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104 条记录 (耗时 0.05 秒)

    Backlight apparatus reduced in thickness
    34.
    发明授权
    Backlight apparatus reduced in thickness 失效
    背光装置的厚度减小

    公开(公告)号：US07195364B2

    公开(公告)日：2007-03-27

    申请号：US11059406

    申请日：2005-02-17

    申请人： Hun Joo Hahm ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Anh ,  Young Sam Park ,  Bum Jin Kim ,  Young June Jeong

    发明人： Hun Joo Hahm ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Anh ,  Young Sam Park ,  Bum Jin Kim ,  Young June Jeong

    IPC分类号： G01D11/28

    CPC分类号： G02B6/0068 ,  G02B6/0016 ,  G02B6/0043 ,  G02F1/133603

    摘要： In a backlight apparatus for an LCD, a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.

    摘要翻译： 在用于LCD的背光装置中，多个条形的第一LED光源被布置在反射板上以横向发光。 多个浅色调布置在第一光源的上方。 透明板放置在浅色调之上。 散射图案形成在透明板底部的对应于浅色调的位置上。 在透明板的一侧设置条状的第二LED光源，以将光发射到透明板中。 布置在透明板一侧的光源防止了现有技术中的黑色区域的形成，从而增强了光的整体均匀性。 然后，即使应用于大型LCD也能够使背光装置保持薄型化。

    Light emitting diode package and light source comprising the same
    35.
    发明授权
    Light emitting diode package and light source comprising the same 失效
    发光二极管封装和包含该发光二极管封装的光源

    公开(公告)号：US07176503B2

    公开(公告)日：2007-02-13

    申请号：US10967212

    申请日：2004-10-19

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： H01L29/24 ,  H01L31/12

    CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An LED package comprises a substrate, one or three terminals formed on a first side of the substrate, three terminals formed on a second side opposite to the first side, and two or three LEDs disposed on the substrate, one of the LEDS being electrically connected to one of the terminals formed on the first side while being electrically connected to one of the terminals formed on the second side, and other LEDS being electrically connected to two terminals formed on the first side or to two terminals formed on the second side. A light source comprises the LED packages having the structure as described above. Without being arranged in a line, the LEDs emitting the same color are differently arranged in every LED package, thereby solving the problem of non-uniform combination of the colors according to the positions of the LEDs on an LED package-mounting substrate.

    摘要翻译： LED封装包括基板，形成在基板的第一侧上的一个或三个端子，形成在与第一侧相对的第二侧上的三个端子和设置在基板上的两个或三个LED，其中一个LED电连接 连接到形成在第一侧上的端子中的一个端子，同时电连接到形成在第二侧上的端子之一，并且其它LEDS电连接到形成在第一侧上的两个端子或形成在第二侧上的两个端子。 光源包括具有如上所述结构的LED封装。 不排列成一行，发光相同颜色的LED在每个LED封装中被不同地排列，从而解决了根据LED封装安装基板上LED的位置的颜色不均匀组合的问题。

    Side-emission type LED package
    36.
    发明授权
    Side-emission type LED package 有权
    侧面发射型LED封装

    公开(公告)号：US07473937B2

    公开(公告)日：2009-01-06

    申请号：US11318837

    申请日：2005-12-28

    申请人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    发明人： Young Sam Park ,  Hyung Suk Kim ,  Jung Kyu Park ,  Ho Sik Ahn ,  Young June Jeong ,  Hun Joo Hahm ,  Bum Jin Kim

    IPC分类号： H01L29/22

    CPC分类号： H01L33/60 ,  F21K9/68 ,  H01L33/54

    摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

    摘要翻译： 提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。 如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

    Vertical light emitting type backlight module
    37.
    发明授权
    Vertical light emitting type backlight module 失效
    垂直发光型背光模组

    公开(公告)号：US07097337B2

    公开(公告)日：2006-08-29

    申请号：US10917383

    申请日：2004-08-13

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： F21V8/00

    CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10

    摘要： Disclosed herein is a vertical light emitting type backlight module, for irradiating white light to the rear side of a liquid crystal display in the perpendicular direction. The vertical light emitting type backlight module comprises a) one or more LED array modules, each comprising a substrate having conductive patterns printed on upper and lower surfaces of the substrate, respectively, a plurality of LED devices mounted on the upper and lower surfaces of the substrate, respectively, for emitting light toward the front of respective surfaces of the substrate with the LED devices mounted thereon, and a plurality of lenses formed to surround the LED devices, respectively, for directing the light emitted from the LED devices in a direction perpendicular to the LED while being within a predetermined angle from an axis parallel to a plane of the backlight module, the substrate being mounted perpendicular to the plane of the backlight module such that the light emitted from the LED devices is emitted in a direction approximately parallel to the plane of the backlight module, and b) a reflection plate for each of the LED array modules for reflecting the light spread in the horizontal direction to change path of the light to the perpendicular direction.

    摘要翻译： 本文公开了一种用于在垂直方向上将白光照射到液晶显示器的后侧的垂直发光型背光模块。 垂直发光型背光模块包括：a）一个或多个LED阵列模块，每个LED阵列模块分别包括印刷在基板的上表面和下表面上的导电图案的基板，安装在基板的上表面和下表面上的多个LED装置 基板，分别用于在安装有LED器件的基板的各个表面的前面发射光，以及分别形成为围绕LED器件的多个透镜，用于将LED器件发出的光沿垂直方向引导 在与来自平行于背光模块的平面的轴线处于预定角度内的LED上，所述基板垂直于所述背光模块的平面安装，使得从所述LED装置发射的光在大致平行于 背光模块的平面，以及b）用于反射光sp的每个LED阵列模块的反射板 在水平方向读取，以将光线的路径改变为垂直方向。

    Light emitting diode device
    38.
    发明授权
    Light emitting diode device 失效
    发光二极管装置

    公开(公告)号：US06972439B1

    公开(公告)日：2005-12-06

    申请号：US10916525

    申请日：2004-08-12

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： G02F1/13357 ,  H01L29/22 ,  H01L33/54 ,  H01L33/60

    CPC分类号： H01L33/54 ,  H01L33/60

    摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.

    摘要翻译： 这里公开了一种发光二极管（LED）装置。 发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜 用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射 镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

    High power LED package and fabrication method thereof
    39.
    发明授权
    High power LED package and fabrication method thereof 有权
    大功率LED封装及其制造方法

    公开(公告)号：US07875476B2

    公开(公告)日：2011-01-25

    申请号：US12612268

    申请日：2009-11-04

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

    摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

    Light emitting diode package and fabrication method thereof
    40.
    发明授权
    Light emitting diode package and fabrication method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号：US08168453B2

    公开(公告)日：2012-05-01

    申请号：US12370802

    申请日：2009-02-13

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L21/56

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。