摘要:
A method for manufacturing a multiple-wavelength semiconductor laser comprises: forming a first bar having an array of first semiconductor chips, wherein at least two semiconductor lasers producing light of different wavelengths are monolithically formed; forming a second bar having an array of second semiconductor chips, wherein a semiconductor laser producing light having a different wavelength from the light produced by the semiconductor lasers of the first semiconductor chips is formed; forming a third bar by locating a laser-forming surface of said first bar facing a back surface of the second bar, and joining respective first semiconductor chips in the first bar to respective second semiconductor chips in the second bar; forming scribe lines by irradiating boundaries of the first semiconductor chips and boundaries of the second semiconductor chips with laser beams, and dividing the third bar along the scribe lines into respective chips.
摘要:
A semiconductor laser device includes a cavity extending in a propagation direction of a laser beam (X-direction). A front facet is on one end of the cavity through which the laser beam is emitted. A rear facet is on the other end of the cavity. An anodic oxide film is provided on at least one of the front facet and the rear facet, and the anodic oxide film preferably has a thickness of λ/4n or an odd integer multiple thereof, where λ is the wavelength of the laser beam and n is the refractive index of the anodic oxide film.
摘要:
A semiconductor laser is provided which emits laser light in which the intensity center of the far-field pattern in the horizontal direction does not vary with variation of the optical output and in which the shape of the far-field pattern in the horizontal direction is stable. The width of trenches is determined so that the magnitude (E1) of the electric field at the center of a ridge and the magnitude (E2) of the electric field at the edges of the trenches provide a ratio E1/E2 that is larger than 0.0001 and smaller than 0.01. In a semiconductor laser with a double-channel ridge structure, layers having a larger equivalent refractive index than the trenches exist outside the trenches. Accordingly, the semiconductor absorbs the light distributed outside the trenches and it is possible to obtain laser light in which the intensity center of the far-field pattern in the horizontal direction does not vary with variation of the optical output and in which the shape of the far-field pattern in the horizontal direction is stable.
摘要:
A semiconductor laser device includes a cavity extending in a propagation direction of a laser beam (X-direction). A front facet is on one end of the cavity through which the laser beam is emitted. A rear facet is on the other end of the cavity. An anodic oxide film is provided on at least one of the front facet and the rear facet, and the anodic oxide film preferably has a thickness of λ/4n or an odd integer multiple thereof, where λ is the wavelength of the laser beam and n is the refractive index of the anodic oxide film.
摘要:
The semiconductor laser device includes an active layer, a p-type cladding layer, and a p-type cap layer. The layers are sequentially stacked so that the semiconductor laser device is provided. The p-type cap layer includes both a p-type dopant and an n-type dopant. In another aspect, the p-type cap layer includes a first layer including a first p-type dopant and a second layer including a second p-type dopant having a diffusion coefficient smaller than that of the first p-type dopant. The first layer is far from the active layer, and the second layer is close to the active layer. In further aspect, the p-type cap layer includes carbon (C) as a p-type dopant. According to these configuration, the p-type dopant can be prevented from being diffused in the active layer and the p-type cladding layer.
摘要:
A semiconductor laser device has an n-GaAs substrate. On the n-GaAs substrate, by turns, are an n-AlGaInP cladding layer, an AlGaInP/GaInP MQW active layer, a p-AlGaInP first cladding layer, a single layer p-AlxGa1-xAs etching stopping layer, a p-AlGaInP second cladding layer with a stripe protrusion, and a p-GaAs contact layer. The portion, other than the stripe-form protrusion, of the p-AlGaInP second cladding layer is covered with an insulating film. The refractive index of the p-AlxGa1-xAs-ESL is nearly equal to the refractive index of each of the lower, first upper, and second upper cladding layers.
