公开(公告)号：US4438107A

公开(公告)日：1984-03-20

申请号：US402812

申请日：1982-07-28

申请人： Isamu Watanabe ,  Takashi Yamaguchi ,  Kazuhiro Kamiya ,  Toshihito Mori ,  Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya

发明人： Isamu Watanabe ,  Takashi Yamaguchi ,  Kazuhiro Kamiya ,  Toshihito Mori ,  Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya

IPC分类号： A61K31/70 ,  A61K31/7028 ,  A61K31/7034 ,  A61K31/7036 ,  A61P31/04 ,  C07D303/16 ,  C07H15/224 ,  C07H15/226 ,  C08B37/00

CPC分类号： C07H15/224 ,  C07D303/16 ,  C07H15/226

摘要： An aminoglycoside compound of the following formula ##STR1## wherein one of R.sub.1 and R.sub.2 represents a hydrogen atom and the other, a methyl group, R.sub.3 represents a hydrogen atom or an amino acyl group having 2 to 5 carbon atoms, R.sub.4 represents a lower alkyl group substituted by one or two substituents selected from the class consisting of hydroxy and amino groups, or a hexopyranosyl group whose hydroxy groups may be substituted by amino groups,and a pharmaceutically acceptable acid addition salt thereof; and an antibiotic composition comprising said compound and its pharmaceutically acceptable acid addition salt.

摘要翻译： 下式的氨基糖苷类化合物其中R 1和R 2中的一个表示氢原子，另一个是甲基，R 3表示氢原子或具有2至5个碳原子的氨基酰基，R 4表示 被一个或两个选自羟基和氨基的取代基取代的低级烷基或其羟基可被氨基取代的六吡喃糖基及其药学上可接受的酸加成盐; 以及包含所述化合物及其药学上可接受的酸加成盐的抗生素组合物。

公开(公告)号：US4349666A

公开(公告)日：1982-09-14

申请号：US196586

申请日：1980-10-14

申请人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya ,  Toshiaki Miyake

发明人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya ,  Toshiaki Miyake

IPC分类号： C07H15/234 ,  C07H15/236 ,  C07H15/22

CPC分类号： C07H15/234 ,  Y02P20/55

摘要： 3'-Deoxykanamycin B, namely tobramycin is produced in an improved yield with a reduced reaction time under moderate reaction conditions, starting from a penta-N-protected 3'-mono-O-alkyl-, aralkyl- or arylsulfonylated derivative of kanamycin B in which all the 1, 3, 2' and 3"-amino groups and possibly the 6'-amino group have been protected by an arylsulfonyl group, especially tosyl group; the 3'-hydroxyl group of kanamycin B has been alkyl-, aralkyl- or arylsulfonylated; the 4"- and 6"-hydroxyl groups have been blocked with a di-valent hydroxyl-protecting group; and possibly the 4'-hydroxyl group and 6'-amino group have been blocked by being converted into the form of a 4', 6'-cyclic carbamate formed between the 4'-hydroxyl group and the 6'-amino group, by subjecting to a process essentially comprising reaction of said protected kanamycin B derivative with a metal halide for a reaction time of 30 min. to 2 hours at a reaction temperature of 0.degree. C..about.150.degree. C. to produce the corresponding 3'-halo compound, reductive replacement of the 3'-halo group by hydrogen and deprotection.

摘要翻译： 3-脱氧卡那霉素B，即在中等反应条件下，以5-N保护的3'-单-O-烷基 - 芳烷基 - 或芳基磺酰化衍生物开始，在中等反应条件下，产率提高，产量提高，反应时间缩短。 其中所有1,3,2'和3“ - 氨基和可能的6'-氨基都被芳基磺酰基，尤其是甲苯磺酰基保护; 卡那霉素B的3'-羟基已经是烷基 - ，芳烷基 - 或芳基磺酰化; 4“和6” - 羟基已被二价羟基保护基封闭; 并且可能的4'-羟基和6'-氨基已经通过在4'-羟基和6'-氨基之间形成的4'，6'-环状氨基甲酸酯的形式被阻断，通过 进行基本上包含所述受保护的卡那霉素B衍生物与金属卤化物的反应的方法，反应时间为30分钟。 在0℃的反应温度下反应2小时。在150℃降解产生相应的3'-卤代化合物，通过氢还原取代3'-卤代基团并脱保护。

