxide semiconductor film and the conductive film; the conductive film is processed to form a source electrode and a drain electrode; and oxygen is added to the low-resistance region between the source electrode and the drain electrode, so that a channel formation region having a higher resistance than the low-resistance region is formed and a first low-resistance region and a second low-resistance region between which the channel formation region is positioned are formed.

    SEMICONDUCTOR DEVICE
    37.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20150084044A1

    公开(公告)日:2015-03-26

    申请号:US14486179

    申请日:2014-09-15

    Abstract: Provided is a semiconductor device having a structure with which a decrease in electrical characteristics that becomes more significant with miniaturization can be suppressed. The semiconductor device includes a first oxide semiconductor film, a gate electrode overlapping with the first oxide semiconductor film, a first gate insulating film between the first oxide semiconductor film and the gate electrode, and a second gate insulating film between the first gate insulating film and the gate electrode. In the first gate insulating film, a peak appears at a diffraction angle 2θ of around 28° by X-ray diffraction. A band gap of the first oxide semiconductor film is smaller than a band gap of the first gate insulating film, and the band gap of the first gate insulating film is smaller than a band gap of the second gate insulating film.

    Abstract translation: 提供一种半导体器件,其具有可以抑制随着小型化而变得更显着的电特性的降低的结构。 半导体器件包括第一氧化物半导体膜,与第一氧化物半导体膜重叠的栅电极,第一氧化物半导体膜和栅极之间的第一栅极绝缘膜,以及在第一栅极绝缘膜和第二栅极绝缘膜之间的第二栅极绝缘膜 栅电极。 在第一栅极绝缘膜中,以衍射角2出现峰值; 通过X射线衍射测得约为28°。 第一氧化物半导体膜的带隙小于第一栅极绝缘膜的带隙,第一栅极绝缘膜的带隙小于第二栅极绝缘膜的带隙。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    38.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20150011046A1

    公开(公告)日:2015-01-08

    申请号:US14313145

    申请日:2014-06-24

    CPC classification number: H01L29/66969 H01L29/4908 H01L29/7869 H01L29/78696

    Abstract: A manufacturing method of a semiconductor device in which the threshold voltage is adjusted is provided. The semiconductor device includes a first semiconductor, an electrode electrically connected to the first semiconductor, a gate electrode, and an electron trap layer between the gate electrode and the first semiconductor. By performing heat treatment at higher than or equal to 125° C. and lower than or equal to 450° C. and, at the same time, keeping a potential of the gate electrode higher than a potential of the electrode for 1 second or more, the threshold voltage is increased.

    Abstract translation: 提供其中调整阈值电压的半导体器件的制造方法。 半导体器件包括第一半导体,电连接到第一半导体的电极,栅极电极和栅电极和第一半导体之间的电子陷阱层。 通过进行高于或等于125℃且低于或等于450℃的热处理,并且同时保持栅电极的电位高于电极的电位1秒以上 ,阈值电压增加。

    Display Device
    40.
    发明公开
    Display Device 审中-公开

    公开(公告)号:US20240155871A1

    公开(公告)日:2024-05-09

    申请号:US18280556

    申请日:2022-03-03

    CPC classification number: H10K59/121 H10K59/122 H10K59/35

    Abstract: A display device with high display quality is provided. A highly reliable display device is provided. A display device with low power consumption is provided. A display device that can easily achieve a higher resolution is provided. A display device with both high display quality and a high resolution is provided. A display device with high contrast is provided. The display device includes a first pixel, a second pixel arranged to be adjacent to the first pixel, and a first insulating layer; the first pixel includes a first pixel electrode, a first EL layer over the first pixel electrode, and a common electrode over the first EL layer; the second pixel includes a second pixel electrode, a second EL layer over the second pixel electrode, and the common electrode over the second EL layer; a side surface of the first EL layer and a side surface of the second EL layer each include a region in contact with the first insulating layer; a side surface of the first pixel electrode is covered with the first EL layer; and a side surface of the second pixel electrode is covered with the second EL layer.

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