摘要翻译:半导体激光器件具有n-GaAs衬底。 在n-GaAs衬底上,依次为n-AlGaInP包覆层,AlGaInP / GaInP MQW有源层,p-AlGaInP第一覆层,单层p-Al x Ga 作为蚀刻停止层,具有条纹突起的p-AlGaInP第二包覆层和p-GaAs接触层。 p-AlGaInP第二包层的除了条状突起之外的部分被绝缘膜覆盖。 p-Al x Ga 1-x As As ESL的折射率几乎等于下,第一上和第二上部包层中的每一个的折射率 层。
摘要:
A semiconductor laser device includes a lower cladding layer of n-(Al0.66Ga0.34)0.5In0.5P, an active layer having a window structure which has a disordered MQW structure, a first upper cladding layer of p-(Al0.7Ga0.3)0.5In0.5P, and a second upper cladding layer of (Al0.66Ga0.34)0.5In0.5P sequentially disposed on an n-GaAs substrate. The refractive index of the first upper cladding layer is smaller than that of the lower cladding layer, and refractive index of the second upper cladding layer is larger than that of the first upper cladding layer and identical to that of the lower cladding layer. The position of peak light intensity at the window structure of the active layer coincides with or very closely approaches the position of the active layer.
摘要翻译:半导体激光器件包括n型(Al 0.66 Ga 0.34)0.5 In 0.5 P的下包层,具有无序MQW结构的窗结构的有源层,p(Al0.7Ga0 .3)0.5In0.5P,和依次设置在n-GaAs衬底上的(Al 0.66 Ga 0.34)0.5 In 0.5 P的第二上包层。 第一上包层的折射率小于下包层的折射率,第二上包层的折射率大于第一上包层的折射率,并且与下包层的折射率相同。 有源层的窗口结构处的峰值光强度的位置与活性层的位置一致或非常接近。
摘要:
A photodetector includes a light responsive element including a semiconductor layer having a plurality of first spaced apart p-n junctions for generating electrical signals in response to incident light, a test element group (TEG) for testing an electrical characteristic of the first p-n junctions, the test element group including a plurality of second spaced apart p-n junctions in the semiconductor layer, and a light shielding mask covering the second spaced apart p-n junctions and preventing incident light from reaching the second spaced apart p-n junctions. The light shielding mask includes at least one window transmitting light, and the window is spaced from each of the second spaced apart p-n junctions. During testing of the electrical characteristics of the photodetector using the TEG, light is not incident directly on the second p-n junctions of the TEG but incident on the semiconductor layer through the window spaced from the second p-n junctions, and the maximum diffusion length of the minority charge carriers in the light responsive element is detected from the result of the test using the TEG. Therefore, the spatial resolution of the photodetector included in a wafer is monitored, and the photodetector is distinguished as defective and nondefective according to the monitored spatial resolution.
摘要:
A solid-state imaging device includes a photodiode array having a plurality of pixels, each pixel including a second conductivity type region formed in a first conductivity type semiconductor layer, an electrode common to all the pixels and disposed on the first conductivity type semiconductor layer, a signal transfer part for transferring signal charges generated in the pixels and a DC voltage source for applying a DC voltage in a forward direction to the pixels. The reverse bias voltage applied to a photodiode due to the voltage applied by the signal input stage of the signal transfer part is canceled by the forward DC voltage applied to the common electrode. As a result, the operating points of the pixels are uniform when nearly zero bias voltage is applied to the pixels.
摘要:
A solid state imaging array for generating a plurality of electrical imaging signals includes photodiodes for producing electrical charges in response to incident light, a signal processing circuit including a charge skimming electrode associated with each sensor for receiving and storing electrical charges from the associated sensor and for transferring a skimmed portion of the stored electrical charge to a respective charge coupled device. The skimmed portion of the electrical charge is determined by the magnitude of a skimming voltage applied to the respective skimming electrode. The array includes a second charge coupled device for applying different magnitude skimming voltages to each of the skimming electrodes in order to compensate for variations in the sensitivities of the photodiodes. The individual compensation is achieved for all of the photodiodes through only two external terminals.