公开(公告)号：US4125706A

公开(公告)日：1978-11-14

申请号：US676792

申请日：1976-04-14

申请人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya

发明人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya

IPC分类号： C07H15/23 ,  C07H15/20

CPC分类号： C07H15/23

摘要： A 1-N-(.alpha.-substituted-.omega.-aminoacyl)-3'-deoxyribostamycin, which is a useful antibiotic active against various drug-resistant bacteria, can be prepared advantageously by a process starting from a protected derivative of ribostamycin in the form of 1,6-carbamate and comprising the 3'-deoxygenation, the splitting of the carbamate linkage and the 1-acylation.

摘要翻译： 作为抗各种药物抗性细菌的有用的抗生素的1-N-（α-取代的ω-氨基酰基）-3'-脱氧肉豆蔻霉素可以有利地通过以下形式开始制备：以保护的核糖霉素衍生物形式 的1,6-氨基甲酸酯并且包含3'-脱氧，氨基甲酸酯键的分解和1-酰化。

公开(公告)号：US4104372A

公开(公告)日：1978-08-01

申请号：US678560

申请日：1976-04-20

申请人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya

发明人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya

IPC分类号： C07H15/234 ,  A61K31/70 ,  A61K31/7028 ,  A61K31/7034 ,  A61K31/7036 ,  A61P31/04 ,  B01J23/00 ,  B01J25/00 ,  C07B61/00 ,  C07H15/236 ,  A61K31/71 ,  C07H15/22

CPC分类号： C07H15/234 ,  Y02P20/55

摘要： 1-N-(.alpha.-hydroxy-.omega.-aminoalkanoyl)-derivatives of 3'-deoxykanamycin A or 6'-N-methyl-3'-deoxykanamycin A are provided as new and useful compounds which are active against gram-negative and gram-positive bacteria, including drug-resistant strains of these bacteria. Examples of these compounds include 1-N-((SR)-.beta.-amino-.alpha.-hydroxypropionyl)-3'-deoxykanamycin A, 1-N-((S)-.gamma.-amino-.alpha.-hydroxybutyryl)-3'-deoxykanamycin A, 1-N-((S)-.delta.-amino-.alpha.-hydroxyvaleryl)-3'-deoxykanamycin A and 1-N-((S)-.gamma.-amino-.alpha.-hydroxybutyryl)-6'-N-methyl-3'-deoxykanamycin A. The compounds may be prepared by selective acylation of the 1-amino group of 3'-deoxykanamycin A or 6'-N-methyl-3'-deoxykanamycin A with a corresponding .alpha.-hydroxy-.omega.-amino-alkanoic acid.

摘要翻译： 提供3'-脱氧卡那霉素A或6'-N-甲基-3'-脱氧卡那霉素A的1-N-（α-羟基 - ω-氨基烷酰基）衍生物作为对革兰氏阴性和革兰氏阴性菌具有活性的新的有用化合物 阳性细菌，包括这些细菌的耐药菌株。 这些化合物的实例包括1-N - （（SR）-β-氨基-α-羟基丙酰基）-3'-脱氧卡那霉素A，1-N - （（S）-γ-氨基-α-羟基丁酰基） 脱氧卡那霉素A，1-N - （（S）-δ-氨基-α-羟基戊酰基）-3'-脱氧卡那霉素A和1 -N（（S）-γ-氨基-α-羟基丁酰基）-6'-N- 甲基-3'-脱氧卡那霉素A.该化合物可以通过将3-脱氧卡那霉素A或6'- N-甲基-3'-脱氧卡那霉素A的1-氨基选择性酰化与相应的α-羟基 - 氨基 - 链烷酸。

公开(公告)号：US4065616A

公开(公告)日：1977-12-27

申请号：US710949

申请日：1976-08-02

申请人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya ,  Isamu Watanabe

发明人： Hamao Umezawa ,  Sumio Umezawa ,  Tsutomu Tsuchiya ,  Isamu Watanabe

IPC分类号： B01J23/00 ,  B01J25/00 ,  C07B61/00 ,  C07H15/224 ,  C07H15/23 ,  C07H15/22

CPC分类号： C07H15/224 ,  C07H15/23

摘要： This invention relates to new processes for the production of a 1-N-(.alpha.-hydroxy-.omega.-aminoalkanoyl)-3'-deoxy-5-O-pentofuranosylneamine, including 3'-deoxybutirosins A and B, as a semi-synthetic antibiotic. This invention further relates to new and useful semi-synthetic antibiotics which are produced by the above new processes.

