Abstract:
A video content creating apparatus includes a computer. The computer registers photographic image data input from a photographic input device and meta-information set in relation to the data in a database. After retrieving photographs based on the meta-information, the apparatus selects the photographs to be used for a reminiscence video and decides the reproduction order of the photographs. After registering a BGM playlist, the apparatus reproduces the photographs and BGM for creating the reminiscence video. If there are any regions, the apparatus displays the regions on a monitor while aligning them in sequence according to the meta-information on them. Upon completion of generation (rendering) of a series of reminiscence video contents, the apparatus creates the reminiscence video by saving the rendering results in Flash movie format, for example.
Abstract:
A method for manufacturing a semiconductor light emitting device includes forming an insulating film on a semiconductor substrate, the insulating film having an opening therein, forming a Pd electrode in the opening and on the insulating film, and removing the portion of the Pd electrode on the insulating film by the application of a physical force to the portion, while leaving the Pd electrode in the opening.
Abstract:
A method for manufacturing a nitride semiconductor light-emitting element comprises: forming a semiconductor laminated structure wherein an n-type nitride semiconductor epitaxial layer, an active layer, and a p-type nitride semiconductor epitaxial layer are laminated on a substrate; forming a p-type electrode having a first electrode layer containing Pd and a second electrode layer containing Ta on the p-type nitride semiconductor epitaxial layer; heat treating at a temperature between 400° C. and 600° C. in an ambient containing oxygen after forming the p-type electrode; and forming a pad electrode containing Au on the p-type electrode after the heat treating.
Abstract:
A fault tolerant (FT) computer system includes a primary system and a secondary system. The primary system includes a first CPU; a first FT control section connected with the first CPU; and a first south bridge connected electrically and operatively with the first FT control section. The secondary system includes a second CPU; a second FT control section connected with the second CPU; and a second south bridge connected electrically with the second FT control section and not connected operatively with the second FT control section. The first FT control section and the second FT control section are connected by a link section, and the primary system and the secondary system operate in synchronization with each other by using the link section, except for the second south bridge.
Abstract:
A method of manufacturing semiconductor laser device including a GaN wafer includes forming a semiconductor layer on the GaN wafer and on which ridge portions are formed. Grooves are formed in the semiconductor layer such that each groove is disposed in line with the scribe marks, between each of the ridge portions and an upstream scribe mark. The grooves are curved and convex outwardly towards a downstream side, and each groove has an apex on a cleavage line. The side extending from the apex preferably does not form an angle of 60 degrees with respect to a cleavage direction or the cleavage line.
Abstract:
The semiconductor laser device includes an active layer, a p-type cladding layer, and a p-type cap layer. The layers are sequentially stacked so that the semiconductor laser device is provided. The p-type cap layer includes both a p-type dopant and an n-type dopant. In another aspect, the p-type cap layer includes a first layer including a first p-type dopant and a second layer including a second p-type dopant having a diffusion coefficient smaller than that of the first p-type dopant. The first layer is far from the active layer, and the second layer is close to the active layer. In further aspect, the p-type cap layer includes carbon (C) as a p-type dopant. According to these configuration, the p-type dopant can be prevented from being diffused in the active layer and the p-type cladding layer.
Abstract:
A tent cloth canvas coated on the surface thereof with a photocatalyst, wherein (1) the adhesiveness between a photocatalyst and the tent cloth canvas is kept satisfactorily for an extended time, (2) an anti-fouling capability is kept for a long time, and (3) the photocatalyst carried on the tent cloth canvas does not promote a lowering with time of a tear strength. A tent cloth canvas coated on the surface thereof with a photocatalyst is used, wherein more than 50% in amount of a plasticizer contained in the canvas remains in comparison with that at an initial stage 1500 hours after the canvas is subjected to a sunshine carbon arc type accelerated weathering test as specified in JIS-K5400, or after 3-year outdoor exposure; and a tent clothe canvas having the above properties and structures further contains a plasticizer having a molecular weight of at least 400, and/or a plasticizer migration restricting layer is provided in the middle of the tent cloth and photocatalyst coating layer.
Abstract:
A fault tolerant (FT) computer system includes a primary system and a secondary system. The primary system includes a first CPU; a first FT control section connected with the first CPU; and a first south bridge connected electrically and operatively with the first FT control section. The secondary system includes a second CPU; a second FT control section connected with the second CPU; and a second south bridge connected electrically with the second FT control section and not connected operatively with the second FT control section. The first FT control section and the second FT control section are connected by a link section, and the primary system and the secondary system operate in synchronization with each other by using the link section, except for the second south bridge.
Abstract:
A conductive electroless plated powder includes core particles and a nickel film formed by an electroless plating process on the surface of each core particle, wherein crystal grain boundaries in the nickel film are primarily oriented in the direction of the thickness of the nickel film. An electroless gold plating film may be deposited on the nickel film as the top layer. The nickel film is formed by electroless plating using glycine or ethylenediamine as a complexing agent.
Abstract:
The present invention provides a photocatalyst-carrying structure which has a structure, wherein an adhesive layer is provided in between a photocatalyst layer and a substrate, the adhesive layer is composed of silicon-modified resin, polysiloxane-containing resin or colloidal silica-containing resin, and for forming the photocatalyst layer a composition comprising a metal oxide gel or a metal hydroxide gel and a photocatalyst is used. Further, the present invention also provides a photocatalyst coating agent for producing a photocatalyst-carrying structure which contains silicon compound, at least one metal oxide sol or metal hydroxide sol, and at least one photocatalyst powder or sol.