摘要翻译： 本发明涉及用于制备1-N-（α-羟基 - ω-氨基烷酰基）-3'-脱氧-5-O-呋喃鸟糖苷的新方法，包括3'-脱氧胆红素A和B作为半合成 抗生素。 本发明还涉及通过上述新方法生产的新的和有用的半合成抗生素。

公开(公告)号：US07777309B2

公开(公告)日：2010-08-17

申请号：US12033061

申请日：2008-02-19

申请人： Tadatoshi Danno ,  Tsutomu Tsuchiya

发明人： Tadatoshi Danno ,  Tsutomu Tsuchiya

IPC分类号： H01L23/495 ,  H01L21/00 ,  H01R9/00

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/50 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H03F3/189 ,  H01L2924/20645 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab. In such a semiconductor device, a circuit formed in the semiconductor element in a monolithic manner is comprised of a plurality of circuit parts and, in a specified circuit part (a low noise amplifier) which forms a portion of the circuit parts, all grounding electrode terminals out of electrode terminals of the semiconductor element are not connected to the tab through wires but are connected with the leads through wires.

摘要翻译： 本发明提供一种并入移动电话中的高频功率模块，其包括高频部分模拟信号处理IC，包括放大其中极弱信号的低噪声放大器。 一种半导体器件，包括由绝缘树脂制成的密封体，设置在密封体的内部和外部的多个引线，设置在密封体内部并具有半导体元件固定区域和导线连接区域的突片 其主表面，固定到半导体元件固定区并且在暴露的主表面上包括电极端子的半导体元件，连接半导体元件的电极端子和引线的导线以及连接半导体元件的电极端子的导线 半导体元件和引线连接区域。 在这种半导体装置中，以单片方式形成在半导体元件中的电路由多个电路部分构成，并且在形成电路部分的一部分的规定电路部分（低噪声放大器）中，所有接地极 半导体元件的电极端子之外的端子不通过导线连接到突片，而是通过导线与引线连接。

公开(公告)号：US07312511B2

公开(公告)日：2007-12-25

申请号：US11455157

申请日：2006-06-19

申请人： Tadatoshi Danno ,  Tsutomu Tsuchiya

发明人： Tadatoshi Danno ,  Tsutomu Tsuchiya

IPC分类号： H01L29/00

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/50 ,  H01L23/66 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab. In such a semiconductor device, a circuit formed in the semiconductor element in a monolithic manner is comprised of a plurality of circuit parts and, in a specified circuit part (a low noise amplifier) which forms a portion of the circuit parts, all grounding electrode terminals out of electrode terminals of the semiconductor element are not connected to the tab through wires but are connected with the leads through wires.

摘要翻译： 本发明提供一种并入移动电话中的高频功率模块，其包括高频部分模拟信号处理IC，包括放大其中极弱信号的低噪声放大器。 一种半导体器件，包括由绝缘树脂制成的密封体，设置在密封体的内部和外部的多个引线，设置在密封体内部并具有半导体元件固定区域和导线连接区域的突片 其主表面，固定到半导体元件固定区并且在暴露的主表面上包括电极端子的半导体元件，连接半导体元件的电极端子和引线的导线以及连接半导体元件的电极端子的导线 半导体元件和引线连接区域。 在这种半导体装置中，以单片方式形成在半导体元件中的电路由多个电路部分构成，并且在形成电路部分的一部分的规定电路部分（低噪声放大器）中，所有接地极 半导体元件的电极端子之外的端子不通过导线连接到突片，而是通过导线与引线连接。

公开(公告)号：USD541332S1

公开(公告)日：2007-04-24

申请号：US29220569

申请日：2005-01-04

申请人： Tsutomu Tsuchiya

设计人： Tsutomu Tsuchiya

公开(公告)号：US20050199987A1

公开(公告)日：2005-09-15

申请号：US10512459

申请日：2003-04-28

申请人： Tadatoshi Danno ,  Tsutomu Tsuchiya

发明人： Tadatoshi Danno ,  Tsutomu Tsuchiya

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/50 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H03F3/189 ,  H01L2924/20645 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab. In such a semiconductor device, a circuit formed in the semiconductor element in a monolithic manner is comprised of a plurality of circuit parts and, in a specified circuit part (a low noise amplifier) which forms a portion of the circuit parts, all grounding electrode terminals out of electrode terminals of the semiconductor element are not connected to the tab through wires but are connected with the leads through wires.

摘要翻译： 本发明提供一种并入移动电话中的高频功率模块，其包括高频部分模拟信号处理IC，包括放大其中极弱信号的低噪声放大器。 一种半导体器件，包括由绝缘树脂制成的密封体，设置在密封体的内部和外部的多个引线，设置在密封体内部并具有半导体元件固定区域和导线连接区域的突片 其主表面，固定到半导体元件固定区并且在暴露的主表面上包括电极端子的半导体元件，连接半导体元件的电极端子和引线的导线以及连接半导体元件的电极端子的导线 半导体元件和引线连接区域。 在这种半导体装置中，以单片方式形成在半导体元件中的电路由多个电路部分构成，并且在形成电路部分的一部分的规定电路部分（低噪声放大器）中，所有接地极 半导体元件的电极端子之外的端子不通过导线连接到突片，而是通过导线与引线连接。

公开(公告)号：US20050147397A1

公开(公告)日：2005-07-07

申请号：US11006721

申请日：2004-12-08

申请人： Hidetoshi Isawa ,  Shizuo Arai ,  Tsutomu Tsuchiya ,  Yuka Tsutsumi

发明人： Hidetoshi Isawa ,  Shizuo Arai ,  Tsutomu Tsuchiya ,  Yuka Tsutsumi

IPC分类号： H04N5/225 ,  G11B17/04 ,  G11B25/04 ,  G11B31/00 ,  G11B33/02 ,  H04N5/247 ,  H04N5/76

CPC分类号： G11B31/006

摘要： In a small size image pickup apparatus, depending upon the opening direction of the lid, a hand strap and the like become obstacles and it becomes difficult to open a disc lid with a large angle. Hence, a disc-like recording medium cannot be attached to and detached from the disc type image pickup apparatus without difficulty. In a disc type image pickup apparatus comprises a table rotating apparatus 35 for rotating a turntable 36 on which a DVD 2 is detachably loaded in the erected state, an optical pickup apparatus 71 capable of recording an information signal of an image corresponding to light of an object inputted through at least a lens apparatus 4 on the DVD 2 rotated by the table rotating apparatus 35, an outer case 5 having a disc compartment portion 6 in which the table rotating apparatus 35 and the optical pickup apparatus 71 are accommodated and in which the turntable 36 being opened to the side surface thereof and a disc lid 7 attached to the outer case 5 so as become freely openable and closable to cover the disc compartment portion 6. A lid rotary shaft portion 39 is provided on the rear portion of the side surface of the outer case 5 to rotatably support the disc lid 7 and the disc lid 0.7 can be rotated around the lid rotary shaft portion 39 in the lateral direction.

摘要翻译： 在小尺寸图像拾取装置中，根据盖的打开方向，手带等成为障碍物，并且变得难以以大的角度打开盘盖。 因此，盘状记录介质不能轻易地附接到盘式图像拾取装置并从其拆卸。 在一种盘式摄像装置中，包括一台转台装置35，用于旋转DVD 2以竖立状态可拆卸地装载在其上的转盘36;能够记录与光线对应的图像的信息信号的光学拾取装置71; 通过台式旋转装置35旋转的DVD 2上的至少透镜装置4输入的物体，具有容纳台式旋转装置35和光学拾取装置71的盘室部6的外壳5， 转台36向其侧表面敞开，盘盖7安装在外壳5上，以便可自如地打开和关闭以覆盖盘室隔间6。 在外壳5的侧面的后部设置盖旋转轴部39，以可旋转地支撑盘盖7，并且盘盖0.7可以围绕盖旋转轴部39沿横向旋转。